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公开(公告)号：US20240029941A1
公开(公告)日：2024-01-25
申请号：US18102911
申请日：2023-01-30
发明人： Dong Hwan LEE , Chan YOON , Dong Jin LEE , Tae Hyun KIM , Byeong Cheol MOON , Boum Seock KIM
CPC分类号： H01F27/2804 , H01F27/292
摘要： A coil component includes a body, a first coil disposed in the body and including a first winding portion having a turns number less than one turn, a second coil disposed in the body and including a second winding portion having a turns number less than one turn, a first external electrode and a second external electrode, respectively connected to one end and the other end of the first coil, and a third external electrode and a fourth external electrode, respectively connected to one end and the other end of the second coil. A portion of the first winding portion is disposed on an internal side of the second winding portion, and a portion of the second winding portion is disposed on an internal side of the first winding portion.
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公开(公告)号：US20150136451A1
公开(公告)日：2015-05-21
申请号：US14268970
申请日：2014-05-02
发明人： Heung Woo PARK , Do Jae YOO , Tae Hyun KIM
CPC分类号： H05K3/4007 , H01L21/4853 , H01L21/568 , H01L23/3121 , H01L23/49811 , H01L2924/0002 , H05K3/284 , H05K2203/0338 , Y10T29/49146 , H01L2924/00
摘要： There is provided an electronic component module including: a substrate on which an electronic component is mounted; at least one insulating member coupled to the substrate and having a surface on which a plating layer is formed; and a molded portion covering the electronic component and the at least one insulating member, wherein the insulating member is bonded to the substrate and a metal layer is formed on a bonding surface between the substrate and the insulating member.
摘要翻译： 提供了一种电子部件模块，包括：安装有电子部件的基板; 至少一个绝缘构件，其耦合到所述衬底并且具有其上形成有镀层的表面; 以及覆盖所述电子部件和所述至少一个绝缘部件的成型部，其中，所述绝缘部件与所述基板接合，并且在所述基板与所述绝缘部件的接合面上形成金属层。
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公开(公告)号：US20140185242A1
公开(公告)日：2014-07-03
申请号：US13789030
申请日：2013-03-07
发明人： Kwang Soo KIM , Tae Hyun KIM , Bum Seok SUH , In Wha JEONG , Young Ki LEE
IPC分类号： H05K7/20
CPC分类号： H05K7/209 , H01L23/367 , H01L23/49833 , H01L23/49861 , H01L24/73 , H01L25/072 , H01L2224/32245 , H01L2224/48229 , H01L2224/49111 , H01L2224/49175 , H01L2224/73265 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/15159 , H01L2224/48227 , H01L2924/00012 , H01L2924/00
摘要： There is provided a power semiconductor module in which power semiconductor elements, integration of which may be difficult due to heating, are modularized. The power semiconductor module includes: a heat dissipation substrate electrically connected to a common connection terminal; and a plurality of electronic elements disposed on the heat dissipation substrate, wherein the electronic elements have varying spaces therebetween.
摘要翻译： 提供了功率半导体模块，其中由于加热而可能难以集成的功率半导体元件被模块化。 功率半导体模块包括：电连接到公共连接端子的散热基板; 以及设置在所述散热基板上的多个电子元件，其中，所述电子元件之间具有不同的间隔。
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公开(公告)号：US20180053719A1
公开(公告)日：2018-02-22
申请号：US15600114
申请日：2017-05-19
发明人： Tae Hyun KIM , Thomas A. KIM , Kyu Bum HAN , Tae Hoon KIM
IPC分类号： H01L23/522 , H01L23/532
CPC分类号： H01L23/5226 , H01L23/13 , H01L23/49816 , H01L23/53209 , H01L23/53214 , H01L23/53219 , H01L23/53228 , H01L23/53233 , H01L23/53242 , H01L23/53247 , H01L23/5328 , H01L23/5389 , H01L23/552 , H01L24/19 , H01L24/20 , H01L25/03 , H01L25/105 , H01L2224/04105 , H01L2224/12105 , H01L2224/16227 , H01L2225/1035 , H01L2225/1058 , H01L2924/1434 , H01L2924/15311 , H01L2924/3025
摘要： A semiconductor package includes a frame having a through hole, an electronic component disposed in the through hole, a metal layer disposed on either one or both of an inner surface of the frame and an upper surface of the electronic component, a redistribution portion disposed below the frame and the electronic component, and a conductive layer connected to the metal layer.
