公开(公告)号：US20230187236A1

公开(公告)日：2023-06-15

申请号：US17889035

申请日：2022-08-16

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Wonguk Seo ,  Seok Heo ,  Sungwook Kang ,  Byeongsang Kim ,  Sungkun Hwang ,  Igor Ivanov

IPC: H01L21/67 ,  H01L21/687 ,  H05B3/26 ,  F27B17/00 ,  F27D5/00 ,  B32B9/00 ,  B32B9/04 ,  B32B18/00 ,  B32B7/12 ,  B32B3/30 ,  B32B3/14

CPC classification number: H01L21/67109 ,  B32B3/14 ,  B32B3/30 ,  B32B7/12 ,  B32B9/04 ,  B32B9/007 ,  B32B9/041 ,  B32B18/00 ,  F27B17/0025 ,  F27D5/0037 ,  H01L21/6875 ,  H05B3/265 ,  B32B2255/205 ,  B32B2307/302 ,  H05B2203/005 ,  H05B2214/04

Abstract: A wafer baking apparatus includes a chamber including a processing space, and a wafer heater disposed in the processing space and configured to support a wafer. The wafer heater includes a first heating plate, a heating resistance pattern disposed on a lower surface of the first heating plate, a second heating plate disposed on the first heating plate, and a heat dispersion layer interposed between the first and second heating plates and having thermal conductivity lower than a thermal conductivity of materials of the first and second heating plates.