公开(公告)号：US12010794B2

公开(公告)日：2024-06-11

申请号：US17709492

申请日：2022-03-31

申请人： IBIDEN CO., LTD.

发明人： Satoru Kawai

IPC分类号： H05K1/11 ,  H05K3/40

CPC分类号： H05K1/11 ,  H05K3/4007 ,  H05K2201/0341 ,  H05K2201/0367 ,  H05K2203/043

摘要： A printed wiring board includes a base insulating layer, a conductor layer formed on the base insulating layer and including conductor pads, a solder resist layer formed on the base insulating layer such that the solder resist layer is covering the conductor layer and having openings exposing the conductor pads, respectively, and plating bumps formed on the conductor pads such that each of the plating bumps includes a base plating layer formed in a respective one of the openings of the solder resist layer, and a top plating layer formed on the base plating layer. The plating bumps are formed such that the base plating layer has an upper surface and a side surface including a portion protruding from the solder resist layer and having a rough surface and that the top plating layer has a hemispherical shape and is covering only the upper surface of the base plating layer.

公开(公告)号：US20180160528A1

公开(公告)日：2018-06-07

申请号：US15578484

申请日：2015-10-30

申请人： MEIKO ELECTRONICS CO., LTD.

发明人： Shigeru MICHIWAKI

IPC分类号： H05K1/02 ,  H05K1/03 ,  H05K1/09 ,  H05K3/14 ,  H05K3/00

CPC分类号： H05K1/0284 ,  H05K1/0326 ,  H05K1/09 ,  H05K3/0014 ,  H05K3/0023 ,  H05K3/14 ,  H05K3/181 ,  H05K3/389 ,  H05K3/426 ,  H05K2201/0129 ,  H05K2201/0338 ,  H05K2201/0341 ,  H05K2201/0347 ,  H05K2201/09118 ,  H05K2203/072 ,  H05K2203/124 ,  H05K2203/1461

摘要： A three-dimensional wiring board production method is provided that includes: a preparation step of preparing a resin film having a breaking elongation of 50% or more; a first metal film formation step of forming a first metal film on a surface of the resin film; a pattern formation step of performing patterning on the first metal film to form a desired pattern; a three-dimensional molding step of performing three-dimensional molding by heating and pressurizing the resin film; and a second metal film formation step of forming a second metal film on the first metal film having a pattern formed thereon. In the first metal film formation step, metal is deposited in a particle state to form the first metal film in a porous state.

公开(公告)号：US09883586B2

公开(公告)日：2018-01-30

申请号：US14808275

申请日：2015-07-24

申请人： TOPPAN PRINTING CO. LTD. ,  NATIONAL UNIVERSITY CORPORATION GUNMA UNIVERSITY

发明人： Tetsuyuki Tsuchida ,  Toshikazu Okubo ,  Ikuo Shohji ,  Akihiro Hirata

IPC分类号： H05K1/09 ,  H05K3/10 ,  B23K1/19 ,  B23K1/00 ,  C25D7/00 ,  B23K35/26 ,  C22C13/02 ,  H05K3/24 ,  B23K1/008

CPC分类号： H05K1/09 ,  B23K1/0008 ,  B23K1/0016 ,  B23K1/008 ,  B23K1/19 ,  B23K35/262 ,  C22C13/02 ,  C25D7/00 ,  H01L2924/0002 ,  H05K3/10 ,  H05K3/244 ,  H05K2201/0341 ,  H05K2203/043 ,  H01L2924/00

摘要： There is provided a wiring substrate including an electrode including Cu or a Cu alloy, a plating film having a film including at least Pd, formed on the electrode, and a solder which is bonded onto the plating film by heating, has a melting point of lower than 140° C., and includes Pd dissolved therein, a Pd concentrated layer being absent between the solder and the electrode.

