ELECTRO ACOUSTIC TRANSDUCER
    2.
    发明申请
    ELECTRO ACOUSTIC TRANSDUCER 有权
    电声传感器

    公开(公告)号:US20150230029A1

    公开(公告)日:2015-08-13

    申请号:US14317135

    申请日:2014-06-27

    Abstract: An electro-acoustic transducer includes a conductive substrate provided with at least one cell and at least one electrode, and a pad substrate disposed corresponding to the conductive substrate and provided with at least one pad corresponding to the electrode, in which at least one of the electrode and the pad includes an electric pattern for electric connection and at least one dummy pattern that is provided around the electric pattern to be separated the electric pattern.

    Abstract translation: 一种电声换能器包括设置有至少一个电池和至少一个电极的导电衬底以及与该导电衬底相对设置并且设置有至少一个对应于该电极的焊盘的焊盘衬底,其中至少一个电极 电极和焊盘包括用于电连接的电图案和设置在电图案周围以分离电图案的至少一个虚设图案。

    CAPACITIVE MICROMACHINED ULTRASONIC TRANSDUCER AND METHOD OF FABRICATING THE SAME
    3.
    发明申请
    CAPACITIVE MICROMACHINED ULTRASONIC TRANSDUCER AND METHOD OF FABRICATING THE SAME 有权
    电容式MICROMACHINED超声波传感器及其制造方法

    公开(公告)号:US20150137285A1

    公开(公告)日:2015-05-21

    申请号:US14286460

    申请日:2014-05-23

    CPC classification number: B81B7/007 B06B1/0292 B81C1/00301

    Abstract: A capacitive micromachined ultrasonic transducer and a method of fabricating the same are provided. The capacitive micromachined ultrasonic transducer includes a device substrate including a first trench defining a plurality of first portions corresponding to an element and a second trench spaced apart from the first trench; a supporting unit provided on the device substrate, the supporting unit defining a plurality of cavities; a membrane provided on the supporting unit to cover the plurality of cavities; a top electrode electrically connected to a second portion in the second trench through a via hole penetrating through the membrane and the supporting unit; and a through silicon via (TSV) substrate provided on a bottom surface of the device substrate, the TSV substrate including a first via metal connected to the plurality of first portions corresponding to the element and a second via metal connected to the second portion.

    Abstract translation: 提供了一种电容微加工超声波换能器及其制造方法。 电容微加工超声波换能器包括:器件基板,其包括限定对应于元件的多个第一部分的第一沟槽和与第一沟槽间隔开的第二沟槽; 设置在所述装置基板上的支撑单元,所述支撑单元限定多个空腔; 设置在所述支撑单元上以覆盖所述多个空腔的膜; 顶部电极,其通过穿过所述膜的通孔和所述支撑单元电连接到所述第二沟槽中的第二部分; 以及设置在器件基板的底面上的贯穿硅通孔(TSV)基板,所述TSV基板包括连接到与所述元件相对应的所述多个第一部分的第一通孔金属和连接到所述第二部分的第二通孔金属。

    MICRO OPTICAL SWITCH DEVICE, IMAGE DISPLAY APPARATUS INCLUDING THE SAME, AND METHOD OF MANUFACTURING THE MICRO OPTICAL SWITCH DEVICE
    4.
    发明申请
    MICRO OPTICAL SWITCH DEVICE, IMAGE DISPLAY APPARATUS INCLUDING THE SAME, AND METHOD OF MANUFACTURING THE MICRO OPTICAL SWITCH DEVICE 有权
    微光开关装置,包括其的图像显示装置以及制造微光开关装置的方法

    公开(公告)号:US20140133003A1

    公开(公告)日:2014-05-15

    申请号:US14078716

    申请日:2013-11-13

    CPC classification number: G02B26/023 B81B7/0016 B81B2201/045 B81B2203/0163

    Abstract: A micro optical switch device, an image display apparatus including the same, and a method of manufacturing the micro optical switch device are provided. The micro optical switch device includes a substrate; a first electrode disposed on the substrate and having a plurality of openings; a second electrode disposed above and spaced apart from the first electrode, and having a plurality of openings; and support units disposed on the substrate and configured to support the second electrode, wherein the support units include deformation preventing portions protruding beyond a top surface of the second electrode

    Abstract translation: 提供微型光开关装置,包括该微型光开关装置的图像显示装置以及制造微型光开关装置的方法。 微型光开关装置包括:基板; 第一电极,设置在所述基板上并具有多个开口; 设置在所述第一电极之上并与所述第一电极间隔开的第二电极,并且具有多个开口; 以及设置在所述基板上并被配置为支撑所述第二电极的支撑单元,其中所述支撑单元包括突出超过所述第二电极的顶表面的变形防止部分

    MICRO OPTICAL SWITCHING DEVICE, IMAGE DISPLAY APPARATUS INCLUDING MICRO OPTICAL SWITCHING DEVICE, AND METHOD OF MANUFACTURING MICRO OPTICAL SWITCHING DEVICE
    5.
    发明申请
    MICRO OPTICAL SWITCHING DEVICE, IMAGE DISPLAY APPARATUS INCLUDING MICRO OPTICAL SWITCHING DEVICE, AND METHOD OF MANUFACTURING MICRO OPTICAL SWITCHING DEVICE 有权
    微型光学切换装置,包括微型光学切换装置的图像显示装置以及制造微型光学切换装置的方法

    公开(公告)号:US20130329271A1

    公开(公告)日:2013-12-12

    申请号:US13912719

    申请日:2013-06-07

    Inventor: Dong-sik SHIM

    CPC classification number: G02B26/02

    Abstract: A micro optical switching device is provided, including a substrate, a first electrode disposed on a first surface of the substrate and including a first opening array including having a first plurality of openings, a second electrode disposed over the first electrode and including a second opening array including a plurality of second openings which do not overlap with the plurality of first openings, and a support member disposed on the substrate. The support member has a thickness greater than a distance from the first surface of the substrate to the second electrode and protrudes above the second electrode.

