公开(公告)号：US20240030210A1

公开(公告)日：2024-01-25

申请号：US18223854

申请日：2023-07-19

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Juyeon Jeong ,  Mihyun Kim ,  Sihan Kim ,  Hankyu Seong ,  Jusong Eom ,  Jihye Yeon

IPC分类号： H01L25/18 ,  H01L27/15 ,  H01L23/00

CPC分类号： H01L25/18 ,  H01L27/156 ,  H01L24/73 ,  H01L24/32 ,  H01L24/29 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/29186 ,  H01L2224/29028 ,  H01L2224/32145 ,  H01L2224/13147 ,  H01L2224/13021 ,  H01L2224/16145 ,  H01L2224/73104 ,  H01L2924/059 ,  H01L2924/12041

摘要： A display apparatus includes: a circuit board including a driving circuit; and a pixel array disposed on the circuit board and including pixels, each of the pixels having a plurality of sub-pixels. The pixel array includes: a semiconductor stack, a conductive partition structure and wavelength conversion portions. The semiconductor stack includes LED cells respectively constituting the plurality of sub-pixels. Each of the LED cells includes at least an active layer and a second conductivity-type semiconductor layer. The conductive partition structure is provided between sub-pixel spaces, respectively overlaps the LED cells on the semiconductor stack, and is provided as a first electrode. The wavelength conversion portions are respectively disposed on the sub-pixel spaces.

公开(公告)号：US20230387095A1

公开(公告)日：2023-11-30

申请号：US18208034

申请日：2023-06-09

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Jaeseok Kim ,  Eunhye Kim ,  Sangmoo Park ,  Yoonsuk Lee ,  Seungryong Han

IPC分类号： H01L25/16 ,  H01L23/00

CPC分类号： H01L25/167 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/2919 ,  H01L2224/29144 ,  H01L2224/29155 ,  H01L2224/29164 ,  H01L2224/29021 ,  H01L2224/29028 ,  H01L2224/32147 ,  H01L2924/12041

摘要： In some embodiments, a display module for implementing an image using an inorganic light emitting device includes a substrate, a thin film transistor (TFT) layer provided on the substrate, a plurality of connection pads provided on the TFT layer, an anisotropic conductive layer provided on the TFT layer, an inorganic light emitting element bonded to the anisotropic conductive layer, and a conductive ball control layer provided in a surrounding area of the plurality of connection pads. The anisotropic conductive layer includes an adhesive layer and a plurality of conductive balls distributed inside the adhesive layer. The inorganic light emitting element includes a plurality of electrodes corresponding to the plurality of connection pads. The conductive ball control layer is configured to restrict the plurality of conductive balls from moving in a direction perpendicular to a bonding direction while the inorganic light emitting element is being bonded to the anisotropic conductive layer.

公开(公告)号：US11683963B2

公开(公告)日：2023-06-20

申请号：US16249387

申请日：2019-01-16

申请人： Samsung Display Co., Ltd.

发明人： Chungseok Lee ,  Donghee Park ,  Cheolgeun An ,  Jihoon Oh ,  Euiyun Jang ,  Jeongho Hwang

IPC分类号： H01L27/32 ,  H01L23/00 ,  H01L51/00

CPC分类号： H01L27/3276 ,  H01L24/29 ,  H01L24/32 ,  H01L51/0096 ,  H01L2224/13144 ,  H01L2224/16238 ,  H01L2224/271 ,  H01L2224/294 ,  H01L2224/29005 ,  H01L2224/29028 ,  H01L2224/2929 ,  H01L2224/2939 ,  H01L2224/29083 ,  H01L2224/29084 ,  H01L2224/29293 ,  H01L2224/29391 ,  H01L2224/29439 ,  H01L2224/29444 ,  H01L2224/29447 ,  H01L2224/29455 ,  H01L2224/29499 ,  H01L2224/32148 ,  H01L2224/32225 ,  H01L2224/32238 ,  H01L2224/743 ,  H01L2224/81191 ,  H01L2224/81903 ,  H01L2224/831 ,  H01L2224/83192 ,  H01L2224/83201 ,  H01L2224/83203 ,  H01L2224/83345 ,  H01L2224/83851 ,  H01L2224/83862 ,  H01L2224/9211 ,  H01L2251/5369 ,  H01L2924/07811 ,  H01L2924/1426 ,  H01L2224/29444 ,  H01L2924/00014 ,  H01L2224/29439 ,  H01L2924/00014 ,  H01L2224/29447 ,  H01L2924/00014 ,  H01L2224/29455 ,  H01L2924/00014 ,  H01L2224/2929 ,  H01L2924/0665 ,  H01L2224/29005 ,  H01L2924/00012 ,  H01L2224/9211 ,  H01L2224/81 ,  H01L2224/83

