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公开(公告)号：US10734790B2
公开(公告)日：2020-08-04
申请号：US15728104
申请日：2017-10-09
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Hye Hun Park , Kwang Jik Lee , Ju Hwan Yang , Jung Wook Seo , Sang Moon Lee
Abstract: A composite electronic component includes an element part and an electrostatic discharge (ESD) protection part disposed on the element part. The ESD protection part includes first and second discharge electrodes having a gap formed therebetween, a discharge layer disposed between the first and second discharge electrodes and in the gap, and a multilayer insulating layer covering the discharge layer and including at least two insulating layers having different breakdown voltage (BDV) values.
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2.发明申请公开(公告)号：US20140187679A1
公开(公告)日：2014-07-03
申请号：US13831678
申请日：2013-03-15
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Kwang Jik Lee , Joon Ho Bae , Hyun Chul Jung
IPC: H05K1/03
CPC classification number: H05K1/0373 , H05K3/4676 , H05K2201/0141 , H05K2201/0209 , H05K2201/0248
Abstract: This invention relates to a resin composition with good workability, including a liquid crystal oligomer, an epoxy resin, or a resin mixture thereof, and an inorganic filler having a nanocone shape, and to an insulating film for a printed circuit board, and a prepreg, which are manufactured using the resin composition.
Abstract translation: 本发明涉及具有良好加工性的树脂组合物，其包括液晶低聚物，环氧树脂或其树脂混合物，以及具有纳米体形状的无机填料，以及印刷电路板用绝缘膜和预浸料 ，其使用树脂组合物制造。
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3.发明申请PREPREG, METHOD FOR MANUFACTURING THE SAME, AND COPPER CLAD LAMINATE USING THE SAME 审中-公开PREPREG，其制造方法和使用它的铜层压板公开(公告)号：US20140187112A1
公开(公告)日：2014-07-03
申请号：US14140160
申请日：2013-12-24
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Sang Hyun Shin , Joon Seok Kang , Jang Bae Son , Kwang Jik Lee , Hye Sook Shin , Hyun Chul Jung
CPC classification number: H05K1/0366 , B32B5/00 , B32B15/00 , C08J5/047 , C08J5/06 , C08J5/24 , C08J2363/00 , H05K1/0203 , H05K2201/0129 , H05K2201/029 , H05K2201/068 , Y10T442/2861 , Y10T442/2926 , Y10T442/2951 , Y10T442/2992 , Y10T442/3415
Abstract: Disclosed herein are a prepreg, including: an inorganic fiber, an organic fiber, or a hybrid fiber obtained by mix-weaving the inorganic fiber and the organic fiber, coated with a thermally conductive component or impregnated with a thermally conductive component; and a cross-linkable resin for impregnating the fiber therewith, a method for manufacturing the same, and a copper clad laminate using the same, so that the prepreg and the copper clad laminate can maintain a low coefficient of thermal expansion and a high modulus of elasticity and have excellent heat radiation property.
Abstract translation: 本发明公开了一种预浸料坯，其包括无机纤维，有机纤维或混合编织无机纤维和有机纤维的复合纤维，所述无机纤维和有机纤维涂覆有导热组分或浸渍有导热组分; 以及用于浸渍纤维的可交联树脂，其制造方法和使用其的覆铜层压板，使得预浸料和覆铜层压板可以保持低的热膨胀系数和高模量 弹性好，散热性好。
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公开(公告)号：US20140174794A1
公开(公告)日：2014-06-26
申请号：US14061266
申请日：2013-10-23
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Joon Seok KANG , Kwang Jik Lee , Sang Hyun Shin , Hye Suk Shin
CPC classification number: C25D11/022 , C25D11/246 , H05K1/0203 , H05K1/053 , H05K3/445 , H05K2201/0141 , H05K2201/0145 , H05K2201/015 , H05K2201/0158 , H05K2203/0315 , H05K2203/1147
Abstract: A heat radiating substrate having strengthened insulation resistance and heat conductivity, and a manufacturing method thereof. The method for manufacturing a heat radiating substrate includes: preparing a metal substrate; performing an anodizing process on the metal substrate to form an anodic oxidation layer; filling surface pores of the anodic oxidation layer with an insulating material; and forming a metal wiring layer on the anodic oxidation layer. High insulation resistance and heat conductivity can be obtained by filling surface pores formed in an anodizing process with an insulating material.
