公开(公告)号：US20170086292A1

公开(公告)日：2017-03-23

申请号：US15202037

申请日：2016-07-05

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Eun-Sil KIM ,  Keun-Yong LEE ,  Seong-Hyun YOO ,  Sang-Hyun SHIN ,  Jin-Ho HONG

IPC: H05K1/03 ,  B32B27/06 ,  B32B37/10 ,  B32B37/06 ,  H05K3/00 ,  B32B37/14

CPC classification number: B32B27/06 ,  B32B5/024 ,  B32B7/02 ,  B32B15/08 ,  B32B15/20 ,  B32B27/12 ,  B32B27/20 ,  B32B37/06 ,  B32B37/10 ,  B32B37/144 ,  B32B38/10 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2305/18 ,  B32B2305/77 ,  B32B2307/734 ,  B32B2457/08 ,  H05K1/0366 ,  H05K1/0373 ,  H05K3/022 ,  H05K2201/0187 ,  H05K2201/0195

Abstract: A prepreg includes a core layer, a first resin layer including a first resin material and laminated on a first side of the core layer, the first resin material impregnating a portion of the core layer, and a second resin layer including a second resin material and laminated on a second side of the core layer, the second resin material impregnating a portion of the core layer so as to form a non-linear joint interface with the first resin material.

公开(公告)号：US20170086290A1

公开(公告)日：2017-03-23

申请号：US15099212

申请日：2016-04-14

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Keun-Yong LEE ,  Jun-Young KIM ,  Sa-Yong LEE ,  Sang-Hyun SHIN

IPC: H05K1/02 ,  H05K3/00 ,  H05K3/46 ,  H05K1/09 ,  H05K1/03

CPC classification number: H05K1/0366 ,  H05K2201/0248 ,  H05K2201/0251 ,  H05K2201/026

Abstract: A prepreg, a printed circuit board and a method of manufacturing the same are provided. A prepreg includes a core layer including nanofibers having a thickness in a range of 10 to 100 nm, a first insulating layer on a first surface of the core layer, and a second insulating layer on a second surface of the core layer.

公开(公告)号：US20160135294A1

公开(公告)日：2016-05-12

申请号：US14932700

申请日：2015-11-04

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Eun-Sil KIM ,  Sang-Hyun SHIN

IPC: H05K1/03 ,  H05K3/00 ,  H05K1/02

CPC classification number: H05K1/0366 ,  H05K1/036 ,  H05K1/0373 ,  H05K2201/0191 ,  H05K2201/0209 ,  H05K2201/068

Abstract: A prepreg includes: a core material having a first resin material impregnated therein; and second resin materials laminated above and below the core material and including a non-linear joint interface formed with the first resin material.

Abstract translation: 预浸料包括：浸渍有第一树脂材料的芯材; 以及层叠在芯材上方和下方的第二树脂材料，并且包括与第一树脂材料形成的非线性接合界面。