公开(公告)号：US09679869B2

公开(公告)日：2017-06-13

申请号：US13464775

申请日：2012-05-04

申请人： Sandra Louise Petty-Weeks ,  Guohao Zhang ,  Hardik Bhupendra Modi

发明人： Sandra Louise Petty-Weeks ,  Guohao Zhang ,  Hardik Bhupendra Modi

IPC分类号： H01P3/08 ,  H01Q1/00 ,  H01L23/00 ,  H01L23/66 ,  H05K1/02 ,  H05K3/24

CPC分类号： H01L24/85 ,  H01L23/66 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2223/6611 ,  H01L2223/6655 ,  H01L2223/6677 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48159 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/48644 ,  H01L2224/48844 ,  H01L2224/73265 ,  H01L2224/85444 ,  H01L2924/00011 ,  H01L2924/00012 ,  H01L2924/01015 ,  H01L2924/01047 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13051 ,  H01L2924/1421 ,  H01L2924/1423 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19105 ,  H01L2924/3011 ,  H05K1/0243 ,  H05K3/244 ,  H05K2201/0341 ,  H01L2924/00014 ,  H01L2924/00

摘要： This disclosure relates to a transmission line for high performance radio frequency (RF) applications. One such transmission line can include a bonding layer configured to receive an RF signal, a barrier layer, a diffusion barrier layer, and a conductive layer proximate to the diffusion barrier layer. The diffusion barrier layer can have a thickness that allows a received RF signal to penetrate the diffusion barrier layer to the conductive layer. In certain implementations, the diffusion barrier layer can be nickel. In some of these implementations, the transmission line can include a gold bonding layer, a palladium barrier layer, and a nickel diffusion barrier layer.

公开(公告)号：US20150334828A1

公开(公告)日：2015-11-19

申请号：US14808275

申请日：2015-07-24

申请人： TOPPAN PRINTING CO. LTD. ,  NATIONAL UNIVERSITY CORPORATION GUNMA UNIVERSITY

发明人： Tetsuyuki TSUCHIDA ,  Toshikazu OKUBO ,  lkuo SHOHJI ,  Akihiro HIRATA

IPC分类号： H05K1/09 ,  H05K3/24 ,  C22C13/02 ,  B23K1/00 ,  C25D7/00 ,  B23K35/26 ,  H05K3/10 ,  B23K1/19

CPC分类号： H05K1/09 ,  B23K1/0008 ,  B23K1/0016 ,  B23K1/008 ,  B23K1/19 ,  B23K35/262 ,  C22C13/02 ,  C25D7/00 ,  H01L2924/0002 ,  H05K3/10 ,  H05K3/244 ,  H05K2201/0341 ,  H05K2203/043 ,  H01L2924/00

摘要： There is provided a wiring substrate including an electrode including Cu or a Cu alloy, a plating film having a film including at least Pd, formed on the electrode, and a solder which is bonded onto the plating film by heating, has a melting point of lower than 140° C., and includes Pd dissolved therein, a Pd concentrated layer being absent between the solder and the electrode.

摘要翻译： 提供一种布线基板，其包括包含Cu或Cu合金的电极，形成在电极上的至少包含Pd的镀膜和通过加热结合到镀膜上的焊料，其熔点为 低于140℃，并且包括溶解在其中的Pd，焊料和电极之间不存在Pd浓缩层。

公开(公告)号：US20140069705A1

公开(公告)日：2014-03-13

申请号：US13997464

申请日：2011-12-23

申请人： Sang Myung Lee ,  Sung Woon Yoon ,  Hyuk Soo Lee ,  Sung Won Lee ,  Ki Do Chun

发明人： Sang Myung Lee ,  Sung Woon Yoon ,  Hyuk Soo Lee ,  Sung Won Lee ,  Ki Do Chun

IPC分类号： H05K1/02 ,  H05K3/38 ,  H05K3/42 ,  H05K3/06

CPC分类号： H05K1/0298 ,  H05K3/064 ,  H05K3/388 ,  H05K3/428 ,  H05K3/4647 ,  H05K3/4652 ,  H05K3/4682 ,  H05K2201/0341 ,  H05K2203/0376

摘要： Disclosed are a printed circuit board and a method for manufacturing the same. The printed circuit board includes a core insulating layer, at least one via formed through the core insulating layer, an inner circuit layer buried in the core insulating layer, and an outer circuit layer on a top surface or a bottom surface of the core insulating layer, wherein the via includes a first part, a second part below the first part, a third part between the first and second parts, and at least one barrier layer including a metal different from a metal of the first to third parts. The inner circuit layer and the via are simultaneously formed so that the process steps are reduced. Since odd circuit layers are provided, the printed circuit board has a light and slim structure.