摘要： An anisotropic conductive film includes a conductive layer; a first resin insulating layer over a first surface of the conductive layer; and a second resin insulating layer over a second surface of the conductive layer, wherein the conductive layer comprises a plurality of conductive particles and a nano fiber connecting the plurality of conductive particles to each other, each of the plurality of conductive particles comprising a plurality of needle-shaped protrusions having a conical shape, and wherein the first resin insulating layer and the second resin insulating layer comprise a same material and have different thicknesses.

公开(公告)号：US20170069595A1

公开(公告)日：2017-03-09

申请号：US15257427

申请日：2016-09-06

申请人： Invensas Corporation

发明人： Belgacem Haba

IPC分类号： H01L23/00

CPC分类号： H01L24/83 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/75 ,  H01L24/81 ,  H01L24/92 ,  H01L24/94 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/05611 ,  H01L2224/05616 ,  H01L2224/05687 ,  H01L2224/113 ,  H01L2224/13022 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13193 ,  H01L2224/1403 ,  H01L2224/1601 ,  H01L2224/16105 ,  H01L2224/16146 ,  H01L2224/271 ,  H01L2224/2733 ,  H01L2224/2741 ,  H01L2224/27436 ,  H01L2224/27849 ,  H01L2224/29027 ,  H01L2224/29028 ,  H01L2224/2929 ,  H01L2224/29291 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29393 ,  H01L2224/29499 ,  H01L2224/3201 ,  H01L2224/32105 ,  H01L2224/32145 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/75102 ,  H01L2224/8109 ,  H01L2224/81101 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/81815 ,  H01L2224/8309 ,  H01L2224/83101 ,  H01L2224/83143 ,  H01L2224/83193 ,  H01L2224/83203 ,  H01L2224/83815 ,  H01L2224/83851 ,  H01L2224/83862 ,  H01L2224/8388 ,  H01L2224/9211 ,  H01L2224/9212 ,  H01L2224/92125 ,  H01L2224/94 ,  H01L2924/01006 ,  H01L2924/014 ,  H01L2924/381 ,  H01L2924/0665 ,  H01L2924/07025 ,  H01L2924/0675 ,  H01L2924/0635 ,  H01L2924/00012 ,  H01L2924/069 ,  H01L2224/83 ,  H01L2924/00014 ,  H01L2224/81 ,  H01L2224/11 ,  H01L2224/27

摘要： 3D joining of microelectronic components and a conductively self-adjusting anisotropic matrix are provided. In an implementation, an adhesive matrix automatically makes electrical connections between two surfaces that have electrical contacts, and bonds the two surfaces together. Conductive members in the adhesive matrix are aligned to automatically establish electrical connections between at least partially aligned contacts on each of the two surfaces while providing nonconductive adhesion between parts of the two surfaces lacking aligned contacts. An example method includes forming an adhesive matrix between two surfaces to be joined, including conductive members anisotropically aligned in an adhesive medium, then pressing the two surfaces together to automatically connect corresponding electrical contacts that are at least partially aligned on the two surfaces. The adhesive medium in the matrix secures the two surfaces together.

