公开(公告)号：US20230065622A1

公开(公告)日：2023-03-02

申请号：US17465633

申请日：2021-09-02

Applicant: Raytheon Company

Inventor： Miroslav Micovic ,  Karen Kaneko Baker ,  Christopher Carbonneau ,  Katherine J. Herrick ,  Teresa J. Clement ,  Jeffrey R. Laroche

IPC: H01L23/427 ,  H01L25/065 ,  H01L23/00 ,  H01L25/00 ,  H03F3/24 ,  H01Q3/24

Abstract: An Array Core Block for an AESA includes a stack of 2*M alternating N-channel RFIC and MMIC Power Amplifier wafers bonded together by a wafer-scale direct bond hybrid (DBH) interconnect process. This process forms both metal-to-metal and dielectric hydrogen bonds between bonding surfaces to seal the wafer stack. Each array core block includes an array of through substrate metal vias to distribute DC bias, LO and information signals. Each array core block also includes a cooling system including micro-channels formed on a backside of at least one of the chips in each bonded pair and through substrate via holes formed through the stack that operatively couple the micro-channels for all of the bonded pairs to receive and circulate a fluid through the micro-channels and through substrate via holes to cool the RFIC and MMIC Power Amplifier chips and to extract the heated fluid.

公开(公告)号：US11917746B2

公开(公告)日：2024-02-27

申请号：US17660261

申请日：2022-04-22

Applicant: Raytheon Company

Inventor： Miroslav Micovic ,  Brandon W. Pillans ,  Andrew D. Gamalski ,  Andrew K. Brown

IPC: H05K1/02 ,  H05K3/20 ,  H05K3/34

CPC classification number: H05K1/0209 ,  H05K1/023 ,  H05K1/0298 ,  H05K3/205 ,  H05K3/3436 ,  H05K2201/0195 ,  H05K2201/064 ,  H05K2203/043 ,  H05K2203/1453 ,  H05K2203/304

Abstract: A method of forming a heat spreader on a printed circuit board (PCB), having a power dissipating component operably coupled thereto, includes attaching a thermally and electrically conductive structure, to a first side of the PCB to define a first PCB region that includes the component and a second PCB region without. The underside of the component is underfilled to electrically insulate its solder contacts. A first protective layer is applied to the second region of the PCB. A conductive plating membrane is deposited to the first region, the second region, and to the structure. A second protective layer is applied over a portion of the conductive plating membrane that overlays the second region, leaving exposed the rest of the conductive plating membrane. An electrically and thermally conductive layer is electroplated over the exposed areas of the conductive plating membrane, to form a heat exchanger within the first region.

公开(公告)号：US20230345616A1

公开(公告)日：2023-10-26

申请号：US17660261

申请日：2022-04-22

Applicant: Raytheon Company

Inventor： Miroslav Micovic ,  Brandon W. Pillans ,  Andrew D. Gamalski ,  Andrew K. Brown

IPC: H05K1/02 ,  H05K3/20 ,  H05K3/34

CPC classification number: H05K1/0209 ,  H05K1/023 ,  H05K1/0298 ,  H05K3/205 ,  H05K3/3436 ,  H05K2203/1453 ,  H05K2201/0195 ,  H05K2201/064 ,  H05K2203/043 ,  H05K2203/304

Abstract: A method of forming a heat spreader on a printed circuit board (PCB), having a power dissipating component operably coupled thereto, includes attaching a thermally and electrically conductive structure, to a first side of the PCB to define a first PCB region that includes the component and a second PCB region without. The underside of the component is underfilled to electrically insulate its solder contacts. A first protective layer is applied to the second region of the PCB. A conductive plating membrane is deposited to the first region, the second region, and to the structure. A second protective layer is applied over a portion of the conductive plating membrane that overlays the second region, leaving exposed the rest of the conductive plating membrane. An electrically and thermally conductive layer is electroplated over the exposed areas of the conductive plating membrane, to form a heat exchanger within the first region.

公开(公告)号：US20220094031A1

公开(公告)日：2022-03-24

申请号：US17025333

申请日：2020-09-18

Applicant: Raytheon Company

Inventor： Miroslav Micovic

IPC: H01Q1/02 ,  H01Q21/06 ,  H01Q21/00 ,  H01Q3/26

Abstract: Methods and apparatus to provide a rectangular N×M antenna element subarray block having opposed first and second major surfaces and first and second ends at opposite ends of the block, wherein the antenna elements are located at the first end of the block. A coldplate between the first inlet connector and the first outlet connector enables flow of the liquid coolant from the first inlet connector to the first outlet connector. The first inlet connector is configured to enable flow of the liquid coolant into the system in a direction that is normal to the first major surface of the block.

公开(公告)号：US11522508B1

公开(公告)日：2022-12-06

申请号：US17402476

申请日：2021-08-13

Applicant: Raytheon Company

Inventor： Andrew D. Gamalski ,  Miroslav Micovic ,  Katherine J. Herrick

IPC: H04B1/04 ,  H03F1/56 ,  H03F3/24 ,  H03F1/22 ,  H03F3/19

Abstract: A dual-band MMIC power amplifier and method of operation to amplify frequencies in different RF bands while only requiring input drive signals at frequencies f1 and f2 in a narrow RF input band. This allows for the use of a conventional narrowband RF IC to drive the MMIC and does not require additional circuitry (e.g., a LO) on the MMIC power amplifier. The matching network of the last amplification stage is modified to pass f1 (or a harmonic thereof), reflect f2, pass a Pth harmonic of f2 where P is 2 or 3 and to reflect any unused 1st, 2nd or 3rd order harmonics of f1 or f2 back into the MMIC. In response to an input signal at f1, the MMIC power amplifier amplifies and outputs a signal at f1 (or a harmonic thereof). In response to an input signal at f2 at sufficient RF power, the last amplification stage operates in compression such that the MMIC power amplifier generates the harmonics, selects the Pth harmonic and outputs an amplified RF signal at P*f2.

公开(公告)号：US11411295B2

公开(公告)日：2022-08-09

申请号：US17025333

申请日：2020-09-18

Applicant: Raytheon Company

Inventor： Miroslav Micovic

IPC: H01Q21/00 ,  H01Q1/02 ,  H01Q3/26 ,  H01Q21/06

Abstract: Methods and apparatus to provide a rectangular N×M antenna element subarray block having opposed first and second major surfaces and first and second ends at opposite ends of the block, wherein the antenna elements are located at the first end of the block. A coldplate between the first inlet connector and the first outlet connector enables flow of the liquid coolant from the first inlet connector to the first outlet connector. The first inlet connector is configured to enable flow of the liquid coolant into the system in a direction that is normal to the first major surface of the block.