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公开(公告)号：USD779589S1
公开(公告)日：2017-02-21
申请号：US29561203
申请日：2016-04-14
设计人： Yongil Moon , Ji-Won Moon , Seung-Chan Park , Donggeun Lee , Yongkwan Cho , Sungwook Kang
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公开(公告)号：US20240280917A1
公开(公告)日：2024-08-22
申请号：US18468505
申请日：2023-09-15
发明人： Jung Dohyun , Youngduk Suh , Sungwook Kang , Sanggon Shin , Seunghee Lee , Jinwook Jung
IPC分类号： G03F7/00
CPC分类号： G03F7/70925
摘要： An apparatus for cleaning an EUV light creation chamber may include a cleaning module, a first movement module and a second movement module. The first movement module may support the cleaning module in the EUV light creation chamber along a first direction. The second movement module may support the first movement module on a surface of the EUV light creation chamber at a position along a second direction perpendicular to the first direction.
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公开(公告)号：US12133041B2
公开(公告)日：2024-10-29
申请号：US17698866
申请日：2022-03-18
发明人： Kyoungho Bang , Sungwook Kang , Junghyeon Kim , Jinyong Kim , Hangil Moon , Igor Ivanov , Byeongmin Lee , Jaeseong Lee , Hyung Lee , Joonrae Cho
CPC分类号： H04R1/1041 , H04R1/08 , H04R1/1016 , H04R1/1075 , H04R1/1083 , H05K5/0213 , H04R2460/11
摘要： An electronic device according to various embodiments disclosed herein may include: a housing, a speaker embedded in the housing, an acoustic duct configured to transfer an output from the speaker to a user, an external hole formed in the housing to be connected to outside the electronic device, an external sound duct configured to transfer a sound introduced through the external hole to the user, and a variable hole member comprising a variable opening disposed in at least one of the external hole and the external sound duct, wherein the variable hole member may include a conductive member comprising a conductive material configured to apply an electric signal, a ventilation hole configured to allow a sound transferred from the external hole to pass therethrough, and a deformable member comprising a deformable material configured to deform based on the electric signal to close at least a portion of the ventilation hole.
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公开(公告)号：USD788217S1
公开(公告)日：2017-05-30
申请号：US29534701
申请日：2015-07-30
设计人： Ji-Won Moon , Seung-Chan Park , Yongkwan Cho , Yongil Moon , Donggeun Lee , Sungwook Kang
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公开(公告)号：US20230187236A1
公开(公告)日：2023-06-15
申请号：US17889035
申请日：2022-08-16
发明人： Wonguk Seo , Seok Heo , Sungwook Kang , Byeongsang Kim , Sungkun Hwang , Igor Ivanov
IPC分类号： H01L21/67 , H01L21/687 , H05B3/26 , F27B17/00 , F27D5/00 , B32B9/00 , B32B9/04 , B32B18/00 , B32B7/12 , B32B3/30 , B32B3/14
CPC分类号： H01L21/67109 , B32B3/14 , B32B3/30 , B32B7/12 , B32B9/04 , B32B9/007 , B32B9/041 , B32B18/00 , F27B17/0025 , F27D5/0037 , H01L21/6875 , H05B3/265 , B32B2255/205 , B32B2307/302 , H05B2203/005 , H05B2214/04
摘要： A wafer baking apparatus includes a chamber including a processing space, and a wafer heater disposed in the processing space and configured to support a wafer. The wafer heater includes a first heating plate, a heating resistance pattern disposed on a lower surface of the first heating plate, a second heating plate disposed on the first heating plate, and a heat dispersion layer interposed between the first and second heating plates and having thermal conductivity lower than a thermal conductivity of materials of the first and second heating plates.
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