公开(公告)号：US20150102505A1

公开(公告)日：2015-04-16

申请号：US14326631

申请日：2014-07-09

Applicant: SAMSUNG ELECTRONICS CO., LTD

Inventor： HYUNSOO CHUNG ,  SEUNGDUK BAEK ,  IN-YOUNG LEE ,  TAE-JE CHO

IPC: H01L25/00 ,  H01L23/48 ,  H01L21/56 ,  H01L25/065 ,  H01L23/00

CPC classification number: H01L25/50 ,  H01L21/563 ,  H01L23/295 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/481 ,  H01L24/05 ,  H01L24/06 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/06181 ,  H01L2224/131 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81005 ,  H01L2224/81815 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/92125 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/81 ,  H01L2924/014 ,  H01L2224/83 ,  H01L2924/00

Abstract: A semiconductor package and a method of fabricating the same. The method may include mounting a lower stack including a plurality of lower semiconductor chips on a substrate and mounting an upper stack including a plurality of upper semiconductor chips on the lower stack. According to example embodiments of the inventive concept, the semiconductor package can be easily fabricated.

Abstract translation: 一种半导体封装及其制造方法。 该方法可以包括将包括多个下半导体芯片的下堆叠安装在基板上，并且在下堆叠上安装包括多个上半导体芯片的上堆叠。 根据本发明构思的示例实施例，可以容易地制造半导体封装。