摘要翻译： 提供了微电子部件的3D连接和导电自调节各向异性矩阵。 在一个实施方案中，粘合剂基质自动地在具有电接触的两个表面之间进行电连接，并将两个表面粘合在一起。 粘合剂基体中的导电构件对准以在两个表面中的每一个上的至少部分对准的触点之间自动建立电连接，同时在缺少对准的触点的两个表面的部分之间提供非导电粘附。 一个示例性方法包括在待接合的两个表面之间形成粘合剂基体，包括在粘合剂介质中各向异性排列的导电构件，然后将两个表面压在一起，以自动连接在两个表面上至少部分对准的对应的电触头。 基体中的粘合剂介质将两个表面固定在一起。

公开(公告)号：US20140061642A1

公开(公告)日：2014-03-06

申请号：US13802759

申请日：2013-03-14

申请人： QUALCOMM INCORPORATED

发明人： Vaishnav Srinivas ,  Bernie Jord Yang ,  Michael Brunolli ,  David Ian West ,  Charles David Paynter

IPC分类号： H01L23/00

CPC分类号： H01L24/17 ,  H01L21/563 ,  H01L22/32 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/30 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/02377 ,  H01L2224/0401 ,  H01L2224/05558 ,  H01L2224/0556 ,  H01L2224/05569 ,  H01L2224/11462 ,  H01L2224/13028 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/13116 ,  H01L2224/13147 ,  H01L2224/14165 ,  H01L2224/16225 ,  H01L2224/16245 ,  H01L2224/27462 ,  H01L2224/29028 ,  H01L2224/29078 ,  H01L2224/29147 ,  H01L2224/3012 ,  H01L2224/3213 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/81815 ,  H01L2224/831 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/07802 ,  H01L2924/381 ,  H01L2924/0105 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05552

摘要： Various aspects of an approach for routing die signals in an interior portion of a die using external interconnects are described herein. The approach provides for contacts coupled to circuits in the interior portion of the die, where the contacts are exposed to an exterior portion of the die. The external interconnects are configured to couple these contacts so that signals from the circuits in the interior portion of the die may be routed externally to the die. In various aspects of the disclosed approach, the external interconnects are protected by a packaging for the die.

摘要翻译： 这里描述了使用外部互连在芯片的内部部分中布线管芯信号的方法的各个方面。 该方法提供了耦合到管芯内部的电路的触点，其中触点暴露于管芯的外部部分。 外部互连被配置为耦合这些触点，使得来自芯片内部部分的电路的信号可以被外部引导到管芯。 在所公开的方法的各个方面，外部互连由模具的包装保护。

公开(公告)号：US11894294B2

公开(公告)日：2024-02-06

申请号：US17804271

申请日：2022-05-26

申请人： SAMSUNG DISPLAY CO., LTD.

发明人： Hanho Park ,  Jeongeun Park ,  Soyeon Joo

IPC分类号： H05K1/18 ,  H01L23/498 ,  H05K1/11 ,  H05K1/02 ,  H05K1/14 ,  H01L23/538 ,  H01L23/00 ,  H01L25/18 ,  H10K59/131

CPC分类号： H01L23/49838 ,  H01L23/5386 ,  H05K1/0268 ,  H05K1/118 ,  H05K1/14 ,  H05K1/189 ,  H01L23/4985 ,  H01L23/5387 ,  H01L24/06 ,  H01L24/29 ,  H01L24/32 ,  H01L25/18 ,  H01L2224/06152 ,  H01L2224/06155 ,  H01L2224/29006 ,  H01L2224/29028 ,  H01L2224/32227 ,  H05K2201/09936 ,  H05K2201/10128 ,  H10K59/131

摘要： A display apparatus includes a printed circuit board including first to fourth output pad regions and a flexible circuit board having a first end connected to a display panel and a second end connected to the printed circuit board. The first output pad region includes a 1st-1st output pad group and a 1st-2nd output pad group, the second output pad region includes a 2nd-1st output pad group and a 2nd-2nd output pad group, the fourth output pad region includes a 4th-1st output pad group and a 4th-2nd output pad group, and the printed circuit board includes a first input terminal electrically connected to the 1st-1st output pad group, a second input terminal electrically connected to the 2nd-2nd output pad group, a third input terminal electrically connected to the first input terminal, and a fourth input terminal electrically connected to the 4th-2nd output pad group.

公开(公告)号：US20180331170A1

公开(公告)日：2018-11-15

申请号：US15553266

申请日：2017-05-25

申请人： Wuhan China Star Optoelectronics Technology Co., Ltd.

