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    SYSTEM-IN-PACKAGE PLATFORM FOR ELECTRONIC-MICROFLUIDIC DEVICES
    7.
    发明申请
    SYSTEM-IN-PACKAGE PLATFORM FOR ELECTRONIC-MICROFLUIDIC DEVICES 有权
    用于电子微流体装置的系统级封装平台

    公开(公告)号：US20130149215A1

    公开(公告)日：2013-06-13

    申请号：US13755293

    申请日：2013-01-31

    申请人： Ronald Dekker ,  Remco Henricus Wilhelmus Pijnenburg ,  Nicolaas Johannes Anthonius Van Veen

    发明人： Ronald Dekker ,  Remco Henricus Wilhelmus Pijnenburg ,  Nicolaas Johannes Anthonius Van Veen

    IPC分类号： H01L37/00 ,  B01L3/00

    CPC分类号： H01L37/00 ,  B01J2219/00783 ,  B01J2219/0095 ,  B01L3/502707 ,  B01L3/502715 ,  B01L2200/12 ,  B01L2200/14 ,  B01L2300/0645 ,  B01L2300/1827 ,  B01L2300/1883 ,  B01L2400/0415 ,  B81B2201/058 ,  B81C1/0023 ,  H01L2224/11 ,  Y10T436/11

    摘要： The present invention relates to an integrated electronic-microfluidic device an integrated electronic-microfluidic device, comprising a semiconductor substrate (106) on a first (122) support, an electronic circuit (102, 104) on a first semiconductor-substrate side of the semiconductor substrate, and a signal interface structure to an external device. The signal interface structure is arranged on the first semiconductor-substrate side and configured to receive electrical signals from the electronic circuit. A microfluidic structure (126) is formed in the semiconductor substrate, and is configured to confine a fluid and to allow a flow of the fluid to and from the microfluidic structure only on a second semiconductor-substrate side that is opposite to the first semiconductor-substrate side and faces away form the first support. The electronic-microfluidic device forms a flexible platform for the formation of various System-in-Package applications. It achieves a clear separation between electrical and wet-chemical interfaces. The claimed method for fabricating the device of the invention also allows a simple formation of thermally isolated microfluidic structures.

    摘要翻译： 本发明涉及一种集成电子微流体装置，集成的电子微流体装置，其包括在第一（122）支撑件上的半导体衬底（106），电子电路（102,104）的第一半导体衬底 半导体衬底和与外部设备的信号接口结构。 信号接口结构布置在第一半导体衬底侧并被配置为从电子电路接收电信号。 微流体结构（126）形成在半导体衬底中，并且被配置为限制流体并允许仅在与第一半导体衬底相反的第二半导体衬底侧上流体流过微流体结构， 衬底侧面和背面形成第一支撑件。 电子微流体装置形成用于形成各种系统级封装应用的灵活平台。 它实现了电气和湿化学界面之间的清晰分离。 所要求的制造本发明装置的方法还允许简单地形成热分离的微流体结构。

    CARDIOMYOCYTES-CONTAINING DEVICE AND METHOD FOR MANUFACTURING AND USING THE SAME
    9.
    发明申请
    CARDIOMYOCYTES-CONTAINING DEVICE AND METHOD FOR MANUFACTURING AND USING THE SAME 失效
    含有血小板活性的装置及其制造和使用方法

    公开(公告)号：US20120094323A1

    公开(公告)日：2012-04-19

    申请号：US13147607

    申请日：2010-02-02

    申请人： Ronald Dekker ,  Anja Van De Stolpe

    发明人： Ronald Dekker ,  Anja Van De Stolpe

    IPC分类号： C12Q1/18 ,  H01B13/00 ,  B05D5/00 ,  C12M1/34 ,  B05D1/36

    CPC分类号： G01N1/30 ,  C12N5/0657 ,  C12N2503/02 ,  C12N2535/10 ,  G01N33/5061

    摘要： Disclosed is a device for determining the cardiotoxicity of a chemical compound, comprising a substrate (10) carrying a deformable stack (34), said stack being partially detached from the substrate by a cavity (32) allowing an out-of-plane deformation of the stack, said stack comprising a first deformable layer (16), a second deformable layer (20) and a multi-electrode structure (18) sandwiched between the first and second deformable layers, the second deformable layer carrying a pattern of cardiomyocytes (28) adhered thereto; and a liquid container (26) mounted on the substrate for exposing the cardiomyocytes to the chemical compound. A method of manufacturing such a device is also disclosed. The present invention further relates to the use of the device for drug target discovery and/or drug development and a method for developing a disease model for a disease that is caused by or modified by stretching of cells, in particular a cardiac disease model.

    摘要翻译： 公开了一种用于确定化合物的心脏毒性的装置，包括承载可变形叠层（34）的基底（10），所述叠层通过空腔（32）部分地与基底分离，允许外部变形 所述堆叠包括夹在所述第一和第二可变形层之间的第一可变形层（16），第二可变形层（20）和多电极结构（18），所述第二可变形层承载心肌细胞图案（28 ） 和安装在基板上的用于将心肌细胞暴露于化合物的液体容器（26）。 还公开了制造这种装置的方法。 本发明还涉及该装置用于药物靶发现和/或药物开发的用途，以及用于开发由细胞拉伸，特别是心脏疾病模型引起或改变的疾病的疾病模型的方法。

    Deformable integrated circuit device
    10.
    发明授权
    Deformable integrated circuit device 有权
    可变形集成电路器件

    公开(公告)号：US07915707B2

    公开(公告)日：2011-03-29

    申请号：US12377673

    申请日：2007-08-07

    申请人： Ronald Dekker ,  Antoon Marie Henrie Tombeur ,  Theodoros Zoumpoulidis

    发明人： Ronald Dekker ,  Antoon Marie Henrie Tombeur ,  Theodoros Zoumpoulidis

    IPC分类号： H01L29/00

    CPC分类号： H01L23/49833 ,  H01L23/5387 ,  H01L2924/0002 ,  H01L2924/00

    摘要： An integrated-circuit device includes a rigid substrate island having a main substrate surface with a circuit region circuit elements and at least one fold structure. The fold structure is attached to the substrate island and is unfoldable from a relaxed, folded state to a strained unfolded state. The fold structure contains at least one passive electrical component. The fold structure further has in its folded state at least one surface with an area vector that includes a non-vanishing area-vector component in a direction parallel to the main substrate surface, which area-vector component is diminished or vanishes when deforming the fold structure from the folded into the unfolded state.

    摘要翻译： 集成电路器件包括具有主衬底表面的刚性衬底岛，其具有电路区域电路元件和至少一个折叠结构。 折叠结构附接到基底岛，并且可以从松弛的折叠状态展开到应变展开状态。 折叠结构包含至少一个无源电组件。 折叠结构在其折叠状态下进一步具有面向向的至少一个表面，该区域向量在平行于主衬底表面的方向上包括非消失的面积 - 矢量分量，该区域 - 矢量分量在折叠变形时减少或消失 结构从折叠到展开状态。