公开(公告)号：US20210130585A1

公开(公告)日：2021-05-06

申请号：US16476690

申请日：2018-01-11

Applicant: SABIC GLOBAL TECHNOLOGIES B.V.

Inventor： Jian WANG ,  Yunan Cheng ,  Yaqin ZHANG ,  Shijie SONG

IPC: C08K9/12

Abstract: Disclosed herein are compositions thermoplastic composition comprising: (a) about 20 wt % to about 99 wt % of a polymer component; and (b) about 1 wt % to about 30 wt % of a laser activatable additive having a core-shell structure; wherein the core comprises an inorganic filler and the shell comprises a laser activatable component comprising copper hydroxide phosphate or tin and antimony oxide, said core comprising from about 10 wt % to about 80 wt % of the laser activatable additive and said shell comprising from about 20 wt % to about 90 wt % of the laser activatable additive.

公开(公告)号：US20210024701A1

公开(公告)日：2021-01-28

申请号：US16982630

申请日：2019-03-18

Applicant: SABIC GLOBAL TECHNOLOGIES B.V.

Inventor： Jian WANG ,  Shijie SONG

IPC: C08G77/00 ,  C08G77/46 ,  C08L71/12 ,  C08L83/12 ,  C08K3/013 ,  C08K5/00 ,  C08K3/22 ,  C08K3/30

Abstract: A thermoplastic composition includes a polyarylene ether component, a flame retardant additive, an impact modifier, and a laser direct structuring additive. The laser platable thermoplastic composition is capable of being plated after being activated using a laser, exhibits a plating index of greater than 0.8 when tested using X-ray fluorescence, and exhibits a heat deflection temperature of greater than 150° C. at 0.45 MPa/3.2 mm when tested in accordance with ASTM D648. In further aspects, the thermoplastic composition may further comprise a laser direct structuring additive synergist comprising a polysiloxane, a polysilane, or a silane.

公开(公告)号：US20200262998A1

公开(公告)日：2020-08-20

申请号：US16477036

申请日：2018-01-11

Applicant: SABIC GLOBAL TECHNOLOGIES B.V.

Inventor： Yaqin ZHANG ,  Jian WANG ,  Mingcheng GUO ,  Yunan CHENG ,  Shijie SONG

IPC: C08K3/04 ,  C08K7/14 ,  C08K3/38 ,  C08K3/22 ,  C08K3/34 ,  C23C18/16

Abstract: The disclosure concerns thermally conductive polymer compositions comprising: (a) from about 20 wt % to about 80 wt % of at least one polymer component; (b) from greater than about 0 wt % to about 70 wt % of a thermally conductive filler; and (c) from about 0.1 wt % to about 40 wt % of a laser activatable additive having a core-shell structure; wherein the core comprises an inorganic filler and the shell comprises a laser activatable component; wherein the combined weight percent value of all components does not exceed about 100 wt %; wherein all weight percent values are based on the total weight of the composition; and wherein a molded sample of the blended thermoplastic composition has a through plane thermal conductivity of at least about 0.40 W/m·K when determined in accordance with ASTM E1461.

公开(公告)号：US20190352503A1

公开(公告)日：2019-11-21

申请号：US16476757

申请日：2018-01-10

Applicant: SABIC GLOBAL TECHNOLOGIES B.V.

Inventor： Yunan CHENG ,  Shijie SONG ,  Jian WANG

IPC: C08L71/12 ,  C08L23/10 ,  B29C35/08 ,  C23C18/20 ,  B29C45/00 ,  C23C18/16

Abstract: Disclosed herein are thermoplastic composition comprising (a) about 15 wt % to about 95 wt % polymer component comprising: (i) either about 20 wt % to about 85 wt % poly(p-phenylene oxide) and about 10 wt % to about 65 wt % flow promoter or about 70 wt % to 100 wt % polypropylene, said polypropylene being homopolymer and/or copolymer; and (ii) greater than about 0 wt % to about 30 wt % impact modifier; (b) about 2 wt % to about 50 wt % of a laser activatable additive having a core-shell structure, wherein the core comprises an inorganic filler and the shell comprises a laser activatable component; and (c) about 3 wt % to about 70 wt % inorganic fillers.

公开(公告)号：US20180258282A1

公开(公告)日：2018-09-13

申请号：US15752908

申请日：2016-07-21

Applicant: SABIC Global Technologies B.V.

