公开(公告)号：US20170086292A1

公开(公告)日：2017-03-23

申请号：US15202037

申请日：2016-07-05

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Eun-Sil KIM ,  Keun-Yong LEE ,  Seong-Hyun YOO ,  Sang-Hyun SHIN ,  Jin-Ho HONG

IPC: H05K1/03 ,  B32B27/06 ,  B32B37/10 ,  B32B37/06 ,  H05K3/00 ,  B32B37/14

CPC classification number: B32B27/06 ,  B32B5/024 ,  B32B7/02 ,  B32B15/08 ,  B32B15/20 ,  B32B27/12 ,  B32B27/20 ,  B32B37/06 ,  B32B37/10 ,  B32B37/144 ,  B32B38/10 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2305/18 ,  B32B2305/77 ,  B32B2307/734 ,  B32B2457/08 ,  H05K1/0366 ,  H05K1/0373 ,  H05K3/022 ,  H05K2201/0187 ,  H05K2201/0195

Abstract: A prepreg includes a core layer, a first resin layer including a first resin material and laminated on a first side of the core layer, the first resin material impregnating a portion of the core layer, and a second resin layer including a second resin material and laminated on a second side of the core layer, the second resin material impregnating a portion of the core layer so as to form a non-linear joint interface with the first resin material.

公开(公告)号：US20160237303A1

公开(公告)日：2016-08-18

申请号：US14951045

申请日：2015-11-24

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Geum-Hee YUN ,  Dae-Hui JO ,  Seong-Hyun YOO ,  Keung-Jin SOHN ,  Jin-Young KIM

IPC: C09D163/00 ,  C09D179/08 ,  H05K1/03

CPC classification number: H05K1/0353 ,  C08G73/0655 ,  C09D179/085 ,  C08K5/17 ,  C08L63/00 ,  C08L79/04

Abstract: A resin composition for a printed circuit includes a first resin having a polycyclic group; a second resin having an imide group conjugated to at least one cyclic group; and a hardening accelerator having two or more functional groups, wherein the resin composition does not include a hardening agent.

Abstract translation: 一种用于印刷电路的树脂组合物包括具有多环基团的第一树脂; 具有与至少一个环状基团结合的酰亚胺基团的第二树脂; 以及具有两个以上官能团的硬化促进剂，其中所述树脂组合物不包含硬化剂。