公开(公告)号：US12224305B2

公开(公告)日：2025-02-11

申请号：US17162590

申请日：2021-01-29

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jihye Yeon ,  Hankyu Seong ,  Sunghyun Sim ,  Junbu Youn

IPC: H10K59/122 ,  H01L27/15 ,  H01L33/38 ,  H01L33/50 ,  H01L33/60 ,  H01L33/62 ,  H10K59/35

Abstract: A display device includes a circuit substrate including a driving circuit; an LED cell array disposed on the circuit substrate, and including a plurality of LED modules, each of the plurality of LED modules including at least two LED cells, from among a plurality of LED cells of the LED cell array, and an insulator coupling the at least two LED cells to each other; a gap-fill layer filling a gap between the plurality of LED modules; a partition disposed on the LED cell array, and defining a plurality of light emitting windows disposed in regions corresponding to the plurality of LED cells, respectively; and at least one color conversion layer disposed in at least a portion of the plurality of light emitting windows.

公开(公告)号：US20210366981A1

公开(公告)日：2021-11-25

申请号：US17162590

申请日：2021-01-29

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jihye Yeon ,  Hankyu Seong ,  Sunghyun Sim ,  Junbu Youn

IPC: H01L27/15 ,  H01L33/38 ,  H01L33/60 ,  H01L33/62 ,  H01L33/50

Abstract: A display device includes a circuit substrate including a driving circuit; an LED cell array disposed on the circuit substrate, and including a plurality of LED modules, each of the plurality of LED modules including at least two LED cells, from among a plurality of LED cells of the LED cell array, and an insulator coupling the at least two LED cells to each other; a gap-fill layer filling a gap between the plurality of LED modules; a partition disposed on the LED cell array, and defining a plurality of light emitting windows disposed in regions corresponding to the plurality of LED cells, respectively; and at least one color conversion layer disposed in at least a portion of the plurality of light emitting windows.

公开(公告)号：US20240021751A1

公开(公告)日：2024-01-18

申请号：US18222296

申请日：2023-07-14

Applicant: SAMSUNG ELECTRONICS CO,. LTD.

Inventor： Jihye Yeon ,  Hankyu Seong ,  Sunghyun Sim ,  Donggun Lee ,  Youngjin Choi

IPC: H01L33/00 ,  H01L33/06 ,  H01L33/08

CPC classification number: H01L33/0093 ,  H01L33/06 ,  H01L33/08 ,  H01L33/325

Abstract: A method of manufacturing an LED module includes forming a first conductivity-type semiconductor base layer on a growth substrate; forming a mask pattern having first to third openings on the first conductivity-type semiconductor base layer, wherein the mask pattern the first to the third openings having different widths and arranged with a same pitch; simultaneously forming first to third light emitting laminates in the first to third openings, respectively; removing the mask pattern from the first conductivity-type semiconductor base layer; and removing an edge region of each of the first to third light emitting laminates, wherein first to third light emitting laminates include a first to third active layers configured to emit light of different wavelengths, respectively.

公开(公告)号：US11380818B2

公开(公告)日：2022-07-05

申请号：US15932000

申请日：2020-05-14

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jongin Yang ,  Hankyu Seong ,  Sunghyun Sim ,  Jihye Yeon ,  Hanul Yoo ,  Jihoon Yun

IPC: H01L33/24 ,  H01L33/50 ,  H01L33/38 ,  H01L33/44 ,  H01L33/62 ,  H01L27/15 ,  H01L33/00

Abstract: A semiconductor light emitting device including at least one light emitting structure on a substrate, the at least one light emitting structure including a first semiconductor pattern, an active pattern, and a second semiconductor pattern sequentially stacked in a vertical direction substantially perpendicular to an upper surface of the substrate; a first electrode contacting a substrate-facing surface of the first semiconductor pattern; and a second electrode at least partially surrounding and contacting a sidewall of the second semiconductor pattern.