公开(公告)号：US10374003B2

公开(公告)日：2019-08-06

申请号：US15850232

申请日：2017-12-21

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Pun Jae Choi ,  Jacob Chang-Lin Tarn ,  Han Kyu Seong ,  Jin Hyuk Song ,  Yoon Joon Choi

IPC分类号： H01L27/00 ,  H01L33/00 ,  H01L27/15 ,  H01L33/18 ,  H01L33/22 ,  H01L33/24 ,  H01L33/32 ,  H01L33/38 ,  H01L33/44 ,  H01L33/46 ,  H01L33/50 ,  H01L33/62 ,  H01L25/075 ,  F21K9/232 ,  F21K9/235 ,  F21K9/237 ,  H01L33/06 ,  H01L31/105 ,  H01L31/0352 ,  H01L31/00 ,  F21V31/00 ,  F21Y115/10

摘要： A semiconductor light emitting device includes a plurality of light emitting cells having first and second surface opposing each other, the plurality of light emitting cells including a first conductivity-type semiconductor layer, a second conductivity-type semiconductor layer, and an active layer therebetween, an insulating layer on the second surface of the plurality of light emitting cells and having first and second openings defining a first contact region of the first conductivity-type semiconductor layer and a second contact region of the second conductivity-type semiconductor layer, respectively, a connection electrode on the insulating layer and connecting a first contact region and a second contact region of adjacent light emitting cells, a transparent support substrate on the first surface of the plurality of light emitting cells, and a transparent bonding layer between the plurality of light emitting cells and the transparent support substrate.

公开(公告)号：US10711990B2

公开(公告)日：2020-07-14

申请号：US16232247

申请日：2018-12-26

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Young Jeong Yoon ,  Yoon Joon Choi

IPC分类号： F21V29/70 ,  F21V23/06 ,  H01L33/62 ,  F21V19/00 ,  H01L33/64

摘要： A light source module includes a heat sink having a mounting region; a light emitting device package having a first surface disposed on the mounting region of the heat sink and a second surface that is opposite to the first surface, the light emitting device package including a connection pad disposed on the second surface; a circuit board disposed on the mounting region of the heat sink and spaced apart from the light emitting device package, the circuit board including a connector and a terminal electrically connected to the connector; and a bracket disposed between the light emitting device package and the circuit board on the mounting region of the heat sink, and coupled to the heat sink, the bracket including a lead frame pressing the connection pad and the terminal to connect the connection pad and the terminal.