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公开(公告)号：US20150156575A1
公开(公告)日：2015-06-04
申请号：US14267575
申请日：2014-05-01
发明人： Tae Hyun KIM , Heung Woo PARK
CPC分类号： H04R31/00 , H04R17/02 , H04R19/005 , H04R19/04 , H04R2201/003
摘要： There is provided a microphone package including: a microphone element formed on a semiconductor element; a mold enclosing the semiconductor element and the microphone element; and a conductive pattern formed on one surface of the mold and having a hole formed therein, the hole being connected to the microphone element.
摘要翻译： 提供了一种麦克风包，包括：形成在半导体元件上的麦克风元件; 封闭半导体元件和麦克风元件的模具; 以及形成在所述模具的一个表面上并且具有形成在其中的孔的导电图案，所述孔连接到所述麦克风元件。
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公开(公告)号：US20230420177A1
公开(公告)日：2023-12-28
申请号：US18097896
申请日：2023-01-17
CPC分类号： H01F27/292 , H01F27/24 , H01F27/306
摘要： A coil component includes a body including a first surface and a second surface opposing each other in a first direction, a third surface and a fourth surface opposing each other in a second direction perpendicular to the first direction, and a fifth surface and a sixth surface opposing each other in a third direction perpendicular to the first direction and the second direction, and including a recess in the third surface, a support member disposed in the body, a coil disposed on the support member and including first and second lead-out portions extending to the third surface of the body, and first and second external electrodes disposed on the sixth surface of the body, extending into the recess and connected to the first and second lead-out portions, respectively.
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公开(公告)号：US20150249891A1
公开(公告)日：2015-09-03
申请号：US14592243
申请日：2015-01-08
发明人： Tae Hyun KIM , Jong Woo HAN , Heung Woo PARK
IPC分类号： H04R23/00
CPC分类号： H04R1/06 , H01L2224/48137 , H01L2924/16151 , H01L2924/16152 , H04R1/04 , H04R1/086 , H04R19/005 , H04R19/04 , H04R31/00 , H04R2499/11
摘要： The microphone package includes: a package substrate including a lead frame and an insulating portion; and an acoustic device mounted on the package substrate and having a space formed in a lower surface thereof, wherein the package substrate includes an acoustic space connected to the space of the acoustic device.
摘要翻译： 麦克风封装包括：包括引线框架和绝缘部分的封装基板; 以及安装在所述封装基板上并具有形成在其下表面中的空间的声学装置，其中所述封装基板包括连接到所述声学装置的空间的声学空间。
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公开(公告)号：US20150230028A1
公开(公告)日：2015-08-13
申请号：US14303799
申请日：2014-06-13
发明人： Heung Woo PARK , Jong Woo HAN , Tae Hyun KIM
IPC分类号： H04R23/00
CPC分类号： H04R19/04 , H01L2224/48091 , H01L2924/16152 , H04R1/086 , H04R19/005 , H04R31/00 , H01L2924/00014
摘要： Embodiments of the invention provide a micro electro mechanical systems (MEMS) microphone, which includes a microphone chip, a premold lead frame comprising a lead frame to which the microphone chip is electrically connected, and a cover coupled to the premold lead frame to cover the microphone chip and electrically connected to the premold lead frame.
