公开(公告)号：US4466852A

公开(公告)日：1984-08-21

申请号：US546215

申请日：1983-10-27

申请人： Richard K. Beltz ,  Donald M. Large ,  Daniel D. Leffel

发明人： Richard K. Beltz ,  Donald M. Large ,  Daniel D. Leffel

IPC分类号： B24B37/34 ,  B32B31/16

CPC分类号： B24B37/345 ,  Y10S134/902 ,  Y10S156/93 ,  Y10T156/11 ,  Y10T156/19 ,  Y10T29/49821

摘要： Wafers (12), including those in the solid state electronics industry, are demounted from an adherent surface (79). A respective passageway (90) is extended from a fluid supply device (92), through the adherent surface (79) to and in communication with, the mounting surface (16) of a respective wafer (12). The fluid is applied via the passageway (90) to and between the mounting surface (16) of the wafer (12) and the adherent surface (79) with sufficient pressure to dislodge the wafer (12). In an advantageous embodiment, the passageway (90) extends to a location between about the centerline (98) and the periphery of the wafer (12). The fluid is thereby applied in an off-center manner with leveraged force to break the seal between the adherent surface (79) and the wafer (12).

摘要翻译： 包括固体电子工业中的晶片（12）从附着表面（79）上拆下。 相应的通道（90）从流体供应装置（92）延伸通过粘附表面（79）延伸到相应晶片（12）的安装表面（16）并与之相连。 流体通过通道（90）施加到晶片（12）的安装表面（16）和粘附表面（79）之间并具有足够的压力以移动晶片（12）。 在有利的实施例中，通道（90）延伸到围绕中心线（98）和晶片（12）周边之间的位置。 因此，流体以偏心的方式以杠杆的力施加，以破坏附着表面（79）和晶片（12）之间的密封。

公开(公告)号：US4531277A

公开(公告)日：1985-07-30

申请号：US599294

申请日：1984-04-12

申请人： Richard K. Beltz ,  Donald M. Large

发明人： Richard K. Beltz ,  Donald M. Large

IPC分类号： H01L21/00 ,  B23Q3/00

CPC分类号： H01L21/67121 ,  Y10T156/1744 ,  Y10T156/1746 ,  Y10T156/1783 ,  Y10T29/49899 ,  Y10T29/53261 ,  Y10T29/53322 ,  Y10T29/53378

摘要： Components such as lids (9) and electronic chip carriers (10) are assembled by registering respective mating faces of each component. An array of assembly stations (75) are formed on an upwardly extending edge (67) of a base (66) having a special inclination. For example, a lid (9) is supported with its mating face upturned and a carrier (10) is supported with its mating face downturned upon the upturned face of the lid (9) on the base (66). The inclination causes the components to slide relative to each other and the base in a given direction within each station (75). A plate (92) overlies a plate (72), supported on and inclined with the base (66). Plate (72) has an opening (74) and plate (92) has an overlying opening (94) to each station (75). The openings (74) and (94) have respective reference edges for stopping sliding of, and thereby positioning an upturned lid (9) and a downturned carrier ( 10) thereupon with a desired registration. A shuttle mechanism (80) reciprocates plate (72) with the openings (74) to and from a magazine (78) to guidably deliver an inverted lid (9) into each station (75). Another magazine (90) is moved to and inclined with the base (66) and guidably delivers an inverted carrier (10) on top of each lid (9) in each station (75). Magazine (90) is moved away and a group clamp (125) is utilized to grasp a resulting array of assembled components for transfer to a subsequent operation.

