Apparatus and method for harmonic imaging using an array transducer operated in the k31 mode
    1.
    发明授权
    Apparatus and method for harmonic imaging using an array transducer operated in the k31 mode 失效
    使用在k31模式下工作的阵列换能器进行谐波成像的装置和方法

    公开(公告)号:US06558331B1

    公开(公告)日:2003-05-06

    申请号:US10158525

    申请日:2002-05-29

    IPC分类号: A61B800

    摘要: A method and apparatus are described for harmonic imaging using a transducer operated in the k31 mode. In one embodiment, the invention includes a transducer operative in a k31 mode, a transmitter for transmitting first signals to the transducer assembly, and a receiver for processing second signals received by the transducer assembly at a harmonic of the frequency of the first signals. In another embodiment, a method of operating an ultrasound system includes emitting first signals in a first frequency range from a transducer operating in the k31 mode, projecting the signals into a body, and detecting second signals confined to a second frequency range.

    摘要翻译: 描述了使用以k31模式操作的换能器的谐波成像的方法和装置。 在一个实施例中,本发明包括以k31模式工作的换能器,用于将第一信号发送到换能器组件的发射器,以及用于以第一信号的频率的谐波处理由换能器组件接收的第二信号的接收器。 在另一个实施例中,一种操作超声系统的方法包括:以从k31模式运行的换能器发射第一频率范围内的第一信号,将信号投射到一个体内,以及检测限于第二频率范围的第二信号。

    FLIP-CHIP INTERCONNECTION THROUGH CHIP VIAS
    2.
    发明申请
    FLIP-CHIP INTERCONNECTION THROUGH CHIP VIAS 有权
    通过芯片VIAS进行切片互连

    公开(公告)号:US20100025785A1

    公开(公告)日:2010-02-04

    申请号:US12442572

    申请日:2007-09-18

    IPC分类号: H01L23/48 H01L21/768

    摘要: An acoustic assembly that includes an integrated circuit package having an electrically conductive via configured to pass from an active portion of the integrated circuit package through a bottom portion of the integrated circuit package. The bottom portion is a bottom side of a substrate of the integrated circuit package. An acoustic element is positioned on the bottom side of the substrate and the via is arranged to electrically couple the active portion of the integrated circuit package to the acoustic element. In one embodiment, the acoustic element is an acoustic stack and the integrated circuit package is an ASIC. The assembly microbeamformed transducer.

    摘要翻译: 一种声学组件,其包括集成电路封装,该集成电路封装具有导电通孔,导电通孔经配置以从集成电路封装的有源部分通过集成电路封装的底部。 底部是集成电路封装的衬底的底侧。 声学元件位于衬底的底侧,并且通孔布置成将集成电路封装件的有源部分电耦合到声学元件。 在一个实施例中,声学元件是声学堆叠,并且集成电路封装是ASIC。 组装微波传感器。

    Ultrasound transducer array with transmitter/receiver integrated
circuitry
    3.
    发明授权
    Ultrasound transducer array with transmitter/receiver integrated circuitry 失效
    具有发射器/接收器集成电路的超声换能器阵列

    公开(公告)号:US5744898A

    公开(公告)日:1998-04-28

    申请号:US752433

    申请日:1996-11-19

    摘要: An ultrasonic transducer assembly is disclosed having both transmit and receive circuitry integral to the transducer assembly for generating and receiving ultrasonic pulses. The ultrasonic transducer array which is integral with the transducer assembly preferably includes multi-layer transducer elements as transmit elements of the array and may include single layer transducer elements as receive elements. Also disclosed is an ultrasonic scanner utilizing the transducer assembly with integral transmit and receive circuitry to reduce the amount and complexity of interconnections between the transducer assembly and a scanner rack.

    摘要翻译: 公开了一种超声波换能器组件,其具有与换能器组件成一体的发射和接收电路,用于产生和接收超声波脉冲。 与换能器组件成一体的超声换能器阵列优选地包括作为阵列的发射元件的多层换能器元件,并且可以包括作为接收元件的单层换能器元件。 还公开了一种利用具有集成的发射和接收电路的换能器组件的超声波扫描器,以减少换能器组件和扫描器架之间的互连的量和复杂性。

    Flip-chip interconnection through chip vias
    4.
    发明授权
    Flip-chip interconnection through chip vias 有权
    通过芯片通孔的倒装芯片互连

    公开(公告)号:US08242665B2

    公开(公告)日:2012-08-14

    申请号:US12442572

    申请日:2007-09-18

    IPC分类号: H01L41/047

    摘要: An acoustic assembly that includes an integrated circuit package having an electrically conductive via configured to pass from an active portion of the integrated circuit package through a bottom portion of the integrated circuit package. The bottom portion is a bottom side of a substrate of the integrated circuit package. An acoustic element is positioned on the bottom side of the substrate and the via is arranged to electrically couple the active portion of the integrated circuit package to the acoustic element. In one embodiment, the acoustic element is an acoustic stack and the integrated circuit package is an ASIC. The assembly microbeamformed transducer.