Abstract translation: 具有增强的绝缘电阻和导热性的散热基板及其制造方法。 散热基板的制造方法包括：准备金属基板; 在金属基板上进行阳极氧化处理以形成阳极氧化层; 用绝缘材料填充阳极氧化层的表面孔; 在阳极氧化层上形成金属布线层。 通过用绝缘材料填充在阳极氧化处理中形成的表面孔，可以获得高绝缘电阻和导热性。
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5.发明申请ELECTRODE PATTERN AND METHOD OF MANUFACTURING THE SAME, PRINTED CIRCUIT BOARD USING ELECTRODE PATTERN AND METHOD OF MANUFACTURING THE SAME 审中-公开电极图案及其制造方法，使用电极图案的印刷电路板及其制造方法公开(公告)号：US20140034358A1
公开(公告)日：2014-02-06
申请号：US13956302
申请日：2013-07-31
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Kwang Jik Lee , Sang Hyun Shin , Hye Suk Shin , Joon Seok Kang
CPC classification number: H05K1/0271 , H05K1/0203 , H05K1/053 , H05K3/02 , H05K3/4644 , H05K2203/1142
Abstract: Disclosed herein are an electrode pattern and a method of manufacturing the same, and a printed circuit board applied with the electrode pattern and a method of manufacturing the same. In order to increase a heat dissipation effect, disclosed herein are an electrode pattern including electrode layers with a predetermined pattern; and insulators insulating the electrode layers from each other, in which the insulators are made of metal oxide, a method of manufacturing the same, and a printed circuit board applied with the electrode pattern and a method of manufacturing the same.
Abstract translation: 这里公开了电极图案及其制造方法，以及应用电极图案的印刷电路板及其制造方法。 为了增加散热效果，这里公开了包括具有预定图案的电极层的电极图案; 绝缘子彼此绝缘，其中绝缘体由金属氧化物制成，其制造方法和应用电极图案的印刷电路板及其制造方法。
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Patent Agency Ranking
公开(公告)号：US10568194B2
公开(公告)日：2020-02-18
申请号：US15792237
申请日：2017-10-24
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Kwang Jik Lee , Sang Moon Lee , Hye Hun Park , Ju Hwan Yang , Jung Wook Seo
Abstract: A common mode filter includes a body including a filter portion and an electrostatic protection portion, first to fourth external electrodes disposed on an external surface of the body, a ground electrode disposed on the external surface of the body, a first coil included in the filter portion and electrically connected to the first and second external electrodes, and a second coil included in the filter portion and electrically connected to the third and fourth external electrodes. The electrostatic protection portion includes discharge electrodes electrically connected to at least one of the first to fourth external electrodes and the ground electrode, a discharge part including conductive particles, a first organic-inorganic composite insulating layer disposed on the discharge electrodes and the discharge part, a magnetic cover layer disposed on the first organic-inorganic composite insulating layer, and a first inorganic insulating layer.
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7.发明申请INSULATION RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD HAVING IMPROVED THERMAL CONDUCTIVITY AND ELECTRICAL PROPERTIES, INSULATING FILM, PREPREG AND PRINTED CIRCUIT BOARD 审中-公开具有改善的导热性和电性能的印刷电路板的绝缘树脂组合物，绝缘膜，印刷电路板和印刷电路板公开(公告)号：US20140353004A1
公开(公告)日：2014-12-04
申请号：US14270131
申请日：2014-05-05
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Hyun Chul Jung , Joon Seok Kang , Jang Bae Son , Sang Hyun Shin , Kwang Jik Lee , Hye Sook Shin
CPC classification number: H05K1/0373 , C08J5/24 , C08J2363/00 , C08K3/14 , C08K3/16 , C08K3/22 , C08K3/28 , C08K3/36 , C08K3/38 , C08K2003/164 , C08K2003/221 , C08K2003/222 , C08K2003/2227 , C08K2003/282 , C08K2003/385 , C08K2201/003 , H05K3/4676 , H05K2201/0209 , H05K2201/0266 , C08L63/00
Abstract: Disclosed herein are an insulation resin composition for a printed circuit board including: an epoxy resin, a first inorganic filler having thermal conductivity of 20 W/mK or more, and a second inorganic filler having relative permittivity less than 10, and an insulating film, a prepreg, and a printed circuit board.
