公开(公告)号：US20230257630A1

公开(公告)日：2023-08-17

申请号：US18098244

申请日：2023-01-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Wooin LEE ,  Jihye KIM ,  Seungho PARK ,  Jaewoo LEE ,  Jaeik LEE ,  Jaehak LEE ,  Bohyeok CHOI ,  Jungeun KANG ,  Boyun KIM ,  Sangkyun KIM ,  Hyukmin KIM

IPC: C09G1/02 ,  C09K3/14 ,  H01L21/3105 ,  H01L21/321 ,  H10B12/00

CPC classification number: C09G1/02 ,  C09K3/1409 ,  H01L21/3212 ,  H01L21/31053 ,  H10B12/05 ,  H10B12/482

Abstract: A slurry composition is used to treat a surface of a target structure including at least one of a first polishing target film and a second polishing target film, which include different materials from each other, by a chemical mechanical polishing (CMP) process. The slurry composition includes: polishing particles; a first inhibitor including a nonionic polymer to selectively bond to the first polishing target film; and a second inhibitor including an anionic polymer to selectively bond to the second polishing target film. A method of manufacturing an integrated circuit device includes: forming, on a substrate, a target structure including at least one of a first polishing target film and a second polishing target film; applying the slurry composition onto the target structure; and treating a surface of the target structure by a CMP process while the slurry composition covers the target structure.