公开(公告)号：US20180355170A1

公开(公告)日：2018-12-13

申请号：US15580501

申请日：2016-06-27

Applicant: SABIC Global Technologies B.V.

Inventor： Yaqin ZHANG ,  Mingcheng GUO ,  Haowei TANG ,  Shan QIN ,  Shengying QIAN

IPC: C08L77/00 ,  C08L69/00 ,  C08L71/02 ,  C08L65/02 ,  C08L23/16 ,  C08L23/08 ,  C08K5/09 ,  C08K5/17 ,  C08K5/42 ,  C08K5/1515 ,  C08K3/22 ,  C08K3/38

CPC classification number: C08L77/00 ,  C08K3/22 ,  C08K3/38 ,  C08K5/09 ,  C08K5/1515 ,  C08K5/17 ,  C08K5/42 ,  C08K2003/2224 ,  C08K2003/385 ,  C08K2201/001 ,  C08L23/0815 ,  C08L23/16 ,  C08L51/06 ,  C08L65/02 ,  C08L69/00 ,  C08L71/02 ,  C08L77/02

Abstract: The present disclosure is directed to polymer composites, and, particularly, thermally conductive polymer composites. The polymer composites can include from about 20 wt. % to about 80 wt. % of a base polymer resin; from about 1 wt. % to about 70 wt. % of thermoconductive filler material comprising thermoconductive particles having a plurality of electronegative functional groups at the surface of the particles, and having a thermal conductivity of at least 2 W/m*K; from about 0.01 wt. % to about 20 wt. % of an amphiphilic compatibilizer including a hydrophilic component and hydrophobic chain component; and, optionally, from about 0 wt. % to 50 wt. % of an additive. As compared to a control composition having 0.00 wt. % of the amphiphilic compatibilizer, the composite has (i) increased mechanical strength as measured by Izod impact testing, and, (ii) increased thermal conductivity as measured by through-plane or in-plane testing.

公开(公告)号：US20210009886A1

公开(公告)日：2021-01-14

申请号：US17040733

申请日：2019-03-26

Applicant: SABIC GLOBAL TECHNOLOGIES B.V.

Inventor： Jian WANG ,  Shijie SONG ,  Yaqin ZHANG

IPC: C09K5/14 ,  C08L71/12 ,  C08J3/20 ,  H05K1/03 ,  H05K1/02

Abstract: A polymer composition includes: from about 20 wt. % to about 80 wt. % of a polymer base resin; from about 10 wt. % to about 60 wt. % of a thermally conductive filler; and from about 5 wt. % to about 60 wt. % of a dielectric ceramic filler having a Dk of at least 20 when measured at 1.1 GHz or greater. The polymer composition exhibits a dielectric constant greater than 3.0 at 1.1 GHz when tested using a split post dielectric resonator and network analyzer on a sample size of 120 mm by 120 mm and 6 mm thickness according to ASTM D150. The polymer composition exhibits a dissipation factor of less than 0.002 at 1.1 GHz when tested using a split post dielectric resonator and network analyzer on a sample size of 120 mm by 120 mm and 6 mm thickness according to ASTM D150.

公开(公告)号：US20210130585A1

公开(公告)日：2021-05-06

申请号：US16476690

申请日：2018-01-11

Applicant: SABIC GLOBAL TECHNOLOGIES B.V.

Inventor： Jian WANG ,  Yunan Cheng ,  Yaqin ZHANG ,  Shijie SONG

IPC: C08K9/12

Abstract: Disclosed herein are compositions thermoplastic composition comprising: (a) about 20 wt % to about 99 wt % of a polymer component; and (b) about 1 wt % to about 30 wt % of a laser activatable additive having a core-shell structure; wherein the core comprises an inorganic filler and the shell comprises a laser activatable component comprising copper hydroxide phosphate or tin and antimony oxide, said core comprising from about 10 wt % to about 80 wt % of the laser activatable additive and said shell comprising from about 20 wt % to about 90 wt % of the laser activatable additive.

公开(公告)号：US20170183475A1

公开(公告)日：2017-06-29

申请号：US15320454

申请日：2015-06-26

Applicant: SABIC Global Technologies B.V.

