公开(公告)号：US20180190522A1

公开(公告)日：2018-07-05

申请号：US15628725

申请日：2017-06-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Bum-Soo KIM ,  Philwoong JUNG ,  Yoonmi LEE ,  Hangryong LIM ,  Manyoung SHIN ,  Young Hoon SON

IPC: H01L21/67 ,  H01L21/673

Abstract: A wafer carrier including a case having an opening at one end, slots disposed in the case and receiving wafers, and a wireless communication circuitry disposed on an inner sidewall of the case and configured to detect humidity of a gas contained in the case may be provided. The wireless communication circuitry may be further configured to compare the detected humidity with a threshold humidity predetermined, and transmit a first warning signal to an external host via wireless communication when the detected humidity is greater than the threshold humidity.

公开(公告)号：US20150234737A1

公开(公告)日：2015-08-20

申请号：US14622185

申请日：2015-02-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Manyoung SHIN ,  Janghyuk AN

IPC: G06F11/36 ,  G01K13/00 ,  G01R31/28 ,  G06F11/263

CPC classification number: G06F11/3692 ,  G01R31/2868 ,  G06F11/24 ,  G06F11/263

Abstract: A test system method for testing software of each of a plurality of system on chips (SoCs) are provided. The test system includes: a plurality of test units configured to test the plurality of SoCs according to a plurality of test cases, respectively; a power supplier configured to supply, to each of the plurality of test units, power of a level corresponding to a corresponding test case, among the plurality of test cases; a temperature controller configured to provide, to each of the plurality of test units, a temperature control signal according to the corresponding test case, and to monitor a measurement temperature, provided from each of the plurality of test units, of each of the plurality of SoCs; and an analyzer configured to analyze at least one of a driving voltage, a driving current, and a driving frequency of each of the plurality of SoCs.

Abstract translation: 提供了一种用于测试多个芯片系统（SoC）中的每一个的软件的测试系统方法。 所述测试系统包括：多个测试单元，被配置为分别根据多个测试用例测试所述多个SoC; 电力供给器，被配置为在所述多个测试用例中向所述多个测试单元中的每一个提供与相应的测试用例对应的电平的电力; 温度控制器，被配置为向所述多个测试单元中的每一个提供根据相应测试用例的温度控制信号，并且监视从所述多个测试单元中的每一个提供的测量温度， SoC; 以及分析器，被配置为分析所述多个SoC中的每一个的驱动电压，驱动电流和驱动频率中的至少一个。