公开(公告)号：US20240071732A1

公开(公告)日：2024-02-29

申请号：US18236748

申请日：2023-08-22

Applicant: SAMSUNG ELECTRONICS CO.,LTD.

Inventor： Hyun-Sik HWANG ,  Jinyoung BANG ,  Sungil CHO ,  Junghwan UM

IPC: H01J37/32 ,  H01L21/3065 ,  H01L21/311

CPC classification number: H01J37/32642 ,  H01J37/32449 ,  H01J37/32724 ,  H01L21/3065 ,  H01L21/31116 ,  H01L21/31144 ,  H01J2237/334

Abstract: A dry etching apparatus includes a process chamber; a support provided in the process chamber and configured to support a substrate; a gas supply configured to supply a process gas including a hydrogen gas (H2) and a fluorocarbon gas (CxFy) into the process chamber; a plasma source configured to generate plasma using the process gas in the process chamber, wherein the support includes: an electrostatic chuck on which the substrate is disposed; an edge ring provided along a circumference of the electrostatic chuck and supporting an edge region of the substrate; an adhesive gel pad provided between the electrostatic chuck and the edge ring; and a coating layer formed only on a surface of the edge ring, which is exposed to the plasma.

公开(公告)号：US20230131026A1

公开(公告)日：2023-04-27

申请号：US17970969

申请日：2022-10-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seongmin KIM ,  Byunggun JANG ,  Jinyoung BANG

IPC: H04M1/02

Abstract: A printed circuit board module and an electronic device including the same are provided. The electronic device includes a housing including at least part thereof formed to be a conductive portion, a support member, a printed circuit board configured to be disposed on at least one surface of the support member and configured to dispose at least one electronic component thereon, and a connecting member for electrical coupling between the conductive portion of the housing and the electronic component, including a base plate and a connecting terminal. The connecting terminal includes a first portion fixed to the base plate, and a second portion coupled to the first portion and including a through hole formed thereon to be fastened to a fixing member, and the second portion may include a wing portion protruding to one direction.

公开(公告)号：US20230011480A1

公开(公告)日：2023-01-12

申请号：US17833184

申请日：2022-06-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seungbo SHIM ,  Junghoon PARK ,  Jinyoung BANG

IPC: H05K1/02 ,  H05K1/14 ,  H05K1/11

Abstract: An electronic device includes: a first printed circuit board (PCB) including a first plate and a first hole formed in the first plate, a second PCB including a second plate, an interposer including a third plate positioned between the first plate and the second plate, a plurality of first vias connecting the first plate and the third plate, a plurality of second vias connecting the second plate and the third plate, and a first reinforcement portion positioned in the first hole to bond the first plate and the third plate.