摘要:
Multiple damascene layers in integrated circuits can form several advantageous designs or components that may lower cost or increase performance of certain designs. In embodiments for power bus signals, multiple damascene layers may be used to form traces with increased power capacity and lower cost. In other embodiments, multiple damascene layers may be used to form components such as capacitors and inductors with increased performance.
摘要:
A semiconductor device fabrication process includes forming insulating mandrels over one or more replacement metal gates on a semiconductor substrate. The mandrels include a first insulating material. Each mandrel has approximately the same width as its underlying gate with each mandrel being at least as wide as its underlying gate. Mandrel spacers are formed around each insulating mandrel. The mandrel spacers include the first insulating material. Each mandrel spacer has a profile that slopes from being wider at the bottom to narrower at the top. A second insulating layer of the second insulating material is formed over the transistor. Trenches to the sources and drains of the gates are formed by removing the second insulating material from portions of the transistor between the mandrels. Trench contacts to the sources and drains of the gates are formed by depositing conductive material in the first trenches.
摘要:
Improved SRAMs are formed with significantly reduced local interconnect to gate shorts, by a technique providing bidirectional, self-aligned local interconnects, employing a gate hard mask over portions of the gates not connected to the local interconnects. Embodiments include forming a gate hard mask over gates, forming bidirectional trenches overlying portions of the gate electrodes and active silicon regions, etching the hard mask layer to expose regions of the gate electrodes that are to connect to local interconnects, and filling the trenches with conductive material to form self-aligned local interconnects.
摘要:
A method for analyzing an electrical characteristic of wire segments configured as one or more power meshes in an integrated circuit (IC) core comprising the steps of (A) specifying design information corresponding to the power meshes, (B) specifying at least one type of analysis to be performed, where the analysis comprises (i) generating a file corresponding to the IC core in a format compatible with an electronic circuit simulator and (ii) calculating the electrical characteristic of the wire segments via the circuit simulator, and (C) displaying the calculated electrical characteristic.
摘要:
An integrated circuit is provided, which includes a transistor device under test, an AC drive circuit, an AC bias circuit and a DC bias circuit. The AC drive circuit generates an AC drive signal. The AC bias circuit biases the transistor device under AC bias conditions in response to the AC drive signal. The DC bias circuit biases the transistor device under DC bias conditions. A switch circuit selectively couples the transistor device to the AC bias circuit in an AC stress mode and to the DC bias circuit in a DC measurement mode.
摘要:
Relevant logic cells and waveforms of a circuit are automatically identified, traced and displayed by using conventional simulation, schematic viewing and waveform viewing tools. The input and output waveforms to and from each logic cell and a transition and a transition time point of each waveform are derived. The output waveform and a selected transition time point identify a predictive input waveform and its transition time, which cause the output signal transition at the selected transition time point. The predictive input signal is the output signal of a preceding, predictive logic cell, thereby identifying the preceding predictive logic cell. Repetitions of this procedure are performed with each new identified predictive logic cell to automatically derive a series or logic cone of cells. Timing margin (set up and hold time) and signal skew (change in signal timing) are derived under best and worst case functional conditions by determining differences in the transition times of the predictive input waveforms for the cells of the logic cone.
摘要:
A clock tree deskew circuit dynamically minimizes skew in clock signals that synchronize operation of synchronized circuit components of an integrated circuit. The clock tree deskew circuit reduces the clock tree skew in repeated intervals over a period of time. The clock tree deskew circuit is then turned off to prevent unnecessary further adjustments to the clock signals, but can be turned back on when conditions change that alter the clock tree skew. The clock signals are paired together in a continuous loop such that each clock signal is the first clock signal of the pair when paired with the next clock signal and is the second clock signal when paired with the one before it. The clock tree deskew circuit detects the absolute skew between each pair of the clock signals. The clock tree deskew circuit adjusts the first clock signal of each pair toward the second clock signal of the pair to reduce the skew between the two clock signals. After a predetermined number of adjustment cycles, the overall clock skew is minimized by repeated adjustments.
摘要:
A multilevel clock tree uses a temporary clock buffer or reference signal in a clock tree deskew circuit to dynamically minimize skew in a variable delay clock signal that synchronizes operation of synchronized circuit components of an integrated circuit. There are multiple temporary clock buffer signals at each level of the multilevel clock tree. Skew between the temporary clock buffer signals are minimized by providing identical path lengths and path geometries at each level of the temporary clock buffer. The clock tree deskew circuit reduces the clock tree skew, on a level by level basis, in repeated intervals over a period of time. When each level of the tree deskew circuit is deskewed, that level of the clock tree deskew circuit is then turned off to prevent unnecessary further adjustments to the clock signals, but can be turned back on when conditions change that alter the clock tree skew. The clock tree deskew circuit adjusts the variable delay clock buffer signal of each pair toward the temporary clock buffer signal of the pair to reduce the skew between the two clock buffer signals. After a predetermined number of adjustment cycles, the overall clock skew of the variable delay clock buffer signal is minimized by repeated adjustments. The variable delay clock buffer signals of each level may be optionally set as conditions warrant.
摘要:
A semiconductor device fabrication process includes forming insulating mandrels over replacement metal gates on a semiconductor substrate with first gates having sources and drains and at least one second gate being isolated from the first gates. Mandrel spacers are formed around each insulating mandrel. The mandrels and mandrel spacers include the first insulating material. A second insulating layer of the second insulating material is formed over the transistor. One or more first trenches are formed to the sources and drains of the first gates by removing the second insulating material between the insulating mandrels. A second trench is formed to the second gate by removing portions of the first and second insulating materials above the second gate. The first trenches and the second trench are filled with conductive material to form first contacts to the sources and drains of the first gates and a second contact to the second gate.
摘要:
A semiconductor device fabrication process includes forming a gate of a transistor on a semiconductor substrate using a hard mask. The hard mask is selectively removed in one or more selected regions over the gate. The removal of the hard mask in the selected regions allows the gate to be connected to an upper metal layer through at least one insulating layer located substantially over the transistor. Conductive material is deposited in one or more trenches formed through the at least one insulating layer. The conductive material forms a local interconnect to the gate in at least one of the selected regions.