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公开(公告)号：US4749754A
公开(公告)日：1988-06-07
申请号：US77920
申请日：1987-07-27
摘要： Thermoplastic molding composition comprising amorphous polyamide and polycarbonate resin blends exhibit improved impact resistance by addition of a polyamide-polyether block copolymer.
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2.发明授权
公开(公告)号：US5605978A
公开(公告)日：1997-02-25
申请号：US542101
申请日：1995-10-12
申请人： Louis M. Maresca , Raymond Z. Naar
发明人： Louis M. Maresca , Raymond Z. Naar
摘要： Thermoplastic molding compositions comprising blends of a block polysiloxane--polycarbonate copolymer and a polyamide resin are useful for extruding articles such as films.
摘要翻译： 包含嵌段聚硅氧烷 - 聚碳酸酯共聚物和聚酰胺树脂的共混物的热塑性模塑组合物可用于挤出诸如薄膜的制品。
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公开(公告)号：US5346967A
公开(公告)日：1994-09-13
申请号：US8267
申请日：1993-01-25
摘要： Thermoplastic resins of enhanced solvent resistance especially useful for packaging or automotive parts comprising blends of amorphous polyamides with a thermoplastic polyester resin, substantially free of a polyarylate have excellent physical properties and barrier resistance to oxygen and carbon dioxide. Preferred blends comprise polyesters prepared by reacting a dihydric alcohol with a dicarboxylic acid, and amorphous polyamides prepared from non-symmetric monomers comprising odd-number chain diamines and diacids, and meta aromatic diamines and diacids.
摘要翻译： 特别适用于包装或汽车部件的热塑性树脂特别适用于包含无定形聚酰胺与热塑性聚酯树脂的共混物，基本上不含多芳基化合物具有优异的物理性能和对氧气和二氧化碳的阻隔性。 优选的共混物包括通过使二元醇与二羧酸反应制备的聚酯和由包含奇数链二胺和二酸的非对称单体和间位芳族二胺和二酸制备的无定形聚酰胺。
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4.发明授权Thermoplastic blends of a polyamide having low amine end-group concentration and a polymer containing carbonate linkages 失效具有低胺端基浓度的聚酰胺和含有碳酸酯键的聚合物的热塑性共混物
公开(公告)号：US5280088A
公开(公告)日：1994-01-18
申请号：US539292
申请日：1990-06-14
CPC分类号： C08L69/005 , C08L67/00 , C08L69/00 , C08L77/00
摘要： Thermoplastic blends of a polyamide having low amine end-group concentration and a polymer containing ester or carbonate linkages. The blends are useful in providing molded parts having improved properties such as improved impact strength.
摘要翻译： 具有低胺端基浓度的聚酰胺和含有酯或碳酸酯键的聚合物的热塑性共混物。 共混物可用于提供具有改进的性能例如改善的冲击强度的模制部件。
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公开(公告)号：US4937130A
公开(公告)日：1990-06-26
申请号：US298390
申请日：1989-01-18
IPC分类号： B65D1/00 , B32B7/02 , B32B27/08 , B32B27/34 , B32B27/36 , C08G69/02 , C08G69/08 , C08L69/00 , C08L77/00
CPC分类号： B32B27/08 , Y10T428/1352 , Y10T428/1383 , Y10T428/31507 , Y10T428/31728 , Y10T428/31732
摘要： A container comprised of an inner aromatic polycarbonate layer, an outer aromatic polycarbonate layer, and an intermediate amorphous polyamide layer between the inner polycarbonate layer and the outer polycarbonate layer. The amorphous polyamide intermediate layer provides the container with enhanced processability, excellent gas barrier properties and hot fill capabilities.
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公开(公告)号：US4857625A
公开(公告)日：1989-08-15
申请号：US35259
申请日：1987-04-02
摘要： Described herein are amorphous thermoplastic terpolymers containing units of the formula: ##STR1## wherein R is independently hydrogen, C.sub.1 to C.sub.6 alkyl, or C.sub.4 to C.sub.8 cycloalkyl, X' is independently ##STR2## wherein R.sub.1 and R.sub.2 are independently hydrogen or C.sub.1 to C.sub.9 alkyl; ##STR3## wherein R.sub.3 and R.sub.4 are independently hydrogen or C.sub.1 to C.sub.8 alkyl and a.sub.1 is an integer of 2 to 7; --S--, --O--, or ##STR4## a is an integer of 0 to 4 and n is independently an integer of 1 to 3. The units are attached to each other by an --0-- bond. These polymers have an excellent combination of mechanical properties. They display high notched izod impact values, high heat distortion temperatures and excellent environmental stress crack resistance.
