公开(公告)号：US20140090245A1

公开(公告)日：2014-04-03

申请号：US14099714

申请日：2013-12-06

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Mi Sun HWANG ,  Myung Sam KANG ,  Ok Tae KIM ,  Seon Ha Kang ,  Gil Yong SHIN ,  Kil Yong YUN ,  Min Jung CHO

IPC: H05K3/46

CPC classification number: H05K3/4685 ,  H05K3/0097 ,  H05K3/205 ,  H05K3/421 ,  H05K2201/0376 ,  H05K2203/0152 ,  H05K2203/1536 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: In accordance with various embodiments, there is provided a method of manufacturing a printed circuit board, the method including the steps of preparing a first carrier including a first pattern formed on one side thereof, preparing a second carrier including a first solder resist layer and a second pattern sequentially formed on one side thereof, pressing the first carrier and the second carrier such that the first pattern is embedded in one side of an insulation layer and the second pattern is embedded in the other side of the insulation layer and then removing the first carrier and the second carrier to fabricate two substrates, attaching the two substrates to each other using an adhesion layer such that the first solder resist layers face each other, and forming a via for connecting the first pattern with the second pattern in the insulation layer, forming a second solder resist on the insulation layer provided with the first pattern, and then removing the adhesion layer.

Abstract translation: 根据各种实施例，提供一种制造印刷电路板的方法，所述方法包括以下步骤：制备包括在其一侧上形成的第一图案的第一载体，制备第二载体，所述第二载体包括第一阻焊层和 第二图案顺序地形成在其一侧上，按压第一载体和第二载体，使得第一图案嵌入绝缘层的一侧，并且第二图案嵌入绝缘层的另一侧，然后移除第一图案 载体和第二载体以制造两个基板，使用粘合层将两个基板彼此附接，使得第一阻焊层彼此面对，并且形成用于将绝缘层中的第一图案与第二图案连接的通孔， 在设置有第一图案的绝缘层上形成第二阻焊剂，然后除去粘合层。

公开(公告)号：US20140060896A1

公开(公告)日：2014-03-06

申请号：US13827429

申请日：2013-03-14

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Gil Yong SHIN ,  Seung Lak Kim ,  Kyoung Ro Yoon

IPC: H05K1/02

CPC classification number: H05K1/0201 ,  H05K1/09 ,  H05K3/0035 ,  H05K3/4644 ,  H05K2201/0338 ,  H05K2201/0341

Abstract: Disclosed herein is a printed circuit board, including: an insulating layer; a circuit layer formed on one surface of the insulating layer; and a via electrode penetrating through the insulating layer and being connected with the circuit layer, wherein the circuit layer is formed in a structure where different kinds of metal layers having different thermal conductivities are laminated.

Abstract translation: 这里公开了一种印刷电路板，包括：绝缘层; 形成在所述绝缘层的一个表面上的电路层; 以及穿过所述绝缘层并与所述电路层连接的通孔电极，其中所述电路层形成为层叠不同导热系数的不同种类的金属层的结构。