    摘要翻译: 一种声学组件,其包括集成电路封装,该集成电路封装具有导电通孔,导电通孔经配置以从集成电路封装的有源部分通过集成电路封装的底部。 底部是集成电路封装的衬底的底侧。 声学元件位于衬底的底侧,并且通孔布置成将集成电路封装件的有源部分电耦合到声学元件。 在一个实施例中,声学元件是声学堆叠,并且集成电路封装是ASIC。 组装微波传感器。

    ULTRASOUND TRANSDUCER FEATURING A PITCH INDEPENDENT INTERPOSER AND METHOD OF MAKING THE SAME
    5.
    发明申请
    ULTRASOUND TRANSDUCER FEATURING A PITCH INDEPENDENT INTERPOSER AND METHOD OF MAKING THE SAME 有权
    超声波传感器及其独立的间接器及其制造方法

    公开(公告)号:US20100156243A1

    公开(公告)日:2010-06-24

    申请号:US12446036

    申请日:2007-07-20

    摘要: An ultrasound transducer 10 comprises an application specific integrated circuit (ASIC) 14, an array of acoustic elements 20, and a pitch independent interposer 12. The ASIC 14 includes a plurality of contact pads 16 on a surface of the ASIC that are separated from adjacent ones thereof by a first pitch. The acoustic elements 22 of the array 20 are separated from adjacent ones thereof by a second pitch. In addition, the pitch independent interposer 12 features a plurality of conductive elements 26 separated from adjacent ones thereof by a third pitch different from both the first pitch and the second pitch. The pitch independent interposer 26 is electrically coupled (i) on a first side to the ASIC via a first subset of the plurality of conductive elements and (ii) on a second side to the array of acoustic elements via a second subset of the plurality of conductive elements, wherein one or more of the plurality of conductive elements 26 electrically couples a contact pad 16 of the ASIC 14 with a corresponding acoustic element 22 of the array 20 of acoustic elements.

    摘要翻译: 超声波换能器10包括专用集成电路(ASIC)14,声学元件20阵列和音调独立插入器12. ASIC 14包括在ASIC的表面上的多个接触垫16,该接触垫16与相邻的 其中一个是第一个音调。 阵列20的声学元件22与其相邻的第二音调分离。 此外,音高独立插入器12具有多个导电元件26,其中多个导电元件26与其相邻的导电元件26分开与第一音调和第二音调不同的第三音高。 音调独立插入器26经由多个导电元件的第一子集在第一侧电耦合到ASIC,并且(ii)经由多个导电元件的第二子集在第二侧到声学元件阵列 导电元件,其中所述多个导电元件26中的一个或多个将ASIC 14的接触焊盘16与声学元件阵列20的对应声学元件22电耦合。

    Ultrasound transducer featuring a pitch independent interposer and method of making the same
    6.
    发明授权
    Ultrasound transducer featuring a pitch independent interposer and method of making the same 有权
    具有音高独立插值器的超声换能器及其制作方法

    公开(公告)号:US08330332B2

    公开(公告)日:2012-12-11

    申请号:US12446036

    申请日:2007-07-20

    IPC分类号: H01L41/00

    摘要: An ultrasound transducer (10) comprises an application specific integrated circuit (ASIC) (14), an array of acoustic elements (20), and a pitch independent interposer (12). The ASIC (14) includes a plurality of contact pads (16) on a surface of the ASIC that are separated from adjacent ones thereof by a first pitch. The acoustic elements (22) of the array (20) are separated from adjacent ones thereof by a second pitch. In addition, the pitch independent interposer (12) features a plurality of conductive elements (26) separated from adjacent ones thereof by a third pitch different from both the first pitch and the second pitch. The pitch independent interposer (26) is electrically coupled (i) on a first side to the ASIC via a first subset of the plurality of conductive elements and (ii) on a second side to the array of acoustic elements via a second subset of the plurality of conductive elements, wherein one or more of the plurality of conductive elements (26) electrically couples a contact pad (16) of the ASIC (14) with a corresponding acoustic element (22) of the array (20) of acoustic elements.

    摘要翻译: 超声换能器(10)包括专用集成电路(ASIC)(14),声学元件阵列(20)和音调独立插值器(12)。 ASIC(14)包括在ASIC的表面上与第一间距相隔离的多个接触焊盘(16)。 阵列(20)的声学元件(22)与其相邻的声学元件(22)以第二间距分开。 另外,音调独立插入器(12)具有多个与其相邻的导电元件(26)分开与第一音调和第二音调不同的第三音调的导电元件(26)。 音调独立插入器(26)经由多个导电元件的第一子集在第一侧电耦合到ASIC,并且(ii)经由第二子集的第二侧到声学元件阵列 多个导电元件,其中所述多个导电元件(26)中的一个或多个将所述ASIC(14)的接触焊盘(16)与所述阵列(20)的声学元件的对应声学元件(22)电耦合。

    Kinetic acoustic ocular examination apparatus and method
    7.
    发明授权
    Kinetic acoustic ocular examination apparatus and method 失效
    动力声学检查装置及方法

    公开(公告)号:US6039691A

    公开(公告)日:2000-03-21

    申请号:US87148

    申请日:1998-05-29

    IPC分类号: A61B8/10 A61B8/00

    CPC分类号: A61B8/10

    摘要: Soft tissue examination apparatus and method employ an ultrasonic transducer system for generating a series of ultrasound pulses, at least one of which is of sufficiently high intensity to induce physical displacement of the soft tissue. The transducer receives a series of ultrasonic echo pulses and responsively generates a series of data signals indicative of such tissue displacement. A data processor receives the data signals and determines the magnitude of the displacement. In such a manner, the present invention assists in the evaluation and/or diagnosis of biological tissue. Preferably, the apparatus and method of this invention is employed to examine the properties of a subject's vitreous body and thus may be used in the evaluation and/or diagnosis of ocular disorders, such as vitreous traction.

    摘要翻译: 软组织检查装置和方法采用超声换能器系统来产生一系列超声波脉冲,其中至少一个具有足够高的强度以引起软组织的物理位移。 换能器接收一系列超声波回波脉冲,并且响应地产生指示这种组织位移的一系列数据信号。 数据处理器接收数据信号并确定位移的大小。 以这种方式,本发明有助于生物组织的评估和/或诊断。 优选地,本发明的装置和方法用于检查受试者的玻璃体的性质,并且因此可以用于评价和/或诊断眼部疾病,例如玻璃体牵引。