-
公开(公告)号：US5316219A
公开(公告)日：1994-05-31
申请号：US910670
申请日：1992-07-08
CPC分类号： B05B13/0431 , H05K3/0091
摘要： An apparatus for manipulating a spray device having a spray nozzle relative to a target substrate, which apparatus includes drive mechanisms for moving the spray device in the X, Y and Z directions, and separate mechanisms for rotating the spray nozzle relative to the spray device and for tilting the spray nozzle relative to the spray device and including a pressure regulator to vary the width of the spray pattern as the spray device moves relative to the target substrate.
摘要翻译： 一种用于操纵具有相对于目标衬底的喷嘴的喷射装置的装置，该装置包括用于在X，Y和Z方向上移动喷射装置的驱动机构，以及用于相对于喷雾装置旋转喷嘴的分离机构， 用于相对于喷雾装置倾斜喷嘴并且包括压力调节器以随着喷射装置相对于目标基板移动而改变喷射图案的宽度。
-
2.发明授权
公开(公告)号：US5938848A
公开(公告)日：1999-08-17
申请号：US672098
申请日：1996-06-27
申请人： Patrick T. Hogan , Kenneth Zalewski , John P. Byers , James Powell , Drew Roberts , Richard G. Christyson
发明人： Patrick T. Hogan , Kenneth Zalewski , John P. Byers , James Powell , Drew Roberts , Richard G. Christyson
CPC分类号： B05B12/122 , B23K1/203 , H05K3/3489 , B23K2201/42
摘要： A first embodiment includes a control system which operates a spray gun to apply an even coating of flux to a circuit board or a plurality of different length circuit boards irrespective of the speed that the circuit board(s) move through a coating chamber. In a second embodiment, the control system pulses the spray gun on and off with a pulsing pattern that coats a plurality of zones of a circuit board with spray patterns of different length and thickness.
摘要翻译： 第一实施例包括控制系统，其操作喷枪以将均匀的焊剂涂层施加到电路板或多个不同长度的电路板，而与电路板移动通过涂覆室的速度无关。 在第二实施例中，控制系统用喷射图案脉冲喷枪，脉冲图案涂覆电路板的多个区域，其喷射图案具有不同长度和厚度。
-
公开(公告)号：US5415337A
公开(公告)日：1995-05-16
申请号：US287361
申请日：1994-08-08
CPC分类号： B05B12/122 , B05B12/06 , B05B15/08 , B23K1/203 , H05K3/3489
摘要： Apparatus and methods for a system and process for applying a flux coating to a circuit board by pulsing an airless spray gun on and off to achieve excellent circuit board through-hole penetration and uniform film thickness. An overspray collection system is provided which reduces overspray and increases material utilization and transfer efficiency. A gun positioning mechanism, which can be automated, accurately locates the gun relative to the circuit board.
摘要翻译： 用于通过脉冲无空气喷枪打开和关闭以将焊剂涂层施加到电路板的系统和方法的装置和方法，以实现优异的电路板通孔穿透和均匀的膜厚度。 提供了一种超喷射收集系统，可以减少过度喷涂，提高材料利用率和转移效率。 可以自动化的枪定位机构相对于电路板精确地定位枪。
-
4.发明授权公开(公告)号：US06265017B1
公开(公告)日：2001-07-24
申请号：US09375131
申请日：1999-08-16
申请人： Patrick T. Hogan , Kenneth Zalewski , John P. Byers , James Powell , Drew Roberts , Richard G. Christyson
发明人： Patrick T. Hogan , Kenneth Zalewski , John P. Byers , James Powell , Drew Roberts , Richard G. Christyson
IPC分类号： B05D102
CPC分类号： B05B12/122 , B23K1/203 , B23K2101/42 , H05K3/3489
摘要： A first embodiment includes a control system which operates a spray gun to apply an even coating of flux to a circuit board or a plurality of different length circuit boards irrespective of the speed that the circuit board(s) move through a coating chamber. In a second embodiment, the control system pulses the spray gun on and off with a pulsing pattern that coats a plurality of zones of a circuit board with spray patterns of different length and thickness.
摘要翻译： 第一实施例包括控制系统，其操作喷枪以将均匀的焊剂涂层施加到电路板或多个不同长度的电路板，而与电路板移动通过涂覆室的速度无关。 在第二实施例中，控制系统用喷射图案脉冲喷枪，脉冲图案涂覆电路板的多个区域，其喷射图案具有不同长度和厚度。
-
公开(公告)号：US5368219A
公开(公告)日：1994-11-29
申请号：US146924
申请日：1993-11-04
CPC分类号： B05B12/122 , B05B12/06 , B05B15/08 , B23K1/203 , H05K3/3489
摘要： Apparatus and methods for a system and process for applying a flux coating to a circuit board by pulsing an airless spray gun on and off to achieve excellent circuit board through-hole penetration and uniform film thickness. An overspray collection system is provided which reduces overspray and increases material utilization and transfer efficiency. A gun positioning mechanism, which can be automated, accurately locates the gun relative to the circuit board.
摘要翻译： 用于通过脉冲无空气喷枪打开和关闭以将焊剂涂层施加到电路板的系统和方法的装置和方法，以实现优异的电路板通孔穿透和均匀的膜厚度。 提供了一种超喷射收集系统，可以减少过度喷涂，提高材料利用率和转移效率。 可以自动化的枪定位机构相对于电路板精确地定位枪。
-
6.发明授权Ventilated curing oven and preheat flash zone system for curing coatings on circuit boards 失效通风固化炉和预热闪蒸区系统，用于固化电路板上的涂层
公开(公告)号：US5288526A
公开(公告)日：1994-02-22
申请号：US16230
申请日：1993-02-11
CPC分类号： B29C35/04 , B05D3/0209 , B05D3/0413 , B05D3/067 , B29C35/08 , H05K3/227 , B29C2035/0827 , B29C35/045 , B29L2031/3425
摘要： Apparatus and process for curing conformal coatings on circuit boards being conveyed through a curing chamber within a UV oven. Warm air, exhausted from a lamp housing containing UV lamps for curing the coatings, is directed into a flash zone chamber through which the coated circuit boards are conveyed prior to entering the UV oven for flashing volatile constituents from the coatings and raising the temperature of the circuit boards.
摘要翻译： 用于固化电路板上的保形涂层的装置和方法被输送通过UV烘箱内的固化室。 从包含用于固化涂层的UV灯的灯壳体排出的热空气被引导到闪光区室中，在进入UV烘箱之前，涂覆的电路板通过该闪光区室被输送，以从涂层中闪烁挥发性成分并提高其温度 电路板。
-
-
-
-
-
搜索结果
6 条记录 (耗时 0.02 秒)
