公开(公告)号：US12101880B2

公开(公告)日：2024-09-24

申请号：US17688219

申请日：2022-03-07

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Hee-Joon Chun ,  Jae Sung Sim ,  Hak Young Lee ,  Kwang Hee Kwon ,  Hee Jung Jung

IPC: H05K1/09 ,  H05K1/11 ,  H05K3/00 ,  H05K3/42

CPC classification number: H05K1/092 ,  H05K1/115 ,  H05K3/0044 ,  H05K3/422 ,  H05K3/423 ,  H05K3/429 ,  H05K2201/0391 ,  H05K2201/09563 ,  H05K2203/025

Abstract: A printed circuit board includes: a first insulating layer; a first metal layer disposed on one surface of the first insulating layer; a second metal layer disposed on the other surface facing the one surface of the first insulating layer; a via penetrating through the first insulating layer to connect the first and second metal layers to each other; and a heterogeneous metal region disposed in at least one of an area in which the via is adjacent to the first insulating layer and an area in which the via is adjacent to the first metal layer, and including a material different from that of the via, wherein the heterogeneous metal region includes at least one of nickel (Ni), silicon (Si), and titanium (Ti).

公开(公告)号：US10779409B2

公开(公告)日：2020-09-15

申请号：US16674507

申请日：2019-11-05

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Byung-Duk Na ,  Hye-Won Jung ,  Jae-Sung Sim ,  Mi-Sun Hwang ,  Hee-Joon Chun ,  Deok-Man Kang ,  Sun-A Kim

IPC: H05K1/11 ,  H05K3/40 ,  H05K1/05 ,  H05K1/03 ,  H05K1/02

Abstract: A printed circuit board including: an insulating material; a metal layer stacked on a surface of the insulating material; and a via hole passing through the metal layer and the insulating material. The metal layer decreases in thickness in a region adjacent to the via hole, and an interface between the insulating material and the metal layer includes a region that is directed toward the via hole.