摘要翻译： 公开了一种印刷电路板及其制造方法。 印刷电路板包括芯绝缘层，至少一个通过芯绝缘层形成的通孔，埋在芯绝缘层中的内电路层，以及在芯绝缘层的顶表面或底表面上的外电路层 ，其中所述通孔包括第一部分，在所述第一部分下方的第二部分，所述第一部分和所述第二部分之间的第三部分以及包含不同于所述第一至第三部分的金属的金属的至少一个阻挡层。 同时形成内部电路层和通孔，从而减少工艺步骤。 由于设置了奇数电路层，所以印刷电路板具有轻薄的结构。

公开(公告)号：US20140027161A1

公开(公告)日：2014-01-30

申请号：US13677076

申请日：2012-11-14

申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.

发明人： Kiwon Lee

IPC分类号： H05K1/09 ,  H05K1/02

CPC分类号： H05K1/09 ,  B82Y30/00 ,  H05K1/0213 ,  H05K1/118 ,  H05K3/20 ,  H05K3/4007 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/0314 ,  H05K2201/0317 ,  H05K2201/0323 ,  H05K2201/0341 ,  H05K2203/1157

摘要： Disclosed herein is a printed circuit board including: a substrate; one or more elastic electrode formed on the substrate and made of an elastic material; and one or more metal electrode formed on the elastic electrode.

摘要翻译： 本文公开了一种印刷电路板，包括：基板; 形成在基板上并由弹性材料制成的一个或多个弹性电极; 以及形成在弹性电极上的一个或多个金属电极。

公开(公告)号：US20130213692A1

公开(公告)日：2013-08-22

申请号：US13544994

申请日：2012-07-10

申请人： Chen-Yueh Kung

发明人： Chen-Yueh Kung

IPC分类号： H05K3/00 ,  H05K1/03

CPC分类号： H05K3/4007 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/13101 ,  H01L2224/16225 ,  H01L2224/81193 ,  H01L2924/12042 ,  H05K1/111 ,  H05K3/108 ,  H05K3/28 ,  H05K3/3452 ,  H05K2201/0341 ,  H05K2201/099 ,  H05K2203/0588 ,  H05K2203/1383 ,  Y02P70/611 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/00

摘要： A method of fabricating a circuit board includes the following steps. A first and a second patterned conductive layer are plated on the first and the second surface of a core substrate, respectively. A first and a second extending pad are individually plated on a first and a second pad of the first and the second patterned conductive layer, respectively. A first and a second thermal-curing type dielectric layer are individually formed on the first and the second surface to cover the first and the second patterned conductive layer and the first and the second extending pad, respectively. A portion of the first and the second thermal-curing type dielectric layer respectively covering the top of the first and the second extending pad are removed. A protective film covers the second extending pad. The extending pad is removed by an etching process.

摘要翻译： 制造电路板的方法包括以下步骤。 第一和第二图案化导电层分别电镀在芯基板的第一和第二表面上。 第一和第二延伸焊盘分别电镀在第一和第二图案化导电层的第一和第二焊盘上。 第一和第二热固化型电介质层分别形成在第一和第二表面上以分别覆盖第一和第二图案化导电层以及第一和第二延伸焊盘。 分别覆盖第一和第二延伸垫的顶部的第一和第二热固化型电介质层的一部分被去除。 保护膜覆盖第二延伸垫。 通过蚀刻工艺去除延伸垫。