摘要翻译： 本文描述的是含有下式的单元的无定形热塑性三元共聚物：其中R独立地是氢，C 1至C 6烷基或C 4至C 8环烷基，X 1是（C 1 -C 6） 独立地，其中R 1和R 2独立地是氢或C 1至C 9烷基; 其中R 3和R 4独立地是氢或C 1至C 8烷基，而a1是2至7的整数; -S-，-O-或
a为0〜4的整数，n为1〜3的整数。该单元通过-O-键彼此连接。 这些聚合物具有优异的机械性能组合。 它们显示出高切口izod冲击值，高热变形温度和优异的耐环境应力开裂性。 -
公开(公告)号：US4725647A
公开(公告)日：1988-02-16
申请号：US669424
申请日：1984-11-08
申请人： Louis M. Maresca , Markus Matzner
发明人： Louis M. Maresca , Markus Matzner
摘要： Described herein is a process for preparing polyesters which comprises reacting a dihydric phenol with a diester derivative of an aromatic diacid in the presence of from about 10 to about 60 weight percent of a processing aid having a boiling point of greater than about 200.degree. C., under polyester forming conditions.
摘要翻译： 本文描述的是制备聚酯的方法，其包括在约10至约60重量％的沸点大于约200℃的加工助剂的存在下使二元酚与芳族二酸的二酯衍生物反应。 在聚酯成形条件下。
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公开(公告)号：US4710562A
公开(公告)日：1987-12-01
申请号：US867619
申请日：1986-05-27
申请人： Louis M. Maresca
发明人： Louis M. Maresca
CPC分类号： C08G61/127
摘要： Described herein is a process for stabilizing a poly(aryl ether ketone) produced by a Friedel-Crafts polymerization process which comprises adding a nucleophilic and/or an electrophilic capping agent during the polymerization.
摘要翻译： 本文描述了一种稳定通过Friedel-Crafts聚合方法制备的聚（芳醚酮）的方法，其包括在聚合期间加入亲核和/或亲电性封端剂。
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公开(公告)号：US4705822A
公开(公告)日：1987-11-10
申请号：US872275
申请日：1986-06-10
CPC分类号： C08G64/081
摘要： This invention relates to moldable polycarbonate compositions and in particular to moldable polycarbonates which have ordered, alternating repeating units derived from bis-(3,5-dimethyl-4-hydroxyphenyl)sulfone (TMBS) and 2,2-bis-(4-hydroxyphenyl)propane (Bisphenol A) dihaloformate, or ordered, alternating repeating units derived from bis-(3,5-dimethyl-4-hydroxyphenyl) sulfone (TMBS) dihaloformate and a bisphenol compound such as 2,2-bis-(4-hydroxyphenyl)propane (Bisphenol A). Such polycarbonate exhibit improved hydrolytic stability and also excellent processability in molding applications.
摘要翻译： 本发明涉及可模制的聚碳酸酯组合物，特别是涉及可衍生的聚碳酸酯，其具有衍生自双 - （3,5-二甲基-4-羟基苯基）砜（TMBS）和2,2-双 - （4-羟基苯基） ）丙二醇（双酚A）二卤代甲酸酯或有序的衍生自二 - （3,5-二甲基-4-羟基苯基）砜（TMBS）二卤代甲酸酯和双酚化合物的交替重复单元，例如2,2-双 - （4-羟基苯基） ）丙烷（双酚A）。 这样的聚碳酸酯表现出改善的水解稳定性和在模塑应用中的优异加工性能。
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公开(公告)号：US4550140A
公开(公告)日：1985-10-29
申请号：US591545
申请日：1984-03-20
CPC分类号： H05K1/0333 , C08G75/23 , C08L71/00 , C08L81/06 , H01B3/30 , H01B3/42 , Y10S428/901
摘要： Circuit board substrates prepared from poly(aryl ether)s which contain repeating units derived from bis-(3,5-dimethyl-4-hydroxyphenyl) sulfone (TMBS) exhibit adequate glass transition temperatures (Tg), acceptable plateability and acceptable resistance to water absorption.
摘要翻译： 由聚（芳基醚）制备的包含衍生自双 - （3,5-二甲基-4-羟基苯基）砜（TMBS）的重复单元的电路板基板显示出足够的玻璃化转变温度（Tg），可接受的平版性和可接受的耐水性 吸收。
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