    Abstract translation: 提供一种微光学开关装置,包括基板,设置在基板的第一表面上的第一电极,并且包括具有第一多个开口的第一开口阵列,设置在第一电极上的第二电极,并且包括第二开口 阵列,其包括不与所述多个第一开口重叠的多个第二开口,以及设置在所述基板上的支撑构件。 支撑构件的厚度大于从衬底的第一表面到第二电极的距离,并且在第二电极上方突出。

    CAPACITIVE MICROMACHINED ULTRASONIC TRANSDUCER AND METHOD OF FABRICATING THE SAME

    公开(公告)号:US20180201501A1

    公开(公告)日:2018-07-19

    申请号:US15922972

    申请日:2018-03-16

    CPC classification number: B81B7/007 B06B1/0292 B81C1/00301

    Abstract: A capacitive micromachined ultrasonic transducer and a method of fabricating the same are provided. The capacitive micromachined ultrasonic transducer includes a device substrate including a first trench defining a plurality of first portions corresponding to an element and a second trench spaced apart from the first trench; a supporting unit provided on the device substrate, the supporting unit defining a plurality of cavities; a membrane provided on the supporting unit to cover the plurality of cavities; a top electrode electrically connected to a second portion in the second trench through a via hole penetrating through the membrane and the supporting unit; and a through silicon via (TSV) substrate provided on a bottom surface of the device substrate, the TSV substrate including a first via metal connected to the plurality of first portions corresponding to the element and a second via metal connected to the second portion.

    ELECTRO-ACOUSTIC TRANSDUCER AND METHOD OF MANUFACTURING THE SAME
    7.
    发明申请
    ELECTRO-ACOUSTIC TRANSDUCER AND METHOD OF MANUFACTURING THE SAME 有权
    电声传感器及其制造方法

    公开(公告)号:US20150163599A1

    公开(公告)日:2015-06-11

    申请号:US14287556

    申请日:2014-05-27

    CPC classification number: B06B1/0292 B81C1/00182 Y10T29/49005

    Abstract: An electro-acoustic transducer includes: a conductive substrate in which a first trench is formed, and which includes an electrode connection unit surrounded by the first trench; a membrane provided on the conductive substrate; an upper electrode provided on the membrane to contact an upper surface of the electrode connection unit; a first electrode provided on a lower surface of the conductive substrate to contact a lower surface of the electrode connection unit; and a second electrode spaced apart from the first electrode and provided to contact the lower surface of the conductive substrate.

    Abstract translation: 电声换能器包括:导电基板,其中形成有第一沟槽,并且包括由第一沟槽包围的电极连接单元; 设置在所述导电基板上的膜; 设置在所述膜上以与所述电极连接单元的上表面接触的上电极; 设置在所述导电基板的下表面上以接触所述电极连接单元的下表面的第一电极; 以及与所述第一电极间隔开并设置成与所述导电基板的下表面接触的第二电极。

    CAPACITIVE MICROMACHINED ULTRASONIC TRANSDUCER AND METHOD OF FABRICATING THE SAME
    8.
    发明申请
    CAPACITIVE MICROMACHINED ULTRASONIC TRANSDUCER AND METHOD OF FABRICATING THE SAME 有权
    电容式MICROMACHINED超声波传感器及其制造方法

    公开(公告)号:US20150156571A1

    公开(公告)日:2015-06-04

    申请号:US14280725

    申请日:2014-05-19

    Abstract: A capacitive micromachined ultrasonic transducer includes a device substrate including a first trench confining a plurality of first parts corresponding to a plurality of elements and a second trench confining a second part separated from the plurality of first parts, a supporting unit provided on the device substrate for confining a plurality of cavities corresponding to each of the plurality of elements, a membrane provided on the supporting unit to cover the plurality of cavities, an upper electrode provided on the membrane and electrically connected to the second part in the second trench through a via hole passing through the membrane and the supporting unit, and a through-silicon via (TSV) substrate provided on a lower surface of the device substrate, and including a plurality of first via metals connected to the plurality of first parts and a second via metal connected to the second part.

    Abstract translation: 一种电容微加工超声波换能器包括:器件基板,包括限定对应于多个元件的多个第一部分的第一沟槽和限制与多个第一部分分离的第二部分的第二沟槽;设置在器件基板上的支撑单元, 限制与所述多个元件中的每一个相对应的多个空腔;设置在所述支撑单元上以覆盖所述多个空腔的膜;设置在所述膜上并通过通孔电连接到所述第二沟槽中的所述第二部分的上电极 穿过膜和支撑单元,以及设置在器件衬底的下表面上的穿硅通孔(TSV)衬底,并且包括连接到多个第一部分的多个第一通孔金属和连接到多个第一通孔的第二通孔金属 到第二部分。

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