公开(公告)号：US11518909B2

公开(公告)日：2022-12-06

申请号：US16645343

申请日：2018-02-13

申请人： Samsung SDI Co., Ltd.

发明人： Kunbae Noh ,  Taeksoo Kwak ,  Junyoung Jang ,  Yoonyoung Koo ,  Yonggoog Kim ,  Jingyo Kim ,  Jin-Hee Bae ,  Jun Sakong ,  Jinwoo Seo ,  Sooyeon Sim ,  Huichan Yun ,  Jiho Lee ,  Kwen-Woo Han ,  Byeong Gyu Hwang

IPC分类号： C09D183/16 ,  H01L21/02 ,  H01L21/306

摘要： Provided is a composition for forming a silica layer, the composition containing a silicon-containing polymer and a solvent, wherein a silica layer formed of the composition for forming the silica layer satisfies Relation 1. The definition of Relation 1 is as described in the specification. The definition of Relation 1 is the same as described in the specification.

公开(公告)号：US11201052B2

公开(公告)日：2021-12-14

申请号：US16874820

申请日：2020-05-15

申请人： Samsung SDI Co., Ltd.

发明人： Seungwoo Jang ,  Taeksoo Kwak ,  Jin-Hee Bae ,  Hyeonsu Jo ,  Euihyun Kim ,  Kunbae Noh ,  Jun Sakong ,  Chungheon Lee ,  Wanhee Lim ,  Byeonggyu Hwang

IPC分类号： H01L21/02 ,  C01B21/087 ,  C01B33/12 ,  H01L27/108

摘要： Disclosed is a composition for forming a silica layer including perhydropolysilazane (PHPS) and a solvent, wherein in an 1H-NMR spectrum of the perhydropolysilazane (PHPS) in CDCl3, when a peak derived from N3SiH1 and N2SiH2 is referred to as Peak 1 and a peak derived from NSiH3 is referred to as Peak 2, a ratio (P1/(P1+P2)) of an area (P1) of Peak 1 relative to a total area (P1+P2) of the Peak 1 and Peak 2 is greater than or equal to 0.77, and when an area from a minimum point between the peaks of Peak 1 and Peak 2 to 4.78 ppm is referred to as a Region B and an area from 4.78 ppm to a minimum point of Peak 1 is referred to as a Region A of the area of Peak 1, a ratio (PA/PB) of an area (PA) of Region A relative to an area (PB) of Region B is greater than or equal to about 1.5.

公开(公告)号：US10804095B2

公开(公告)日：2020-10-13

申请号：US16163170

申请日：2018-10-17

申请人： Samsung SDI Co., Ltd.

发明人： Jin-Hee Bae ,  Taeksoo Kwak ,  Byeonggyu Hwang ,  Kunbae Noh ,  Jun Sakong ,  Jinwoo Seo ,  Junyoung Jang

IPC分类号： H01L21/02 ,  C01B21/068 ,  C09D183/16 ,  C08G77/62

摘要： A composition for forming a silica layer includes a silicon-containing polymer and a solvent, the composition having a SiO2 conversion rate of greater than about 0 and less than or equal to about 15. The SiO2 conversion rate is represented by: SiO2 conversion rate=(a ratio of an area of Si—O to an area of Si—H measured after coating the composition in a thickness of 6700 Å on a bare wafer, and allowing the coated wafer to stand for 24 hours under conditions of a temperature of 85° C. and a relative humidity of 85%)−(a ratio of an area of Si—O to an area of Si—H measured after coating the composition in a thickness of 6700 Å on a bare wafer, and allowing the coated wafer to stand for 2 hours under conditions of a temperature of 85° C. and a relative humidity of 85%).

公开(公告)号：US10020185B2

公开(公告)日：2018-07-10

申请号：US14720674

申请日：2015-05-22

申请人： SAMSUNG SDI CO., LTD.

发明人： Hui-Chan Yun ,  Woo-Han Kim ,  Sang-Ran Koh ,  Taek-Soo Kwak ,  Bo-Sun Kim ,  Jin-Gyo Kim ,  Yoong-Hee Na ,  Kun-Bae Noh ,  Sae-Mi Park ,  Jin-Hee Bae ,  Jun Sakong ,  Eun-Seon Lee ,  Wan-Hee Lim ,  Jun-Young Jang ,  Il Jung ,  Byeong-Gyu Hwang

IPC分类号： H01L21/469 ,  H01L21/02 ,  C01B33/12 ,  C09D1/00 ,  H01L29/06

CPC分类号： H01L21/02222 ,  C01B33/12 ,  C09D1/00 ,  H01L21/02126 ,  H01L21/02164 ,  H01L21/02216 ,  H01L21/02282 ,  H01L29/0649

摘要： A composition for forming a silica layer including a silicon-containing polymer having a weight average molecular weight of about 20,000 to about 70,000 and a polydispersity index of about 5.0 to about 17.0 and a solvent; a silica layer manufactured using the same; and an electronic device including the silica layer.

公开(公告)号：US20160099145A1

公开(公告)日：2016-04-07

申请号：US14720674

申请日：2015-05-22

申请人： SAMSUNG SDI CO., LTD.

发明人： Hui-Chan Yun ,  Woo-Han Kim ,  Sang-Ran Koh ,  Taek-Soo Kwak ,  Bo-Sun Kim ,  Jin-Gyo Kim ,  Yoong-Hee Na ,  Kun-Bae Noh ,  Sae-Mi Park ,  Jin-Hee Bae ,  Jun Sakong ,  Eun-Seon Lee ,  Wan-Hee Lim ,  Jun-Young Jang ,  Il Jung ,  Byeong-Gyu Hwang

IPC分类号： H01L21/02 ,  C01B33/12 ,  C09D1/00 ,  H01L29/06

CPC分类号： H01L21/02222 ,  C01B33/12 ,  C09D1/00 ,  H01L21/02126 ,  H01L21/02164 ,  H01L21/02216 ,  H01L21/02282 ,  H01L29/0649

摘要： A composition for forming a silica layer including a silicon-containing polymer having a weight average molecular weight of about 20,000 to about 70,000 and a polydispersity index of about 5.0 to about 17.0 and a solvent; a silica layer manufactured using the same; and an electronic device including the silica layer.

摘要翻译： 一种用于形成二氧化硅层的组合物，其包含重均分子量为约20,000至约70,000且多分散指数为约5.0至约17.0的含硅聚合物和溶剂; 使用其制造的二氧化硅层; 以及包括二氧化硅层的电子器件。