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公开(公告)号：US08298866B1
公开(公告)日：2012-10-30
申请号：US13358947
申请日：2012-01-26
CPC分类号： H01L24/96 , H01L21/56 , H01L21/561 , H01L21/568 , H01L21/6835 , H01L21/76802 , H01L21/76877 , H01L21/78 , H01L21/82 , H01L23/3157 , H01L23/481 , H01L23/5389 , H01L24/19 , H01L24/97 , H01L2221/68345 , H01L2224/04105 , H01L2224/12105 , H01L2224/20 , H01L2224/83132 , H01L2224/8314 , H01L2224/83192 , H01L2224/92144 , H01L2224/97 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/3011 , H01L2224/82
摘要： A method of forming an electronic component package includes coupling a first surface of an electronic component to a first surface of a first dielectric strip, the electronic component comprising bond pads on the first surface; forming first via apertures through the first dielectric strip to expose the bond pads; and filling the first via apertures with an electrically conductive material to form first vias electrically coupled to the bond pads. The bond pads are directly connected to the corresponding first vias without the use of a solder and without the need to form a solder wetting layer on the bond pads.
摘要翻译： 形成电子部件封装的方法包括将电子部件的第一表面耦合到第一介电条的第一表面，所述电子部件包括第一表面上的接合焊盘; 首先经由穿过第一介电条的孔暴露出接合焊盘; 并且用导电材料填充第一通孔，以形成电耦合到接合焊盘的第一通孔。 接合焊盘直接连接到相应的第一通孔而不使用焊料，而不需要在接合焊盘上形成焊料润湿层。
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公开(公告)号：US06905914B1
公开(公告)日：2005-06-14
申请号：US10291050
申请日：2002-11-08
IPC分类号： H01L21/60 , H01L21/68 , H01L23/538 , H01L21/44 , H01L23/053
CPC分类号： H01L24/96 , H01L21/56 , H01L21/561 , H01L21/568 , H01L21/6835 , H01L21/76802 , H01L21/76877 , H01L21/78 , H01L21/82 , H01L23/3157 , H01L23/481 , H01L23/5389 , H01L24/19 , H01L24/97 , H01L2221/68345 , H01L2224/04105 , H01L2224/12105 , H01L2224/20 , H01L2224/83132 , H01L2224/8314 , H01L2224/83192 , H01L2224/92144 , H01L2224/97 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/3011 , H01L2224/82
摘要： A method of forming an electronic component package includes coupling a first surface of an electronic component to a first surface of a first dielectric strip, the electronic component comprising bond pads on the first surface; forming first via apertures through the first dielectric strip to expose the bond pads; and filling the first via apertures with an electrically conductive material to form first vias electrically coupled to the bond pads. The bond pads are directly connected to the corresponding first vias without the use of a solder and without the need to form a solder wetting layer on the bond pads.
摘要翻译： 形成电子部件封装的方法包括将电子部件的第一表面耦合到第一介电条的第一表面，所述电子部件包括第一表面上的接合焊盘; 首先经由穿过第一介电条的孔暴露出接合焊盘; 并且用导电材料填充第一通孔，以形成电耦合到接合焊盘的第一通孔。 接合焊盘直接连接到相应的第一通孔而不使用焊料，而不需要在接合焊盘上形成焊料润湿层。
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公开(公告)号：US07714431B1
公开(公告)日：2010-05-11
申请号：US11605740
申请日：2006-11-28
IPC分类号： H01L23/12
CPC分类号： H01L24/96 , H01L21/56 , H01L21/561 , H01L21/568 , H01L21/6835 , H01L21/76802 , H01L21/76877 , H01L21/78 , H01L21/82 , H01L23/3157 , H01L23/481 , H01L23/5389 , H01L24/19 , H01L24/97 , H01L2221/68345 , H01L2224/04105 , H01L2224/12105 , H01L2224/20 , H01L2224/83132 , H01L2224/8314 , H01L2224/83192 , H01L2224/92144 , H01L2224/97 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/3011 , H01L2224/82
摘要： A method of forming an electronic component package includes coupling a first surface of an electronic component to a first surface of a first dielectric strip, the electronic component comprising bond pads on the first surface; forming first via apertures through the first dielectric strip to expose the bond pads; and filling the first via apertures with an electrically conductive material to form first vias electrically coupled to the bond pads. The bond pads are directly connected to the corresponding first vias without the use of a solder and without the need to form a solder wetting layer on the bond pads.
摘要翻译： 形成电子部件封装的方法包括将电子部件的第一表面耦合到第一介电条的第一表面，所述电子部件包括第一表面上的接合焊盘; 首先经由穿过第一介电条的孔暴露出接合焊盘; 并且用导电材料填充第一通孔，以形成电耦合到接合焊盘的第一通孔。 接合焊盘直接连接到相应的第一通孔而不使用焊料，而不需要在接合焊盘上形成焊料润湿层。
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公开(公告)号：US07192807B1
公开(公告)日：2007-03-20
申请号：US11123605
申请日：2005-05-05
IPC分类号： H01L21/00
CPC分类号： H01L24/96 , H01L21/56 , H01L21/561 , H01L21/568 , H01L21/6835 , H01L21/76802 , H01L21/76877 , H01L21/78 , H01L21/82 , H01L23/3157 , H01L23/481 , H01L23/5389 , H01L24/19 , H01L24/97 , H01L2221/68345 , H01L2224/04105 , H01L2224/12105 , H01L2224/20 , H01L2224/83132 , H01L2224/8314 , H01L2224/83192 , H01L2224/92144 , H01L2224/97 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/3011 , H01L2224/82
摘要： A method of forming an electronic component package includes coupling a first surface of an electronic component to a first surface of a first dielectric strip, the electronic component comprising bond pads on the first surface; forming first via apertures through the first dielectric strip to expose the bond pads; and filling the first via apertures with an electrically conductive material to form first vias electrically coupled to the bond pads. The bond pads are directly connected to the corresponding first vias without the use of a solder and without the need to form a solder wetting layer on the bond pads.
