-
公开(公告)号：US20230253218A1
公开(公告)日：2023-08-10
申请号：US18135618
申请日：2023-04-17
发明人： Ji Hoon CHA , Jinwoo LEE , Seok Hoon KIM , In Gi KIM , Seung Min SHIN , Yong Jun CHOI
IPC分类号： H01L21/67 , H01L21/687
CPC分类号： H01L21/67115 , H01L21/67051 , H01L21/68728 , H01L21/68764
摘要： An apparatus is provided. The apparatus includes a spinner configured to hold a wafer, a nozzle configured to supply a liquid chemical onto an upper surface of the wafer, and a laser module configured to heat the wafer by radiating a laser beam to a lower surface of the wafer while the nozzle supplies the liquid chemical onto the upper surface of the wafer.
-
公开(公告)号：US20200343113A1
公开(公告)日：2020-10-29
申请号：US16690498
申请日：2019-11-21
发明人： Yong Jun CHOI , Seok Hoon KIM , Young-Hoo KIM , In Gi KIM , Sung Hyun PARK , Seung Min SHIN , Kun Tack LEE , Jinwoo LEE , Hun Jae JANG , Ji Hoon CHA
IPC分类号： H01L21/67 , H01L21/687 , B08B3/08
摘要： A multi-chamber apparatus for processing a wafer, the apparatus including a high etch rate chamber to receive the wafer and to etch silicon nitride with a phosphoric acid solution; a rinse chamber to receive the wafer and to clean the wafer with an ammonia mixed solution; and a supercritical drying chamber to dry the wafer with a supercritical fluid.
-
公开(公告)号：US20230343613A1
公开(公告)日：2023-10-26
申请号：US18214096
申请日：2023-06-26
发明人： Yong Jun CHOI , Seok Hoon KIM , Young-Hoo KIM , In Gi KIM , Sung Hyun PARK , Seung Min SHIN , Kun Tack LEE , Jinwoo LEE , Hun Jae JANG , Ji Hoon CHA
IPC分类号： H01L21/67 , B08B3/08 , H01L21/687
CPC分类号： H01L21/67167 , H01L21/67063 , H01L21/67051 , B08B3/08 , H01L21/67034 , H01L21/68707
摘要： A multi-chamber apparatus for processing a wafer, the apparatus including a high etch rate chamber to receive the wafer and to etch silicon nitride with a phosphoric acid solution; a rinse chamber to receive the wafer and to clean the wafer with an ammonia mixed solution; and a supercritical drying chamber to dry the wafer with a supercritical fluid.
-
公开(公告)号：US20210060625A1
公开(公告)日：2021-03-04
申请号：US16890490
申请日：2020-06-02
发明人： Seung Min SHIN , Hun Jae JANG , Seok Hoon KIM , Young-Hoo KIM , In Gi KIM , Tae-Hong KIM , Kun Tack LEE , Ji Hoon CHA , Yong Jun CHOI
IPC分类号： B08B7/00 , B08B3/10 , H01L21/67 , H01L21/687 , H01L21/311
摘要： A wafer cleaning apparatus is provided. The wafer cleaning apparatus includes comprising a chamber configured to be loaded with a wafer, a nozzle on the wafer and configured to provide liquid chemicals on an upper surface of the wafer, a housing under the wafer, a laser module configured to irradiate laser on the wafer, a transparent window disposed between the wafer and the laser module, and a controller configured to control on/off of the laser module, wherein the controller is configured to control repetition of turning the laser module on and off, and retain temperature of the wafer within a temperature range, and a ratio of time when the laser module is on in one cycle including on/off of the laser module is 30% to 50%.
-
5.发明申请公开(公告)号：US20200251358A1
公开(公告)日：2020-08-06
申请号：US16683753
申请日：2019-11-14
发明人： Ji Hoon CHA , Jinwoo LEE , Seok Hoon KIM , In Gi KIM , Seung Min SHIN , Yong Jun CHOI
IPC分类号： H01L21/67 , H01L21/687
摘要： An apparatus is provided. The apparatus includes a spinner configured to hold a wafer, a nozzle configured to supply a liquid chemical onto an upper surface of the wafer, and a laser module configured to heat the wafer by radiating a laser beam to a lower surface of the wafer while the nozzle supplies the liquid chemical onto the upper surface of the wafer.
-
公开(公告)号：US20190259641A1
公开(公告)日：2019-08-22
申请号：US16115943
申请日：2018-08-29
发明人： Young-Hoo KIM , Sung Hyun PARK , Hyun Woo NHO , Ji Hoon CHA , Yong Jun CHOI
IPC分类号： H01L21/67 , B01D29/66 , H01L21/311
摘要： A liquid chemical recycle system includes a buffer tank receiving a first liquid chemical from outside; a vacuum tank having a vacuum pump connected thereto and receiving the first liquid chemical from the buffer tank using the vacuum pump; and a recycle tank receiving the first liquid chemical from the vacuum tank and providing a second liquid chemical, which is a recycled first liquid chemical, to the outside, wherein the buffer tank includes a first injection portion, to which the first liquid chemical is provided, and a first supply portion, which provides the first liquid chemical to the vacuum tank, and a bottom of the buffer tank is downwardly inclined toward the first supply portion to prevent a material contained in the first liquid chemical from being accumulated in the buffer tank.
-
-
-
-
-
搜索结果
6 条记录 (耗时 0.019 秒)
