公开(公告)号：US20240030210A1

公开(公告)日：2024-01-25

申请号：US18223854

申请日：2023-07-19

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Juyeon Jeong ,  Mihyun Kim ,  Sihan Kim ,  Hankyu Seong ,  Jusong Eom ,  Jihye Yeon

IPC分类号： H01L25/18 ,  H01L27/15 ,  H01L23/00

CPC分类号： H01L25/18 ,  H01L27/156 ,  H01L24/73 ,  H01L24/32 ,  H01L24/29 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/29186 ,  H01L2224/29028 ,  H01L2224/32145 ,  H01L2224/13147 ,  H01L2224/13021 ,  H01L2224/16145 ,  H01L2224/73104 ,  H01L2924/059 ,  H01L2924/12041

摘要： A display apparatus includes: a circuit board including a driving circuit; and a pixel array disposed on the circuit board and including pixels, each of the pixels having a plurality of sub-pixels. The pixel array includes: a semiconductor stack, a conductive partition structure and wavelength conversion portions. The semiconductor stack includes LED cells respectively constituting the plurality of sub-pixels. Each of the LED cells includes at least an active layer and a second conductivity-type semiconductor layer. The conductive partition structure is provided between sub-pixel spaces, respectively overlaps the LED cells on the semiconductor stack, and is provided as a first electrode. The wavelength conversion portions are respectively disposed on the sub-pixel spaces.

公开(公告)号：US20240021589A1

公开(公告)日：2024-01-18

申请号：US18221699

申请日：2023-07-13

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Sammook Kang ,  Mihyun Kim ,  Hankyu Seong ,  Jihye Yeon

IPC分类号： H01L25/075 ,  H01L33/62 ,  H01L33/38 ,  H01L33/50 ,  H01L25/16 ,  H01L27/15

CPC分类号： H01L25/0753 ,  H01L33/62 ,  H01L33/382 ,  H01L33/505 ,  H01L25/167 ,  H01L27/156

摘要： A display apparatus includes a circuit board including a driver circuit, and a pixel array including a plurality of pixels on the circuit board, where each of the plurality of pixels includes a first sub-pixel, a second sub-pixel, and a third sub-pixel, and where the pixel array includes a lower light emitting structure including a first lower light-emitting diode (LED) cell, a second lower LED cell, and a third lower LED cell respectively corresponding to the first sub-pixel, the second sub-pixel, and the third sub-pixel, each of the first lower LED cell, the second lower LED cell, and the third lower LED cell including a first semiconductor laminate configured to emit first light of a first wavelength, and a base insulating layer on lower surfaces of the first lower LED cell, the second lower LED cell, and the third lower LED cell.

公开(公告)号：US10229831B2

公开(公告)日：2019-03-12

申请号：US15656305

申请日：2017-07-21

申请人： Samsung Electronics Co., Ltd.

发明人： Youngjo Tak ,  Sammook Kang ,  Mihyun Kim ,  Junyoun Kim

IPC分类号： H01L21/02

摘要： A method of fabricating a nitride semiconductor substrate including forming a buffer layer on a surface of a growth substrate, growing a first nitride semiconductor layer on the buffer layer, growing a second nitride semiconductor layer on the first nitride semiconductor layer, and removing the growth substrate may be provided. The forming a buffer layer may deform the surface of the growth substrate to have a convex shape. The forming a buffer layer and the growing a first nitride semiconductor layer may be performed within a first process chamber. The growing a second nitride semiconductor layer and the removing the growth substrate may be performed within a second process chamber.

公开(公告)号：US11031717B2

公开(公告)日：2021-06-08

申请号：US16511331

申请日：2019-07-15

申请人： Samsung Electronics Co., Ltd. ,  Hyupjinconnector Co., Ltd.

发明人： Yonglak Cho ,  Jeongki Park ,  Mihyun Kim ,  Jeongyong Lee ,  Choonggeun Lee ,  Dongjin Chung ,  Jangwon Hur ,  Jiwoo Lee

IPC分类号： H01R13/24 ,  H05K1/18 ,  H01Q1/24 ,  H01Q5/307

摘要： The disclosure includes a housing including a first plate, a second plate, and a side member surrounding a space between the first and second plates, a printed circuit board disposed in the space and including an opening, a first conductive structure disposed in the space, a second conductive structure disposed in the space, and a flexible conductive member located between the first and second conductive structures through the opening to construct an electrical path between the first and second conductive structures. The flexible conductive member may include a base, a first flexible portion having a first height from the base, protruding from the base toward the first plate, and in contact with the first conductive structure, and a second flexible portion having a second height from the base, protruding from the base toward the second plate, and in contact with the second conductive structure.