公开(公告)号：US09887332B2

公开(公告)日：2018-02-06

申请号：US15056117

申请日：2016-02-29

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Pun Jae Choi ,  Geun Woo Ko ,  Yong Min Kwon ,  Ah Young Woo ,  Jun Ho Lee ,  Jin Wook Chung

IPC: H01L33/62 ,  H01L25/16 ,  H01L25/075 ,  H01L33/48 ,  H01L33/56 ,  H01L33/60

CPC classification number: H01L33/62 ,  H01L25/0753 ,  H01L25/167 ,  H01L33/486 ,  H01L33/56 ,  H01L33/60

Abstract: A semiconductor light-emitting device package includes: a light-emitting structure having a first surface, a second surface opposite to the first surface and side surfaces disposed between the first and the second surfaces, the light-emitting structure comprising a first light-emitting laminate and a second light-emitting laminate, each of the first and the second light emitting laminates including: a first conductivity-type semiconductor layer; an active layer, and a second conductivity-type semiconductor layer, an interconnector provided on the second surface of the light-emitting structure and configured to electrically connect the first and the second light-emitting laminates; a metal guide surrounding the side surfaces of the light-emitting structure; and an encapsulant surrounding the metal guide and the second and the side surfaces of the light-emitting structure and exposing the first surface of the light-emitting structure.