Inventor： Jian WANG ,  Shijie SONG

IPC: C08L71/12 ,  C08L53/02 ,  C08L25/06 ,  C08K3/22 ,  C08K3/30 ,  C08K3/014 ,  B29C47/00

CPC classification number: C08L71/12 ,  B29C48/022 ,  C08K3/014 ,  C08K3/20 ,  C08K3/22 ,  C08K3/30 ,  C08K2003/2241 ,  C08L25/06 ,  C08L53/02 ,  C08L2203/20

Abstract: Disclosed are resin compositions that include poly(arylene ether), HIPS/GPPS), impact modifier, and ceramic filer that provide various Dk values while maintaining Df at a very low level. The compositions also possess excellent mechanical and processing performance, for example, superior high impact strength and good ductility, compared to prior art compositions. The compositions can be used to form components of wireless electronic communications devices in order to ensure a low degree of signal attenuation.

公开(公告)号：US20210009886A1

公开(公告)日：2021-01-14

申请号：US17040733

申请日：2019-03-26

Applicant: SABIC GLOBAL TECHNOLOGIES B.V.

Inventor： Jian WANG ,  Shijie SONG ,  Yaqin ZHANG

IPC: C09K5/14 ,  C08L71/12 ,  C08J3/20 ,  H05K1/03 ,  H05K1/02

Abstract: A polymer composition includes: from about 20 wt. % to about 80 wt. % of a polymer base resin; from about 10 wt. % to about 60 wt. % of a thermally conductive filler; and from about 5 wt. % to about 60 wt. % of a dielectric ceramic filler having a Dk of at least 20 when measured at 1.1 GHz or greater. The polymer composition exhibits a dielectric constant greater than 3.0 at 1.1 GHz when tested using a split post dielectric resonator and network analyzer on a sample size of 120 mm by 120 mm and 6 mm thickness according to ASTM D150. The polymer composition exhibits a dissipation factor of less than 0.002 at 1.1 GHz when tested using a split post dielectric resonator and network analyzer on a sample size of 120 mm by 120 mm and 6 mm thickness according to ASTM D150.

公开(公告)号：US20200010674A1

公开(公告)日：2020-01-09

申请号：US16458579

申请日：2019-07-01

Applicant: SABIC GLOBAL TECHNOLOGIES B.V.

Inventor： Jian WANG ,  Wei SHAN ,  Xing LIU

IPC: C08L71/12

Abstract: A thermoplastic composition includes from 29.9 wt % to 84.9 wt % of a base resin including poly(p-phenylene oxide) (PPO), polystyrene (PS) and an impact modifier; from 15 wt % to 70 wt % of a dielectric filler; and from 0.1 wt % to 10 wt % of an impact promoter including a polycarbonate-siloxane copolymer, a polyolefin-siloxane copolymer, or a combination thereof. The thermoplastic composition has a dielectric constant (Dk) of from 3.0-8.0 between 1 and 5 gigahertz (GHz) and a dissipation factor (Df) of less than 0.003 between 1 and 5 GHz. Articles including the thermoplastic composition, and in particular telecommunications devices, are also described.

公开(公告)号：US20200010658A1

公开(公告)日：2020-01-09

申请号：US16458556

申请日：2019-07-01

Applicant: SABIC GLOBAL TECHNOLOGIES B.V.

Inventor： Jian WANG ,  Shijie SONG

IPC: C08L23/14

Abstract: A thermoplastic composition includes: from 48.9 wt % to 93.9 wt % of a thermoplastic resin component including polypropylene, polypropylene copolymer, blends thereof or combinations thereof; from 5 wt % to 50 wt % glass fiber; from 1 wt % to 30 wt % impact modifier; and from 0.1 wt % to 10 wt % of a polyolefin-siloxane copolymer. The thermoplastic composition has a dielectric constant (Dk) of less than 2.8 at from 1-5 gigahertz (GHz) and a dissipation factor (Df) of less than 0.003 at from 1-5 GHz, the combined weight percent value of all components does not exceed 100 wt %, and all weight percent values are based on the total weight of the composition. Articles including the thermoplastic composition—and in particular telecommunications devices including the thermoplastic composition—are also described.

公开(公告)号：US20190177519A1

公开(公告)日：2019-06-13

申请号：US16300991

申请日：2017-05-25

Applicant: SABIC Global Technologies B.V.

Inventor： Jian WANG ,  Shijie SONG ,  Zhenke WEI ,  Qin WANG ,  Mian DAI

IPC: C08L23/12 ,  C08L71/12 ,  C08L69/00 ,  C08K7/14 ,  C08L67/02 ,  C08L23/08 ,  C08L25/08

Abstract: A thermoplastic composition includes from about 50 wt. % to about 90 wt. % of a polymeric base resin and from about 10 wt. % to about 50 wt. % of a low dielectric constant (Dk)/low dissipation factor (Df) glass fiber component. The low Dk/low Df glass fiber component has a Dk of less than about 5.0 at a frequency of from 1 MHz to 1 GHz and a Df of less than about 0.002 at a frequency of from 1 MHz to 1 GHz. In certain aspects the thermoplastic composition has a Dk that is at least about 0.1 lower than a substantially identical reference composition that does not include the low Dk/low Df glass fiber component.