公开(公告)号：US20140131081A1

公开(公告)日：2014-05-15

申请号：US13827656

申请日：2013-03-14

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Hye Jin Cho ,  Se Kyung Lee ,  Bae Soon Son ,  Suk Jin Ham

IPC: H05K3/20

CPC classification number: H05K3/284 ,  H01L21/563 ,  H01L2224/16225 ,  H05K3/3436 ,  H05K2201/0129 ,  H05K2201/0145 ,  H05K2201/09909 ,  H05K2201/10977 ,  H05K2203/013 ,  H05K2203/0514 ,  H05K2203/0545

Abstract: Disclosed herein is a printed circuit board, including: a base substrate on which a connection pad is formed; a dam spaced apart from one side of the connection pad; and a protective layer formed to surround the dam.

Abstract translation: 本文公开了一种印刷电路板，包括：基底，其上形成有连接垫; 与连接垫的一侧隔开的坝; 以及形成为围绕坝的保护层。