Inventor： Yaqin ZHANG ,  Mingcheng GUO ,  Yun ZHENG

IPC: C08K3/00 ,  C09K21/02 ,  C08K3/22 ,  C09K5/14

CPC classification number: C08K3/016 ,  C08K3/22 ,  C08K3/32 ,  C08K3/34 ,  C08K3/38 ,  C08K5/5435 ,  C08K2003/2224 ,  C08K2003/2227 ,  C08K2003/329 ,  C08K2003/387 ,  C08K2201/001 ,  C09K5/14 ,  C09K21/02 ,  C08L77/02

Abstract: The invention concerns compositions comprising (a) from about 20 wt % to about 80 wt % of a polymer component; (b) from about 10 wt % to about 70 wt % of a flame retardant component; and (c) from about 0.01 wt % to about 5 wt % of an acid component; wherein the combined weight percent value of all components does not exceed 100 wt %; wherein all weight percent values are based on the total weight of the composition; and wherein the composition has: (i) a thermal conductivity of at least about 1.5 W/mK for through plane thermal conductivity; (ii) flame retardancy of at least VI at 0.8 mm using the UL94 test standard; and (iii) melt volume flow rate of at least 10 g/cm3 using ASTM D 1238.

公开(公告)号：US20200262998A1

公开(公告)日：2020-08-20

申请号：US16477036

申请日：2018-01-11

Applicant: SABIC GLOBAL TECHNOLOGIES B.V.

Inventor： Yaqin ZHANG ,  Jian WANG ,  Mingcheng GUO ,  Yunan CHENG ,  Shijie SONG

IPC: C08K3/04 ,  C08K7/14 ,  C08K3/38 ,  C08K3/22 ,  C08K3/34 ,  C23C18/16

Abstract: The disclosure concerns thermally conductive polymer compositions comprising: (a) from about 20 wt % to about 80 wt % of at least one polymer component; (b) from greater than about 0 wt % to about 70 wt % of a thermally conductive filler; and (c) from about 0.1 wt % to about 40 wt % of a laser activatable additive having a core-shell structure; wherein the core comprises an inorganic filler and the shell comprises a laser activatable component; wherein the combined weight percent value of all components does not exceed about 100 wt %; wherein all weight percent values are based on the total weight of the composition; and wherein a molded sample of the blended thermoplastic composition has a through plane thermal conductivity of at least about 0.40 W/m·K when determined in accordance with ASTM E1461.

公开(公告)号：US20190309205A1

公开(公告)日：2019-10-10

申请号：US16308185

申请日：2017-06-06

Applicant: SABIC GLOBAL TECHNOLOGIES B.V.

Inventor： Mingcheng GUO ,  Yaqin ZHANG ,  Shijie SONG ,  Narong AN ,  Yubin BAO

IPC: C09K5/14 ,  C08L69/00 ,  B29C45/00 ,  B29C48/00

Abstract: Thermally conductive compositions include from about 20 wt. % to about 80 wt. % of a polycarbonate polymer, from about 0.5 wt. % to about 30 wt. % of an impact modifier, and a thermal conductivity modifier. The thermal conductivity modifier includes from about 0.5 wt. % to about 10 wt. % of a high density polyethylene polymer, from about 0.5 wt. % to about 10 wt. % of a maleic anhydride type copolymer, or from about 0.01 wt. % to about 10 wt. % of an acid component. In some aspects the thermally conductive compositions have a notched Izod impact strength of at least about 30 J/m, a through-plane thermal conductivity of at least about 0.4 W/mK and/or an in-plane thermal conductivity of at least about 1.0 W/mK. Methods for making the compositions and articles formed according to the methods are also described.

公开(公告)号：US20180312650A1

公开(公告)日：2018-11-01

申请号：US15770986

申请日：2016-10-17

Applicant: SABIC Global Technologies B.V.

Inventor： Yaqin ZHANG ,  Ming GU ,  Feng JIANG ,  Mingcheng GUO

IPC: C08J7/04 ,  C09D5/24 ,  C09D5/32

CPC classification number: C08J7/04 ,  C08J2375/04 ,  C09D5/24 ,  C09D5/32

Abstract: An article may comprise a substrate formed from a thermoplastic or thermoset; and a thermal conductive or heat absorptive coating disposed adjacent the substrate to form a composite stack, wherein the composite stack is characterized by an increase of through plane thermal conductivity of at least 2 W/m*K, when compared to the substrate without the coating.