摘要翻译： 诸如盖（9）和电子芯片载体（10）的组件通过配准每个部件的相应配合面来组装。 在具有特殊倾斜度的基座（66）的向上延伸的边缘（67）上形成有一组组装工位（75）。 例如，盖（9）被支撑，其配合面向上翻转，并且托架（10）以其在底座（66）上的盖（9）的向上翻转的面上下降的配合面支撑。 倾斜使得部件在每个工位（75）内沿给定方向相对于彼此和基部滑动。 板（92）覆盖支撑在基座（66）上并与基座（66）倾斜的板（72）。 板（72）具有开口（74），板（92）具有到每个工位（75）的上覆开口（94）。 开口（74）和（94）具有各自的参考边缘，用于停止滑动，并由此将所向上的盖（9）和下降的托架（10）定位在所需的配准位置上。 穿梭机构（80）将板（72）与开口（74）往复运动，并将其从盒（78）往复运动以引导将倒置的盖（9）输送到每个工位（75）中。 另一盒（90）被移动到底座66并与其倾斜，并且在每个工位（75）中的每个盖子（9）的顶部上可引导地传送倒置的托架（10）。 移动杂志（90）并且使用组夹（125）来抓取所组装的组件阵列以转移到随后的操作。

公开(公告)号：US4498451A

公开(公告)日：1985-02-12

申请号：US520662

申请日：1983-08-05

申请人： Richard K. Beltz ,  Donald M. Large

发明人： Richard K. Beltz ,  Donald M. Large

IPC分类号： B28D5/00 ,  B28D5/04 ,  B28D1/32

CPC分类号： B28D5/04 ,  B28D5/0023 ,  B28D5/0052 ,  Y10T225/371

摘要： An article such as a semiconductor wafer (10) is cut by splitting along a line (22) in a plane known to facilitate splitting. Wafer (10) is supported in a laterally unrestrained manner in a holder (34) lined with preferred paper (26) and fitted with a reference plate (43). Paper liner (26) is of a type having a surface (25) capable of developing lateral restraint by friction between such surface (25) and a surface (13) of wafer (10). A resilient force is applied normal to and upon a top surface (11) of wafer (10) by a press (60) having members (75 and 76) applied along line (22). Separation stresses develop along line (22) of the splitting plane and friction forces develop along paper surface (25) providing lateral resistance to an expected cutting force. A cutter (80) has an elongate tool (92) which is advanced at a top edge (27) of wafer (10) where it abuts plate (43). Tool (92) has a leading edge (94) for cutting and lateral faces (95 and 96) converging angularly toward edge (94) for separating cut surfaces. Tool (92) is advanced into and along the splitting plane at a preferred angle of about forty-five degrees between wafer surface (11) and elongate portion (93) of tool (92). Utilizing a micrometer assisted assembly (86), a gradual, calibrated force is applied to advance tool (92) for a precise distance into wafer (10). Tool (92) provides sufficient cutting and separation that a split becomes self-propagating along line (22) through wafer (10).

摘要翻译： 诸如半导体晶片（10）的物品通过沿已知有利于分裂的平面中的线（22）分裂而被切割。 晶片（10）以横向无限制的方式支撑在衬有优选纸（26）并装配有参考板（43）的保持器（34）中。 纸衬里（26）是具有能够通过这种表面（25）和晶片（10）的表面（13）之间的摩擦而产生横向约束的表面（25）的类型。 通过具有沿着线（22）施加的构件（75和76）的压力机（60）将弹性力垂直施加到晶片（10）的顶表面（11）上。 分离应力沿着分裂平面的线（22）发展，摩擦力沿纸表面（25）发展，提供对预期切割力的横向阻力。 切割器（80）具有在其邻接板（43）的晶片（10）的顶边缘（27）处前进的细长工具（92）。 工具（92）具有用于切割的前缘（94）和用于分离切割表面的边缘（94）成角度地会聚的侧面（95和96）。 工具（92）在晶片表面（11）和工具（92）的细长部分（93）之间以约四十五度的优选角度前进并沿着分割平面。 利用千分尺辅助组件（86），施加渐进的校准力以推进工具（92）以进入晶片（10）的精确距离。 工具（92）提供足够的切割和分离，使得分割沿着线（22）自动传播通过晶片（10）。