公开(公告)号：US08436470B2

公开(公告)日：2013-05-07

申请号：US12941894

申请日：2010-11-08

申请人： Daewoong Suh ,  Stephen E. Lehman ,  Mukul Renavikar

发明人： Daewoong Suh ,  Stephen E. Lehman ,  Mukul Renavikar

IPC分类号： H01L29/72

CPC分类号： H05K3/3484 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05568 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05669 ,  H01L2224/11 ,  H01L2224/11822 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/13147 ,  H01L2224/136 ,  H01L2224/81011 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1433 ,  H05K3/244 ,  H05K3/3436 ,  H05K2201/0215 ,  H05K2201/0341 ,  H05K2203/0435 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00014

摘要： A microelectronic assembly and method for fabricating the same are described. In an example, a microelectronic assembly includes a microelectronic device having a surface with one or more areas to receive one or more solder balls, the one or more areas having a surface finish comprising Ni. A solder material comprising Cu, such as flux or paste, is applied to the Ni surface finish and one or more solder balls are coupled to the microelectronic device by a reflow process that forms a solder joint between the one or more solder balls, the solder material comprising Cu, and the one or more areas having a surface finish comprising Ni.

摘要翻译： 描述了一种微电子组件及其制造方法。 在一个示例中，微电子组件包括具有一个或多个区域以接收一个或多个焊球的表面的微电子器件，所述一个或多个区域具有包括Ni的表面光洁度。 将包含Cu的焊料材料（例如焊剂或糊料）施加到Ni表面光洁度上，并且一个或多个焊球通过在一个或多个焊球之间形成焊料接头的回流工艺耦合到微电子器件，焊料 包含Cu的材料，并且所述一个或多个区域具有包括Ni的表面光洁度。

公开(公告)号：US20120198692A1

公开(公告)日：2012-08-09

申请号：US13453074

申请日：2012-04-23

申请人： Charles L. Arvin ,  Hai P. Longworth ,  David J. Russell ,  Krystyna W. Semkow

发明人： Charles L. Arvin ,  Hai P. Longworth ,  David J. Russell ,  Krystyna W. Semkow

IPC分类号： H05K3/00

CPC分类号： H01L23/49811 ,  H01L23/49827 ,  H01L2924/0002 ,  H05K3/108 ,  H05K3/24 ,  H05K3/243 ,  H05K3/421 ,  H05K3/4644 ,  H05K2201/0341 ,  H05K2201/0769 ,  H05K2201/09481 ,  H05K2201/09563 ,  H01L2924/00

摘要： An electroless Cu layer is formed on each side of a packaging substrate containing a core, at least one front metal interconnect layer, and at least one backside metal interconnect layer. A photoresist is applied on both electroless Cu layers and lithographically patterned. First electrolytic Cu portions are formed on exposed surfaces of the electroless Cu layers, followed by formation of electrolytic Ni portions and second electrolytic Cu portions. The electrolytic Ni portions provide enhanced resistance to electromigration, while the second electrolytic Cu portions provide an adhesion layer for a solder mask and serves as an oxidation protection layer. Some of the first electrolytic Cu may be masked by lithographic means to block formation of electrolytic Ni portions and second electrolytic Cu portions thereupon as needed. Optionally, the electrolytic Ni portions may be formed directly on electroless Cu layers.

摘要翻译： 在包含芯，至少一个前金属互连层和至少一个背侧金属互连层的封装基板的每一侧上形成化学镀铜层。 在两个无电镀铜层上涂布光致抗蚀剂，并用光刻图案化。 第一电解Cu部分形成在无电解Cu层的暴露表面上，随后形成电解Ni部分和第二电解Cu部分。 电解Ni部分提供增强的电迁移阻力，而第二电解Cu部分提供用于焊接掩模的粘附层并且用作氧化保护层。 一些第一电解铜可以被光刻装置掩盖，以根据需要阻挡电解Ni部分和第二电解Cu部分的形成。 任选地，电解Ni部分可以直接形成在无电镀Cu层上。