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    Rapid Prototyping Method and Radiation-Curable Composition for Use Therein
    2.
    发明申请
    Rapid Prototyping Method and Radiation-Curable Composition for Use Therein 失效
    快速成型方法和可用于其中的可辐射组合物

    公开(公告)号：US20090224438A1

    公开(公告)日：2009-09-10

    申请号：US11922747

    申请日：2006-06-29

    申请人： Jurgen Stampfl ,  Heinrich Gruber ,  Helga Lichtenegger ,  Robert Liska ,  Robert Infuhr

    发明人： Jurgen Stampfl ,  Heinrich Gruber ,  Helga Lichtenegger ,  Robert Liska ,  Robert Infuhr

    IPC分类号： B29C35/08

    CPC分类号： C08F2/48 ,  B29C33/3842 ,  B29C64/106 ,  B33Y10/00 ,  B33Y70/00 ,  B33Y80/00 ,  G03F7/0017 ,  G03F7/0037 ,  G03F7/027 ,  G03F7/0755 ,  G03F7/42 ,  G03F7/423 ,  G03F7/425 ,  G03F7/426

    摘要： The invention relates to a method for producing three-dimensional objects, comprising producing a three-dimensional structure by sequential selective curing of layers of a composition curable with visible and/or ultraviolet light into a solid polymeric material by sequential exposure of the individual layers to UV and/or visible light, whereafter a three-dimensional object is produced by use of the three-dimensional structure thus formed, followed by removing the three-dimensional structure from or of the three-dimensional object, characterized in that removing the three-dimensional structure is accomplished by chemically cleaving the polymeric material as well as simultaneously or subsequently dissolving the material in a solvent or mixed solvent and/or melting the material.

    摘要翻译： 本发明涉及一种用于生产三维物体的方法，包括通过将可见光和/或紫外光固化的组合物的层顺序选择性固化成固体聚合物材料，通过将各层顺次曝光而制备三维结构 UV和/或可见光，然后通过使用如此形成的三维结构产生三维物体，随后从三维物体中去除三维结构，其特征在于， 通过化学裂解聚合材料以及同时或随后将材料溶解在溶剂或混合溶剂中和/或熔化材料来实现三维结构。

    Shape deposition manufacturing of microscopic ceramic and metallic parts using silicon molds
    4.
    发明授权
    Shape deposition manufacturing of microscopic ceramic and metallic parts using silicon molds 失效
    使用硅模具的微观陶瓷和金属部件的形状沉积制造

    公开(公告)号：US06242163B1

    公开(公告)日：2001-06-05

    申请号：US09387328

    申请日：1999-08-31

    申请人： Jurgen Stampfl ,  Alexander Cooper ,  Rudolf Leitgeb ,  Yih-Lin Cheng ,  Friedrich Prinz

    发明人： Jurgen Stampfl ,  Alexander Cooper ,  Rudolf Leitgeb ,  Yih-Lin Cheng ,  Friedrich Prinz

    IPC分类号： C23F100

    CPC分类号： C23F1/00 ,  B81C99/0085 ,  B81C2201/019 ,  B81C2201/034

    摘要： Micro-Mold Shape Deposition Manufacturing (&mgr;-Mold SDM) is a method for fabricating complex, three-dimensional microstructures from layered silicon molds. Silicon wafers are etched using conventional silicon-processing techniques to produce wafers with surface patterns, some of which contain through-etched regions. The wafers are then stacked and bonded together to form a mold, which is filled with part material. In one embodiment, the part material is a ceramic or metallic gelcasting slurry that is poured into the mold and solidified to form a part precursor. The mold is removed, and the precursor is sintered to form the final part. The gelcasting material may also be a polymer or magnetic slurry, in which case sintering is not needed. The mold can also be filled by electroplating a metal into it; if necessary, each layer is filled with metal after being bonded to a previously filled layer. Patterned silicon wafer layers may also be combined with macroscopic wax layers formed by Mold SDM to create macroscopic parts with some microscopic parts or features.

    摘要翻译： 微模形状沉积制造（mu-Mold SDM）是从分层硅模制造复杂的三维微结构的方法。 使用常规的硅处理技术来蚀刻硅晶片以产生具有表面图案的晶片，其中一些具有贯通蚀刻区域。 然后将晶片堆叠并结合在一起以形成用部件材料填充的模具。 在一个实施例中，部件材料是陶瓷或金属凝胶浇注浆料，其被倒入模具中并固化以形成部件前体。 去除模具，并将前体烧结以形成最终部分。 凝胶浇铸材料也可以是聚合物或磁性浆料，在这种情况下不需要烧结。 模具也可以通过将金属电镀到其中来填充; 如果需要，每层在结合到预先填充的层之后都填充有金属。 图案化的硅晶片层还可以与由模具SDM形成的宏观蜡层组合以产生具有一些微观部件或特征的宏观部件。

    Fabrication of micron-sized parts from conductive materials by silicon electric-discharge machining
    5.
    发明授权
    Fabrication of micron-sized parts from conductive materials by silicon electric-discharge machining 失效
    通过硅放电加工从导电材料制造微米级零件

    公开(公告)号：US06531036B1

    公开(公告)日：2003-03-11

    申请号：US09383113

    申请日：1999-08-25

    申请人： Rudolf Leitgeb ,  Jurgen Stampfl ,  Yih-Lin Cheng ,  Friedrich Prinz

    发明人： Rudolf Leitgeb ,  Jurgen Stampfl ,  Yih-Lin Cheng ,  Friedrich Prinz

    IPC分类号： H01L2100

    CPC分类号： B23H1/04 ,  B23H9/00 ,  B81C99/0085 ,  H01F41/34

    摘要： A method for fabricating sub-millimeter sized parts uses electrodes created from patterned silicon wafers for electric-discharge machining (EDM), in which an electric discharge is generated between a patterned electrode and a conductive workpiece. Workpiece material corresponding to the electrode pattern is removed by electroerosion, and the remaining workpiece contains the desired part. Electrodes are formed by etching stepped patterns in silicon wafers and depositing a thin metallic layer on the wafer. The resulting electrode is used in an EDM machine, and an inverse pattern is produced in the part. Alternately, the silicon wafer pattern is filled by a metal to produce a metal electrode with an inverse pattern. The wafer is removed from the metal, and the metal is used in an EDM machine. The resulting part has the same pattern as the silicon wafer used to create the metal electrode. The metal can be electroplated into the wafer pattern, in which case copper may be used, or metal powder can be hot-pressed into the wafer. Hot pressed electrodes are preferably a mixture of silver and tungsten. The present method is adaptable to highly parallel manufacturing, and can be fully automated using a CAD/CAM system with added process-specific extensions.

    摘要翻译： 用于制造亚毫米尺寸部件的方法使用由图案化硅晶片产生的放电加工（EDM）的电极，其中在图案化电极和导电工件之间产生放电。 对应于电极图案的工件材料通过电蚀去除，剩余的工件包含所需部分。 电极通过在硅晶片中蚀刻阶梯图案并在薄片上沉积薄金属层而形成。 所得电极用于电火花加工机，在该部件中产生反向图案。 或者，硅晶片图案由金属填充以产生具有相反图案的金属电极。 将晶片从金属上除去，并将金属用于EDM机器中。 所得部分具有与用于形成金属电极的硅晶片相同的图案。 金属可以电镀到晶片图案中，在这种情况下可以使用铜，或者可以将金属粉末热压到晶片中。 热压电极优选为银和钨的混合物。 本方法适用于高度并行的制造，并且可以使用具有附加的处理特定扩展的CAD / CAM系统进行全自动化。