公开(公告)号：US20250091077A1

公开(公告)日：2025-03-20

申请号：US18661139

申请日：2024-05-10

Applicant: SAMSUNG ELECTRONICS CO, LTD.

Inventor： Min Suk KANG ,  Young-Hoo KIM ,  Sung Hyun PARK ,  Jin Seon YOU ,  Tae-Hong KIM ,  Woo Gwan SHIM

IPC: B05B14/00 ,  B05B15/50

Abstract: A home port includes: a cylindrical body including: an open upper, a lower end, and an outlet in the lower end of the cylindrical body; a cover covering the open upper end; a pipe connected to the outlet; and a first bracket between the cover and the outlet, wherein a hole is provided in the first bracket, the first bracket has an inclined surface inclined from a first side of the first bracket to a second side of the first bracket, a vertical level of the first side of the first bracket is higher than a vertical level of the second side of the first bracket, and the hole of the first bracket is provided at the second side of the first bracket.

公开(公告)号：US20250105032A1

公开(公告)日：2025-03-27

申请号：US18442548

申请日：2024-02-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sung Hyun PARK ,  Min Suk KANG ,  Young-Hoo KIM ,  Jin Seon YOU ,  Tae-Hong KIM ,  Woo Gwan SHIM

IPC: H01L21/67

Abstract: A chemical liquid supply apparatus is provided and includes an additive supply, a chemical liquid supply, and a controller that controls the additive supply and the chemical liquid supply. The additive supply includes a first tank that receives an additive from an additive container, and a first circulating pipe connected to the first tank. The chemical liquid supply includes an auxiliary tank that receives an etching liquid from another container and receives the additive, and a second circulating pipe connected to the auxiliary tank. The controller provides control so as to: circulate the additive in the first tank; heat the etching liquid in the auxiliary tank using a heater such that a temperature of the etching liquid is increased to a first temperature; supply the additive to the auxiliary tank; and produce a chemical liquid by circulating the etching liquid and the additive at the first temperature.

公开(公告)号：US20230343613A1

公开(公告)日：2023-10-26

申请号：US18214096

申请日：2023-06-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yong Jun CHOI ,  Seok Hoon KIM ,  Young-Hoo KIM ,  In Gi KIM ,  Sung Hyun PARK ,  Seung Min SHIN ,  Kun Tack LEE ,  Jinwoo LEE ,  Hun Jae JANG ,  Ji Hoon CHA

IPC: H01L21/67 ,  B08B3/08 ,  H01L21/687

CPC classification number: H01L21/67167 ,  H01L21/67063 ,  H01L21/67051 ,  B08B3/08 ,  H01L21/67034 ,  H01L21/68707

Abstract: A multi-chamber apparatus for processing a wafer, the apparatus including a high etch rate chamber to receive the wafer and to etch silicon nitride with a phosphoric acid solution; a rinse chamber to receive the wafer and to clean the wafer with an ammonia mixed solution; and a supercritical drying chamber to dry the wafer with a supercritical fluid.

公开(公告)号：US20170194047A1

公开(公告)日：2017-07-06

申请号：US15361599

申请日：2016-11-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Woojin RIM ,  Tae Joong SONG ,  Yong Ho KIM ,  Sung Hyun PARK

IPC: G11C11/419 ,  G06F1/28 ,  G06F1/04 ,  G11C11/418

CPC classification number: G11C11/419 ,  G06F1/3275 ,  G11C8/08 ,  G11C11/418 ,  Y02D10/14

Abstract: An integrated circuit (IC) and a mobile device are provided. The IC includes a memory cell that includes a word line, a bit line pair, and a storage cell connected to the word line and the bit line pair. The IC further includes a timing control circuit configured to generate switch signals based on an operation control signal, and a switch circuit configured to receive a first voltage, a second voltage and a third voltage having different levels, and output, to the word line, one among the first voltage, the second voltage, and the third voltage based on the switch signals.

公开(公告)号：US20200343113A1

公开(公告)日：2020-10-29

申请号：US16690498

申请日：2019-11-21

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yong Jun CHOI ,  Seok Hoon KIM ,  Young-Hoo KIM ,  In Gi KIM ,  Sung Hyun PARK ,  Seung Min SHIN ,  Kun Tack LEE ,  Jinwoo LEE ,  Hun Jae JANG ,  Ji Hoon CHA

IPC: H01L21/67 ,  H01L21/687 ,  B08B3/08

Abstract: A multi-chamber apparatus for processing a wafer, the apparatus including a high etch rate chamber to receive the wafer and to etch silicon nitride with a phosphoric acid solution; a rinse chamber to receive the wafer and to clean the wafer with an ammonia mixed solution; and a supercritical drying chamber to dry the wafer with a supercritical fluid.

公开(公告)号：US20190259641A1

公开(公告)日：2019-08-22

申请号：US16115943

申请日：2018-08-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Young-Hoo KIM ,  Sung Hyun PARK ,  Hyun Woo NHO ,  Ji Hoon CHA ,  Yong Jun CHOI

IPC: H01L21/67 ,  B01D29/66 ,  H01L21/311

Abstract: A liquid chemical recycle system includes a buffer tank receiving a first liquid chemical from outside; a vacuum tank having a vacuum pump connected thereto and receiving the first liquid chemical from the buffer tank using the vacuum pump; and a recycle tank receiving the first liquid chemical from the vacuum tank and providing a second liquid chemical, which is a recycled first liquid chemical, to the outside, wherein the buffer tank includes a first injection portion, to which the first liquid chemical is provided, and a first supply portion, which provides the first liquid chemical to the vacuum tank, and a bottom of the buffer tank is downwardly inclined toward the first supply portion to prevent a material contained in the first liquid chemical from being accumulated in the buffer tank.