公开(公告)号：US20130121060A1

公开(公告)日：2013-05-16

申请号：US13672113

申请日：2012-11-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Chang-bum LEE ,  Young-bae KIM ,  Kyung-min KIM ,  Chang-jung KIM ,  Dong-soo LEE ,  Myoung-jae LEE ,  Seung-ryul LEE ,  Man CHANG

IPC: H01L45/00 ,  G11C11/56 ,  H01L21/62 ,  H01L27/24

CPC classification number: G11C13/0007 ,  G11C11/5685 ,  G11C13/0069 ,  G11C2013/0071 ,  G11C2213/15 ,  G11C2213/32 ,  G11C2213/55 ,  G11C2213/56 ,  G11C2213/71 ,  H01L27/2409 ,  H01L27/2481 ,  H01L45/08 ,  H01L45/1233 ,  H01L45/1266 ,  H01L45/146 ,  H01L45/1625 ,  H01L45/1641 ,  H01L45/1675

Abstract: Non-volatile memory elements, memory devices including the same, and methods for operating and manufacturing the same may include a memory layer between a first electrode and a second electrode spaced apart from the first electrode. The memory layer may include a first material layer and a second material layer, and may have a resistance change characteristic due to movement of ionic species between the first material layer and the second material layer. At least the first material layer of the first and second material layers may be doped with a metal.

Abstract translation: 非易失性存储器元件，包括其的存储器件及其操作和制造方法可以包括在与第一电极间隔开的第一电极和第二电极之间的存储层。 存储层可以包括第一材料层和第二材料层，并且可以由于第一材料层和第二材料层之间的离子物质的移动而具有电阻变化特性。 至少第一和第二材料层的第一材料层可以掺杂金属。

公开(公告)号：US20190227150A1

公开(公告)日：2019-07-25

申请号：US16150724

申请日：2018-10-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dong-jae SHIN ,  Kyoung-ho HA ,  Seong-gu KIM ,  Yong-hwack SHIN ,  Chang-gyun SHIN ,  Dong-sik SHIM ,  Chang-bum LEE ,  Jung-ho CHA

IPC: G01S7/481 ,  G01S7/486 ,  G01S7/484 ,  G01S17/88 ,  G01S17/42

Abstract: The bi-directional optical integrated circuit device array includes a plurality of bi-directional optical integrated circuit unit devices integrated on a substrate and arranged in two-dimensions. Each of the bi-directional optical integrated circuit unit devices includes a single wavelength laser light source integrated on the substrate, a bi-directional optical device integrated on the substrate and optically connected to the laser light source, and an antenna integrated on the substrate and optically connected to the bi-directional optical device.