Abstract:
A position measurement device includes a light source, a reflector coupled to a test object, a light detector between the light source and reflector, and a controller to measure a position of the test object based on an interference pattern generated by a reference beam and a measurement beam output from the light detector. The controller also controls a temperature of the light detector by generating signals for a heat exchanger having a Peltier region coupled to the light detector. The signals including a first signal to cause the heat exchanger to remove heat from the light receiver and a second signal to cause the heat exchanger to apply heat to the light receiver.
Abstract:
According to example embodiments, an optical measurement apparatus may include: a station configured to support a measurement target; an image acquisition unit configured to acquire a one-dimensional (1D) line image of the measurement target; a driver configured to move the station and the image acquisition unit; and a controller. The controller may be configured to control the driver and the image acquisition unit to acquire a plurality of 1D line images of the measurement target while varying a distance between the image acquisition unit and the measurement target to generate a two-dimensional (2D) scan image from combining the plurality of 1D line images; and to detect a pattern of the measurement target based on comparing a plurality of 2D reference images and the 2D scan image. The optical measurement apparatus may measure critical dimensions of non-repeating ultrafine patterns at high speed.
Abstract:
A system on chip and method for operating a system on chip are provided. A system on chip includes a shared memory configured to store image data and a processor configured to: generate a first correction value by performing first image processing for a first pixel value of a first pixel of the image data received from the shared memory, generate a second correction value by performing second image processing, which is different from the first image processing, for the first pixel value of the image data received from the shared memory, generate a third correction value by performing third image processing, which is different from the first image processing and the second image processing, for the first pixel value of the image data received from the shared memory, and output a first pixel correction value that is changed from the first pixel value by comparing the first to third correction values with the first pixel value and selecting one of the first to third correction values.
Abstract:
A defective pixel correction device is provided. The defective pixel correction device includes: a pixel grading circuit configured to output a grade map including a plurality of grades indicating defect levels and respectively corresponding to a plurality of pixels included in an input image; a pixel selection circuit configured to select one or more candidate pixels from among the plurality of pixels, based on whether the plurality of grades correspond to a correction level, in the grade map; and a correction circuit configured to correct the one or more candidate pixels.
Abstract:
An image sensing device including an image sensor configured to output a raw image by capturing an image of a subject and an image signal processor configured to perform a bad pixel correction process on the raw image on an image patch-by-image patch unit, compare pixels of an image patch of the raw image with a local saturation threshold value, determine a state of local saturation of the image patch based on a number of saturated pixels whose pixel values exceed the local saturation threshold value, and output a corrected image patch, which is obtained by correcting a pixel of the image patch with a corrected pixel value, with a replacement pixel value, or with a raw pixel value depending on the state of local saturation of the image patch.
Abstract:
An inspection apparatus for a semiconductor process and a semiconductor process device, the inspection apparatus including a transferer configured to transfer a process object between a plurality of chambers; at least one line camera installed above the transferer, the at least one line camera being configured to generate an original image by capturing an image of the process object transferred by the transferer; and a controller configured to receive the original image and to perform an inspection of the process object by correcting distortion of the original image due to a change in transfer speed of the transferer.
Abstract:
An autofocus control apparatus includes a beam splitter, a condenser lens and a detector. The beam splitter directs light beams from a light source toward a sample and passes light beams reflected from the sample to the condenser lens. The condenser lens condenses the light beams, and the detector detects a focal point deviation of the sample relative to a focal point of the condenser lens. The focal point deviation is detected based on an intersection of a focal line passing through different focal points of the condenser lens and a light receiving plane configured to receive the light beams passing through the condenser lens.