公开(公告)号：US20130256876A1

公开(公告)日：2013-10-03

申请号：US13733446

申请日：2013-01-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ui-hyoung LEE ,  Moon-gi CHO ,  Mi-seok PARK ,  Sun-hee PARK ,  Hwan-sik LIM ,  Jin-ho CHOI ,  Fujisaki ATSUSHI

IPC: H01L23/00

CPC classification number: H01L24/14 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/0345 ,  H01L2224/03452 ,  H01L2224/0401 ,  H01L2224/05022 ,  H01L2224/05099 ,  H01L2224/05568 ,  H01L2224/05599 ,  H01L2224/06102 ,  H01L2224/11452 ,  H01L2224/1146 ,  H01L2224/1147 ,  H01L2224/11849 ,  H01L2224/13012 ,  H01L2224/13014 ,  H01L2224/13018 ,  H01L2224/1308 ,  H01L2224/13099 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/1312 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/13166 ,  H01L2224/13169 ,  H01L2224/13171 ,  H01L2224/17517 ,  H01L2924/00014 ,  H01L2924/01327 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/01006 ,  H01L2224/05552

Abstract: A semiconductor package includes a semiconductor chip having a plurality of contact pads on a surface thereof, a plurality of main bumps on the contact pads, respectively. Each of the plurality of main bumps includes a first pillar layer on one of the contact pads and a first solder layer on the first pillar layer, and the first solder layer includes an upper portion having an overhang portion.

Abstract translation: 半导体封装包括其表面上具有多个接触焊盘的半导体芯片，分别在接触焊盘上的多个主凸块。 多个主凸块中的每一个包括在一个接触焊盘上的第一柱层和第一柱层上的第一焊料层，并且第一焊料层包括具有突出部分的上部。