发明人： Kui XU

IPC分类号： H01L27/32 ,  H01L23/00 ,  H01L23/498 ,  H01L25/18 ,  H05K1/18 ,  H05K1/14 ,  H05K1/11

CPC分类号： H01L27/3276 ,  H01L23/4985 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L25/18 ,  H01L2224/1145 ,  H01L2224/11614 ,  H01L2224/11622 ,  H01L2224/13019 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13166 ,  H01L2224/1318 ,  H01L2224/16148 ,  H01L2224/16238 ,  H01L2224/29028 ,  H01L2224/2929 ,  H01L2224/29298 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2227/323 ,  H01L2924/0635 ,  H01L2924/07025 ,  H01L2924/2064 ,  H05K1/111 ,  H05K1/147 ,  H05K1/189 ,  H05K3/027 ,  H05K3/4007 ,  H05K2201/10128 ,  H05K2201/1078 ,  H05K2201/10787 ,  H05K2201/10977

摘要： The present invention discloses a connection component, connector, manufacturing method for the same and panel component. The connection component includes a first connector and a second connector electrically connected to the first connector, wherein, between the first connector and the second connector, a connection adhesive is provided, the first connector and/or the second connector both include a base body and multiple connection terminals, wherein the multiple connection terminals are disposed on the base body, a terminal portion of each connection terminal has a protrusion, the protrusion has a saw-tooth shape, and the saw-tooth shape has a regular pattern or a non-regular pattern, Accordingly, the present invention can enhance the reliability of the connection and increase the production yield.

公开(公告)号：US20170062374A1

公开(公告)日：2017-03-02

申请号：US15015758

申请日：2016-02-04

申请人： Samsung Electronics Co., Ltd.

发明人： Kunmo CHU ,  Wonsuk CHANG ,  Chanmoon CHUNG

IPC分类号： H01L23/00

CPC分类号： H01L24/33 ,  H01B1/22 ,  H01L23/53276 ,  H01L23/5328 ,  H01L24/09 ,  H01L24/29 ,  H01L2224/29028 ,  H01L2224/29105 ,  H01L2224/29198 ,  H01L2224/29393 ,  H01L2224/29394 ,  H01L2224/2949 ,  H01L2224/2957 ,  H01L2224/29691 ,  H01L2224/32227 ,  H01L2924/01006 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/0134 ,  H01L2924/1426 ,  H01R4/04 ,  H01R13/2414 ,  H05K3/323 ,  H05K3/3436 ,  H05K2201/0224 ,  H05K2201/026 ,  H05K2201/0323 ,  H05K2201/10674 ,  H05K2203/0425

摘要： Provided are anisotropic conductive materials, electronic devices including anisotropic conductive materials, and/or methods of manufacturing the electronic devices. An anisotropic conductive material may include a plurality of particles in a matrix material layer. At least some of the particles may include a core portion and a shell portion covering the core portion. The core portion may include a conductive material that is in a liquid state at a temperature greater than 15° C. and less than or equal to about 110° C. or less. For example, the core portion may include at least one of a liquid metal, a low melting point solder, and a nanofiller. The shell portion may include an insulating material. A bonding portion formed by using the anisotropic conductive material may include the core portion outflowed from the particle and may further include an intermetallic compound.

摘要翻译： 提供各向异性导电材料，包括各向异性导电材料的电子器件和/或制造电子器件的方法。 各向异性导电材料可以包括基质材料层中的多个颗粒。 至少一些颗粒可以包括芯部分和覆盖芯部分的壳部分。 核心部分可以包括在大于15℃且小于或等于约110℃或更低的温度下处于液态的导电材料。 例如，芯部可以包括液态金属，低熔点焊料和纳米填料中的至少一种。 外壳部分可以包括绝缘材料。 通过使用各向异性导电材料形成的接合部可以包括从颗粒流出的芯部，还可以包含金属间化合物。

公开(公告)号：US08426980B2

公开(公告)日：2013-04-23

申请号：US13210818

申请日：2011-08-16

申请人： Chau-Chin Su ,  Ying-Chieh Ho ,  Po-Hsiang Huang

发明人： Chau-Chin Su ,  Ying-Chieh Ho ,  Po-Hsiang Huang

IPC分类号： H01L23/522

CPC分类号： H01L25/0657 ,  H01L23/48 ,  H01L24/32 ,  H01L2224/05554 ,  H01L2224/06131 ,  H01L2224/06151 ,  H01L2224/29028 ,  H01L2224/29099 ,  H01L2224/2919 ,  H01L2224/32106 ,  H01L2225/06531 ,  H01L2225/06565 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2924/00

