公开(公告)号：US20230155086A1

公开(公告)日：2023-05-18

申请号：US17943299

申请日：2022-09-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jongho LIM ,  Jaehyuk LIM ,  Hosik JUN ,  Hyojeong KANG ,  Yonggi CHO

IPC: H01L33/60 ,  H01L25/16 ,  H01L33/00 ,  H01L33/50 ,  H01L33/58

CPC classification number: H01L33/60 ,  H01L25/167 ,  H01L33/0095 ,  H01L33/50 ,  H01L33/58 ,  H01L2933/0041 ,  H01L2933/0058

Abstract: A light-emitting diode (LED) package includes a substrate including an insulating material; upper pads on an upper surface of the substrate; a side surface molding layer covering the upper surface of the substrate and side surfaces of the upper pads; an LED chip on the upper surface of the substrate and electrically connected to the upper pads; a fluorescent layer on the LED chip; and a reflection molding layer on the substrate and covering the LED chip, the reflection molding layer including white silicon, wherein the reflection molding layer exposes a portion of side surfaces of the fluorescent layer.