STRUCTURED WAFER AND OPTOELECTRONIC COMPONENT PRODUCED THEREWITH

    公开(公告)号:US20250070528A1

    公开(公告)日:2025-02-27

    申请号:US18726213

    申请日:2022-12-09

    Applicant: Schott AG

    Abstract: The invention relates to an encapsulated optoelectronic component having a housing and at least one optoelectronic component, which is arranged in a cavity which is formed by a main element and is covered on an upper side by a cover element, and therefore the optoelectronic component is arranged between the cover element and the main elements and the main element forms side walls which laterally enclose the cavity. A one-part plate element with at least one tongue-shaped deflecting element is arranged between the cover element and the main element in such a way that, in the cavity, the deflecting element is arranged with at least one optical surface by which electromagnetic radiation emitted or received by the optoelectronic component can be deflected. The invention also relates to at least one wafer with deflecting elements, to a composite assembly of encapsulated optoelectronic components and to a method for the production thereof.

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