SEMICONDUCTOR DEVICE
    3.
    发明公开

    公开(公告)号:US20240008254A1

    公开(公告)日:2024-01-04

    申请号:US18116071

    申请日:2023-03-01

    IPC分类号: H10B12/00

    CPC分类号: H10B12/315 H10B12/033

    摘要: A semiconductor device includes a substrate, a lower electrode above the substrate, the lower electrode extending in a vertical direction, a support surrounding a side wall of the lower electrode and supporting the lower electrode, a dielectric layer on the lower electrode and the support, and an upper electrode on the dielectric layer, wherein the lower electrode includes a base electrode layer and an insertion layer, the base electrode layer containing a halogen element, and the insertion layer containing carbon, and the insertion layer is inserted in a portion of the lower electrode, the portion of the lower electrode being adjacent to the support and the dielectric layer.

    Method and apparatus for analyzing communication environments and designing networks in consideration of trees

    公开(公告)号:US11467148B2

    公开(公告)日:2022-10-11

    申请号:US16137026

    申请日:2018-09-20

    摘要: A method for identifying radio signal transmission characteristics in a wireless communication system and an apparatus therefor are provided. The method may include identifying a signal transmission site, identifying a signal reception site, finding an area where a tree is present between the signal transmission site and the signal reception site, checking characteristics of the crown of the tree and characteristics of the trunk of the tree, and examining transmission characteristics of a radio signal sent from the signal transmission site to the signal reception site on the basis of the characteristics of the crown and the trunk. The method and apparatus relate to a communication method and system for converging a 5th-Generation (5G) communication system for supporting higher data rates beyond a 4th-Generation (4G) system with a technology for internet of things (IoT), and may be applied to intelligent services based on the 5G communication and the IoT-related technologies.

    Capacitor structure and semiconductor device including the same

    公开(公告)号:US11424316B2

    公开(公告)日:2022-08-23

    申请号:US16916263

    申请日:2020-06-30

    IPC分类号: H01L49/02 H01L27/108

    摘要: A capacitor structure and a semiconductor device, the capacitor structure including a lower electrode on a substrate; a seed layer on the lower electrode; a dielectric layer on the seed layer; and an upper electrode on the dielectric layer, wherein the dielectric layer includes a ternary metal oxide having a chemical formula of ABO3, in which each of A and B is independently a metal, and the seed layer includes a ternary metal oxide containing the same elements as that of the dielectric layer, the ternary metal oxide having a chemical formula of ABO3-x, in which each of A and B is the same metal as A and B of the ternary metal oxide having a chemical formula of ABO3, 0