摘要： A chip-to-chip multi-signaling communication system with common conductive layer, which comprises a first chip, a second chip, and a common conductive layer, is disclosed. The first chip has at least a first metal pad and a second metal pad. The second chip has at least a first metal pad and a second metal pad. The common conductive layer is to a conductive material and glued directly to the first chip and the second chip. Wherein, the first metal pad of the second chip is aligned with the first metal pad of the first chip for receiving the signal from the first metal pad of the first chip through the common conductive layer. The interference generated by other pads of the first and the second chips is suppressed by the design of the pads and the common conductive layer.

摘要翻译： 公开了一种具有公共导电层的芯片到芯片的多信令通信系统，其包括第一芯片，第二芯片和公共导电层。 第一芯片具有至少第一金属焊盘和第二金属焊盘。 第二芯片具有至少第一金属焊盘和第二金属焊盘。 公共导电层是导电材料并直接胶合到第一芯片和第二芯片。 其中，第二芯片的第一金属焊盘与第一芯片的第一金属焊盘对准，用于通过公共导电层从第一芯片的第一金属焊盘接收信号。 通过焊盘和公共导电层的设计来抑制由第一和第二芯片的其它焊盘产生的干扰。

公开(公告)号：US08314473B2

公开(公告)日：2012-11-20

申请号：US12773552

申请日：2010-05-04

申请人： Michael Gruenhagen ,  Thomas P. Welch ,  Eric J. Woolsey

发明人： Michael Gruenhagen ,  Thomas P. Welch ,  Eric J. Woolsey

IPC分类号： H01L21/70

CPC分类号： H01L23/49513 ,  H01L21/6835 ,  H01L22/10 ,  H01L23/28 ,  H01L23/3107 ,  H01L24/03 ,  H01L24/05 ,  H01L24/27 ,  H01L24/29 ,  H01L24/48 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2221/68381 ,  H01L2224/03002 ,  H01L2224/0345 ,  H01L2224/03452 ,  H01L2224/03462 ,  H01L2224/04026 ,  H01L2224/04042 ,  H01L2224/05082 ,  H01L2224/05083 ,  H01L2224/05124 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05551 ,  H01L2224/05578 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/27002 ,  H01L2224/27462 ,  H01L2224/27464 ,  H01L2224/29018 ,  H01L2224/29028 ,  H01L2224/2908 ,  H01L2224/29082 ,  H01L2224/29111 ,  H01L2224/29147 ,  H01L2224/29155 ,  H01L2224/32245 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/83447 ,  H01L2224/8346 ,  H01L2224/83815 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12032 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15738 ,  H01L2924/15747 ,  H01L2924/1576 ,  H01L2924/181 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/013 ,  H01L2924/01402 ,  H01L2224/03 ,  H01L2224/27 ,  H01L2924/01083 ,  H01L2924/01051 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Standoff structures that can be used on the die backside of semiconductor devices and methods for making the same are described. The devices contain a silicon substrate with an integrated circuit on the front side of the substrate and a backmetal layer on the backside of the substrate. Standoff structures made of Cu of Ni are formed on the backmetal layer and are embedded in a Sn-containing layer that covers the backmetal layer and the standoff structures. The standoff structures can be isolated from each other so that they are not connected and can also be configured to substantially mirror indentations in the leadframe that is attached to the Sn-containing layer. Other embodiments are described.

摘要翻译： 描述了可用于半导体器件的模具背面的间隔结构及其制造方法。 这些器件包含在衬底前侧具有集成电路的硅衬底和衬底背面上的后金属层。 在后金属层上形成由Cu的Cu构成的间隔结构，并且嵌入到覆盖后金属层和间隔结构的含Sn层中。 间隔结构可以彼此隔离，使得它们不连接，并且还可以被配置为基本上镜像连接到含Sn层的引线框架中的凹陷。 描述其他实施例。