摘要翻译： 形成电子部件封装的方法包括将电子部件的第一表面耦合到第一介电条的第一表面，所述电子部件包括第一表面上的接合焊盘; 首先经由穿过第一介电条的孔暴露出接合焊盘; 并且用导电材料填充第一通孔，以形成电耦合到接合焊盘的第一通孔。 接合焊盘直接连接到相应的第一通孔而不使用焊料，而不需要在接合焊盘上形成焊料润湿层。
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公开(公告)号：US08486764B1
公开(公告)日：2013-07-16
申请号：US13627815
申请日：2012-09-26
CPC分类号： H01L24/96 , H01L21/56 , H01L21/561 , H01L21/568 , H01L21/6835 , H01L21/76802 , H01L21/76877 , H01L21/78 , H01L21/82 , H01L23/3157 , H01L23/481 , H01L23/5389 , H01L24/19 , H01L24/97 , H01L2221/68345 , H01L2224/04105 , H01L2224/12105 , H01L2224/20 , H01L2224/83132 , H01L2224/8314 , H01L2224/83192 , H01L2224/92144 , H01L2224/97 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/3011 , H01L2224/82
摘要： A method of forming an electronic component package includes coupling a first surface of an electronic component to a first surface of a first dielectric strip, the electronic component comprising bond pads on the first surface; forming first via apertures through the first dielectric strip to expose the bond pads; and filling the first via apertures with an electrically conductive material to form first vias electrically coupled to the bond pads. The bond pads are directly connected to the corresponding first vias without the use of a solder and without the need to form a solder wetting layer on the bond pads.
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公开(公告)号：US08119455B1
公开(公告)日：2012-02-21
申请号：US13065296
申请日：2011-03-18
IPC分类号： H01L21/00
CPC分类号： H01L24/96 , H01L21/56 , H01L21/561 , H01L21/568 , H01L21/6835 , H01L21/76802 , H01L21/76877 , H01L21/78 , H01L21/82 , H01L23/3157 , H01L23/481 , H01L23/5389 , H01L24/19 , H01L24/97 , H01L2221/68345 , H01L2224/04105 , H01L2224/12105 , H01L2224/20 , H01L2224/83132 , H01L2224/8314 , H01L2224/83192 , H01L2224/92144 , H01L2224/97 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/3011 , H01L2224/82
摘要： A method of forming an electronic component package includes coupling a first surface of an electronic component to a first surface of a first dielectric strip, the electronic component comprising bond pads on the first surface; forming first via apertures through the first dielectric strip to expose the bond pads; and filling the first via apertures with an electrically conductive material to form first vias electrically coupled to the bond pads. The bond pads are directly connected to the corresponding first vias without the use of a solder and without the need to form a solder wetting layer on the bond pads.
摘要翻译： 形成电子部件封装的方法包括将电子部件的第一表面耦合到第一介电条的第一表面，所述电子部件包括第一表面上的接合焊盘; 首先经由穿过第一介电条的孔暴露出接合焊盘; 并且用导电材料填充第一通孔，以形成电耦合到接合焊盘的第一通孔。 接合焊盘直接连接到相应的第一通孔而不使用焊料，而不需要在接合焊盘上形成焊料润湿层。
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公开(公告)号：US07932595B1
公开(公告)日：2011-04-26
申请号：US12661604
申请日：2010-03-19
IPC分类号： H01L23/12
CPC分类号： H01L24/96 , H01L21/56 , H01L21/561 , H01L21/568 , H01L21/6835 , H01L21/76802 , H01L21/76877 , H01L21/78 , H01L21/82 , H01L23/3157 , H01L23/481 , H01L23/5389 , H01L24/19 , H01L24/97 , H01L2221/68345 , H01L2224/04105 , H01L2224/12105 , H01L2224/20 , H01L2224/83132 , H01L2224/8314 , H01L2224/83192 , H01L2224/92144 , H01L2224/97 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/3011 , H01L2224/82
摘要： A method of forming an electronic component package includes coupling a first surface of an electronic component to a first surface of a first dielectric strip, the electronic component comprising bond pads on the first surface; forming first via apertures through the first dielectric strip to expose the bond pads; and filling the first via apertures with an electrically conductive material to form first vias electrically coupled to the bond pads. The bond pads are directly connected to the corresponding first vias without the use of a solder and without the need to form a solder wetting layer on the bond pads.
摘要翻译： 形成电子部件封装的方法包括将电子部件的第一表面耦合到第一介电条的第一表面，所述电子部件包括第一表面上的接合焊盘; 首先经由穿过第一介电条的孔暴露出接合焊盘; 并且用导电材料填充第一通孔，以形成电耦合到接合焊盘的第一通孔。 接合焊盘直接连接到相应的第一通孔而不使用焊料，而不需要在接合焊盘上形成焊料润湿层。
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