公开(公告)号：US09904639B2

公开(公告)日：2018-02-27

申请号：US14775030

申请日：2014-03-12

Applicant: SAMSUNG ELECTRONICS CO., LTD

Inventor： Chanju Park ,  Sungmin Lee

IPC: G06F13/00 ,  G06F13/40 ,  G06F1/20 ,  G06F1/32 ,  G06F9/50 ,  G06F9/455

CPC classification number: G06F13/4022 ,  G06F1/206 ,  G06F1/3287 ,  G06F9/45558 ,  G06F9/5088 ,  G06F9/5094 ,  G06F2009/4557 ,  G06F2009/45579 ,  Y02D10/151 ,  Y02D10/16 ,  Y02D10/171 ,  Y02D10/22 ,  Y02D10/32

Abstract: The present invention relates to an interconnection fabric switching apparatus capable of dynamically allocating resources according to a workload and a method therefore, and the apparatus provided with a switching connection part according to the present invention is characterized by including: at least one computing node, a switching connection part for switch-interconnecting the computing node and the input/output node; and a controller for analyzing the workload of the computing node so as to determine whether to transfer the virtual machine of a first computing node to a second computing node, wherein the control unit controls the virtual machine of the first computing node to be transferred through the switching connection part to the second computing node.

公开(公告)号：US12183977B2

公开(公告)日：2024-12-31

申请号：US18361369

申请日：2023-07-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jungi Jeong ,  Chanju Park ,  Junhwa Oh ,  Sanghyuk Wi

IPC: H01Q21/00 ,  H01Q1/22 ,  H01Q1/24 ,  H01Q21/06

Abstract: The disclosure relates to a 5th generation (5G) or 6th generation (6G) communication system for supporting a higher data transfer rate beyond 4th generation (4G) communication such as long-term evolution (LTE). An antenna module is provided. The antenna module includes a communication circuit, an antenna unit comprising multiple antenna elements constituting a subarray, and a network unit disposed beneath the antenna unit in multiple layers, the network unit comprising at least one transmission line configured to be branched to positions of the multiple antenna elements, a via hole extending through the multi-layer, and a stub structure disposed on an area adjacent to the via hole. The open stub structure designed on a first layer forming a ground plane, among the multiple layers, may include a first via pad disposed to be adjacent to the via hole, a first open stub extending from the first via pad in a first direction, and a first slot part configured to surround the first via pad and the first open stub. The short stub structure designed on a second layer different from the first layer having the open stub structure designed thereon may include a second via pad disposed to be adjacent to the via hole, a short stub extending from the second via pad in a second direction perpendicular to the first direction, a transformer extending from the second via pad in a third direction different from the second direction so as to be connected to the at least one transmission line, and a second slot part configured to surround at least a portion of an edge of the second via pad, the short stub, and the transformer.

公开(公告)号：US20210011476A1

公开(公告)日：2021-01-14

申请号：US16922655

申请日：2020-07-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Daehyun BAN ,  Yongsung Kim ,  Chanju Park ,  Chanwon Seo ,  Hongpyo Lee

IPC: G05D1/00 ,  G06T3/00 ,  G06T7/73 ,  G06K9/62 ,  G06K9/00

Abstract: An electronic apparatus is provided. The electronic apparatus includes: a sensor; a camera; a memory; and a processor configured to be connected to the sensor, the camera, and the memory. The memory includes an artificial intelligence model trained to identify at least one object. The processor is further configured to: detect an object based on sensing data received from the sensor; based on the detected object being identified as having a height less than a predetermined threshold value, warp an object region, including the detected object, in an image acquired through the camera based on distance information of the object region; and identify the detected object by inputting the warped object region into the artificial intelligence model.

公开(公告)号：US11742587B2

公开(公告)日：2023-08-29

申请号：US17581044

申请日：2022-01-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jungi Jeong ,  Chanju Park ,  Junhwa Oh ,  Sanghyuk Wi

IPC: H01Q21/06 ,  H01Q1/24 ,  H01Q21/00 ,  H01Q1/22

CPC classification number: H01Q21/0025 ,  H01Q1/2283 ,  H01Q1/243 ,  H01Q21/064

Abstract: The disclosure relates to a 5th generation (5G) or 6th generation (6G) communication system for supporting a higher data transfer rate beyond 4th generation (4G) communication such as long-term evolution (LTE). An antenna module is provided. The antenna module includes a communication circuit, an antenna unit comprising multiple antenna elements constituting a subarray, and a network unit disposed beneath the antenna unit in multiple layers, the network unit comprising at least one transmission line configured to be branched to positions of the multiple antenna elements, a via hole extending through the multi-layer, and a stub structure disposed on an area adjacent to the via hole. The open stub structure designed on a first layer forming a ground plane, among the multiple layers, may include a first via pad disposed to be adjacent to the via hole, a first open stub extending from the first via pad in a first direction, and a first slot part configured to surround the first via pad and the first open stub. The short stub structure designed on a second layer different from the first layer having the open stub structure designed thereon may include a second via pad disposed to be adjacent to the via hole, a short stub extending from the second via pad in a second direction perpendicular to the first direction, a transformer extending from the second via pad in a third direction different from the second direction so as to be connected to the at least one transmission line, and a second slot part configured to surround at least a portion of an edge of the second via pad, the short stub, and the transformer.

公开(公告)号：US11650597B2

公开(公告)日：2023-05-16

申请号：US16922655

申请日：2020-07-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Daehyun Ban ,  Yongsung Kim ,  Chanju Park ,  Chanwon Seo ,  Hongpyo Lee

IPC: G05D1/02 ,  G05D1/00 ,  G06T3/00 ,  G06T7/73 ,  G06V20/10

CPC classification number: G05D1/0246 ,  G05D1/0088 ,  G06T3/0093 ,  G06T7/74 ,  G06V20/10 ,  G05D2201/0203 ,  G06T2207/20081

Abstract: An electronic apparatus is provided. The electronic apparatus includes: a sensor; a camera; a memory; and a processor configured to be connected to the sensor, the camera, and the memory. The memory includes an artificial intelligence model trained to identify at least one object. The processor is further configured to: detect an object based on sensing data received from the sensor; based on the detected object being identified as having a height less than a predetermined threshold value, warp an object region, including the detected object, in an image acquired through the camera based on distance information of the object region; and identify the detected object by inputting the warped object region into the artificial intelligence model.