摘要翻译： 本发明的实施例提供了一种微机电系统（MEMS）麦克风，其包括麦克风芯片，包括导电框架的预引导框架，麦克风芯片电连接到该引线框架，以及连接到预成型引线框架以覆盖 麦克风芯片并电连接到预制引线框架。
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9.发明申请SEMICONDUCTOR PACKAGE, METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE AND STACK TYPE SEMICONDUCTOR PACKAGE 审中-公开半导体封装，制造半导体封装和堆叠型半导体封装的方法公开(公告)号：US20150054173A1
公开(公告)日：2015-02-26
申请号：US14328672
申请日：2014-07-10
发明人： Tae Hyun KIM , Do Jae YOO , Heung Woo PARK
IPC分类号： H01L23/522 , H01L23/31 , H01L21/50 , H01L21/56
CPC分类号： H01L21/50 , H01L21/4853 , H01L21/565 , H01L23/142 , H01L23/145 , H01L23/3121 , H01L23/49811 , H01L23/49827 , H01L24/24 , H01L24/73 , H01L24/82 , H01L25/0657 , H01L25/105 , H01L2021/6027 , H01L2224/0401 , H01L2224/04105 , H01L2224/12105 , H01L2224/131 , H01L2224/16225 , H01L2224/16245 , H01L2224/24226 , H01L2224/24246 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73257 , H01L2224/73265 , H01L2224/73267 , H01L2224/92244 , H01L2225/0651 , H01L2225/06568 , H01L2225/1023 , H01L2225/1029 , H01L2225/1035 , H01L2225/1058 , H01L2924/12042 , H01L2924/1305 , H01L2924/13055 , H01L2924/14 , H01L2924/15311 , H01L2924/1533 , H01L2924/15787 , H01L2924/181 , H01L2924/014 , H01L2924/00012 , H01L2924/00
摘要： Disclosed herein are a semiconductor package, a method of manufacturing a semiconductor package, and a stack type semiconductor package. The semiconductor package according to a preferred embodiment of the present invention includes: a base substrate on which a first circuit layer is formed; a semiconductor device formed on the base substrate; a molding part formed on the base substrate and formed to enclose the first circuit layer and the semiconductor device; a first via formed on the first circuit layer and formed to penetrate through the molding part; and a second circuit layer formed on an upper surface of the molding part and integrally formed with the first via.
摘要翻译： 这里公开了半导体封装，半导体封装的制造方法和堆叠型半导体封装。 根据本发明的优选实施例的半导体封装包括：形成有第一电路层的基底基板; 形成在所述基底基板上的半导体器件; 形成在所述基底基板上并形成为封闭所述第一电路层和所述半导体器件的成型部; 第一通孔，其形成在第一电路层上并形成以穿透模制部件; 以及形成在所述模制部件的上表面上并与所述第一通孔一体形成的第二电路层。
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10.发明申请公开(公告)号：US20140113392A1
公开(公告)日：2014-04-24
申请号：US14145514
申请日：2013-12-31
发明人： Ji Hyun PARK , Seog Moon CHOI , Tae Hoon KIM , Sang Hyun SHIN , Tae Hyun KIM
CPC分类号： H01L33/56 , H01L24/45 , H01L25/0753 , H01L33/505 , H01L33/54 , H01L33/58 , H01L33/62 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/8592 , H01L2924/12041 , H01L2924/181 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： Disclosed herein is a method of manufacturing a package substrate for optical elements. The method includes the steps of providing a conductive substrate including an insulation layer formed thereon, and forming a circuit layer and electrode pads on the conductive substrate using a plating process. The method further includes selectively plating the circuit layer, in which the optical element is to be mounted, with a conductor to such a thickness that the optical element is buried, forming a cavity space including a lower part and a side wall in the circuit layer, and mounting an optical element in the cavity space and then applying a fluorescent resin layer thereon.
摘要翻译： 本文公开了一种制造用于光学元件的封装衬底的方法。 该方法包括以下步骤：提供包括形成在其上的绝缘层的导电基板，以及使用电镀工艺在导电基板上形成电路层和电极焊盘。 该方法还包括选择性地将其中要安装光学元件的电路层与导体相隔一定厚度以使光学元件被掩埋，从而在电路层中形成包括下部和侧壁的腔空间 ，并将光学元件安装在空腔中，然后在其上施加荧光树脂层。
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