Abstract translation: 本发明公开了一种用于印刷电路板的绝缘树脂组合物，其包括：环氧树脂，导热率为20W / mK以上的第一无机填料和相对介电常数小于10的第二无机填料，以及绝缘膜， 预浸料和印刷电路板。
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8.发明申请RESIN COMPOSITION WITH ENHANCED HEAT-RELEASING PROPERTIES, HEAT-RELEASING FILM, INSULATING FILM, AND PREPREG 审中-公开具有增强热释放特性的树脂组合物，热释放膜，绝缘膜和预浸膜公开(公告)号：US20140187674A1
公开(公告)日：2014-07-03
申请号：US13831693
申请日：2013-03-15
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Kwang Jik Lee , Joon Seok Kang , Jang Bae Son , Sang Hyun Shin , Hye Sook Shin , Hyun Chul Jung
IPC: C09J185/02 , C09J163/00
CPC classification number: C09J185/02 , C08J5/10 , C08J5/24 , C08J2363/00 , C08J2367/02 , C08K3/042 , C08K3/20 , C08L63/00 , C08L67/02 , C09J163/00
Abstract: This invention relates to a resin composition with enhanced heat-releasing properties, including a liquid crystal oligomer, an epoxy resin, or a resin mixture thereof, and graphene oxide as a filler, and to a heat-releasing film for an electronic device, an insulating film for a printed circuit board, and a prepreg, which are manufactured using the resin composition.
Abstract translation: 本发明涉及具有提高散热性能的树脂组合物，包括液晶低聚物，环氧树脂或其树脂混合物，以及作为填料的氧化石墨烯，以及电子设备用散热膜， 用于印刷电路板的绝缘膜和使用该树脂组合物制造的预浸料。
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9.发明申请INSULATING FILM FOR PRINTED CIRCUIT BOARD HAVING IMPROVED THERMAL CONDUCTIVITY, MANUFACTURING METHOD THEREOF, AND PRINTED CIRCUIT BOARD USING THE SAME 审中-公开具有改进的导热性的印刷电路板的绝缘膜，其制造方法和使用该印刷电路板的印刷电路板公开(公告)号：US20140174792A1
公开(公告)日：2014-06-26
申请号：US13845831
申请日：2013-03-18
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Jang Bae Son , Joon Seok Kang , Sang Hyun Shin , Kwang Jik Lee , Hye Sook Shin , Hyun Chul Jung
CPC classification number: H01B3/305 , H01L2224/04105 , H01L2224/12105 , H01L2224/73267 , H05K1/185 , H05K3/4602 , H05K3/4676 , H05K2201/0141 , H05K2201/0209
Abstract: This invention relates to an insulating film for a printed circuit board having improved thermal conductivity, a manufacturing method thereof and a printed circuit board using the same, wherein the insulating film includes an amphiphilic block copolymer having a vertical structure formed in a thickness direction by chemically coupling a hydrophilic compound with a hydrophobic compound.
Abstract translation: 本发明涉及一种具有改进导热性的印刷电路板用绝缘膜及其制造方法和使用该绝缘膜的印刷电路板，其中该绝缘膜包括通过化学方法沿厚度方向形成垂直结构的两亲性嵌段共聚物 将亲水性化合物与疏水化合物偶联。
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公开(公告)号：US20180199420A1
公开(公告)日：2018-07-12
申请号：US15792237
申请日：2017-10-24
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Kwang Jik Lee , Sang Moon Lee , Hye Hun Park , Ju Hwan Yang , Jung Wook Seo
CPC classification number: H05F3/04 , H01F27/29 , H01F27/32 , H01F27/362 , H01F2017/0093 , H03H1/00 , H03H7/427 , H03H2001/0092
Abstract: A common mode filter includes a body including a filter portion and an electrostatic protection portion, first to fourth external electrodes disposed on an external surface of the body, a ground electrode disposed on the external surface of the body, a first coil included in the filter portion and electrically connected to the first and second external electrodes, and a second coil included in the filter portion and electrically connected to the third and fourth external electrodes. The electrostatic protection portion includes discharge electrodes electrically connected to at least one of the first to fourth external electrodes and the ground electrode, a discharge part including conductive particles, a first organic-inorganic composite insulating layer disposed on the discharge electrodes and the discharge part, a magnetic cover layer disposed on the first organic-inorganic composite insulating layer, and a first inorganic insulating layer.
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