公开(公告)号：US11817414B2

公开(公告)日：2023-11-14

申请号：US17368194

申请日：2021-07-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Won Choi ,  Sangkyun Im ,  Sanghoon Roh ,  Jihyeon Son ,  Joowhan Lee ,  Hyuntae Jang

IPC: H01L23/00 ,  H01L33/60 ,  H01L25/075 ,  H01L33/62

CPC classification number: H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L25/0753 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/2929 ,  H01L2224/2957 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29371 ,  H01L2224/29411 ,  H01L2224/29439 ,  H01L2224/29455 ,  H01L2224/29499 ,  H01L2224/32227 ,  H01L2224/8302 ,  H01L2224/83091 ,  H01L2224/83099 ,  H01L2224/83192 ,  H01L2224/83851 ,  H01L2924/12041 ,  H01L2924/20105

Abstract: A display module and a method for manufacturing thereof are provided. The display module includes a substrate including a pad, a conduction film which is bonded to the substrate including the pad, wherein at least one of a surface of the conduction film and an inner portion of the conduction film is black color treated, and a display device mounted on the pad to which the conduction film is bonded.

公开(公告)号：US20220013489A1

公开(公告)日：2022-01-13

申请号：US17368194

申请日：2021-07-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Won Choi ,  Sangkyun Im ,  Sanghoon Roh ,  Jihyeon Son ,  Joowhan Lee ,  Hyuntae Jang

IPC: H01L23/00 ,  H01L33/62 ,  H01L33/60 ,  H01L25/075

Abstract: A display module and a method for manufacturing thereof are provided. The display module includes a substrate including a pad, a conduction film which is bonded to the substrate including the pad, wherein at least one of a surface of the conduction film and an inner portion of the conduction film is black color treated, and a display device mounted on the pad to which the conduction film is bonded.