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公开(公告)号：US20160225978A1
公开(公告)日：2016-08-04
申请号：US15006388
申请日：2016-01-26
发明人： Takahiro Kan , Kenichi Otsuki , Takumi Suzuki , Masayuki Ishikawa , Shigeru Shiraishi , Go Yamashita
IPC分类号： H01L41/253
CPC分类号： H03H3/04 , H03H9/0519 , H03H9/0547
摘要： A method of manufacturing a vibration device includes a process of strongly exciting a vibrator element by applying power, which is higher than drive power during use of the vibrator element, to the vibrator element, and a process of adjusting a frequency of the vibrator element after the process of strongly exciting the vibrator element.
摘要翻译： 一种制造振动装置的方法包括通过在振动元件使用期间施加比驱动力高的振动元件施加电力来强烈激发振动元件的过程，以及在振动器元件之后调整振动元件的频率的处理 激发振动元件的过程。
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公开(公告)号：US12113502B2
公开(公告)日：2024-10-08
申请号：US17229065
申请日：2021-04-13
发明人： Masaya Kanno , Shigeru Shiraishi , Atsushi Matsuo
CPC分类号： H03H3/013 , H03H3/02 , H03H2003/022 , H03H2003/023 , H03H2003/027 , H03H9/02102 , H03H9/0547 , H03H9/1021 , H03H9/19
摘要： A method of manufacturing a quartz crystal element includes preparing a quartz crystal wafer having a predetermined cutting angle with respect to a crystal axis of a quartz crystal, forming a first resist film having a first tilted part on a first surface of the quartz crystal wafer and dry-etching the first resist film with the quartz crystal, forming a first tilted surface by dry-etching the quartz crystal wafer from the first surface side, forming a second resist film having a second tilted part on a second surface of the quartz crystal wafer and dry-etching the second resist film with the quartz crystal, and forming a second tilted surface tilted by dry-etching the quartz crystal wafer from the second surface side. The quartz crystal element provided with the first tilted surface and the second tilted surface, and having a cutting angle different from the predetermined cutting angle is formed.
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公开(公告)号：US20240113691A1
公开(公告)日：2024-04-04
申请号：US18475685
申请日：2023-09-27
摘要： A method for manufacturing a vibrator includes a preparation step of preparing a quartz crystal substrate having a first surface and a second surface which are in a front and back relationship, a first protective film formation step of forming a first protective film in a second groove formation region when a region of the quartz crystal substrate where the vibrator is formed is referred to as an element formation region, a region where the first groove is formed is referred to as a first groove formation region, and a region where the second groove is formed is referred to as the second groove formation region, a second protective film formation step of forming, in the first groove formation region, a second protective film having a lower etching rate than the first protective film, a third protective film formation step of forming a third protective film in a region of the element formation region other than the first groove formation region and the second groove formation region, and a first dry etching step of dry etching the quartz crystal substrate from the first surface through the first protective film, the second protective film, and the third protective film.
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公开(公告)号：US20240113692A1
公开(公告)日：2024-04-04
申请号：US18475701
申请日：2023-09-27
CPC分类号： H03H9/215 , H03H3/02 , H03H2003/026
摘要： A method for manufacturing a vibrator includes a preparation step of preparing a quartz crystal substrate having a first surface and a second surface which are in a front and back relationship, a first protective film formation step of forming a first protective film in a region of an element formation region other than a first groove formation region and a second groove formation region when a region of the quartz crystal substrate where the vibrator is formed is referred to as the element formation region, a region where the first groove is formed is referred to as the first groove formation region, and a region where the second groove is formed is referred to as the second groove formation region, a first dry etching step of dry etching the quartz crystal substrate from the first surface through the first protective film, a second protective film formation step of forming a second protective film in the first groove formation region, and a second dry etching step of dry etching the quartz crystal substrate from the first surface through the first protective film and the second protective film.
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公开(公告)号：US20230020694A1
公开(公告)日：2023-01-19
申请号：US17865052
申请日：2022-07-14
IPC分类号： H01L41/332
摘要： A method for manufacturing a vibrator device includes a first dry etching step of dry-etching a quartz crystal substrate having a first surface and a second surface from the side facing the first surface to form first grooves and part of the outer shapes of a first vibrating arm and a second vibrating arm, a second dry etching step of dry-etching the quartz crystal substrate from the side facing the second surface to form second grooves and part of the outer shapes of the first vibrating arm and the second vibrating arm, and thereafter, a wet etching step of wet-etching the side surfaces of the first vibrating arm and the second vibrating arm.
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公开(公告)号：US20240113690A1
公开(公告)日：2024-04-04
申请号：US18475673
申请日：2023-09-27
CPC分类号： H03H9/215 , H03H3/02 , H03H2003/026
摘要： A method for manufacturing a vibrator includes a preparation step of preparing a quartz crystal substrate having a first surface and a second surface which are in a front and back relationship, a first film formation step of forming a first stacked body by sequentially stacking a first underlying film, a second underlying film, and a first protective film at the first surface, a first patterning step of patterning the first stacked body in a manner in which the first underlying film, the second underlying film, and the first protective film remain in a region of an element formation region other than a first groove formation region and a second groove formation region, the first underlying film and the second underlying film remain in the first groove formation region, and the first underlying film remains in the second groove formation region, and a first dry etching step of dry etching the quartz crystal substrate from the first surface through the first stacked body.
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公开(公告)号：US20210336601A1
公开(公告)日：2021-10-28
申请号：US17232510
申请日：2021-04-16
摘要： A method of manufacturing a vibrator element having a vibrating part which vibrates in a thickness-shear mode, and a thin-wall part which is coupled to the vibrating part, and which is thinner than the vibrating part includes a preparation step of preparing a quartz crystal substrate, a resist film formation step of forming a resist film in a vibrating part area of the quartz crystal substrate where the vibrating part is formed, an etching step of etching the quartz crystal substrate via the resist film, then ending the etching in a state in which the resist film remains in the vibrating part area to thereby form the vibrating part and the thin-wall part, and a resist film removal step of removing the resist film remaining.
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公开(公告)号：US20240110787A1
公开(公告)日：2024-04-04
申请号：US18475730
申请日：2023-09-27
IPC分类号： G01C19/5628 , H03H3/02 , H03H9/215 , H10N30/082
CPC分类号： G01C19/5628 , H03H3/02 , H03H9/215 , H10N30/082 , H03H2003/026
摘要： A method for manufacturing a vibrator includes a preparation step of preparing a quartz crystal substrate having a first surface and a second surface which are in a front and back relationship, a first protective film formation step of forming a first protective film in an element formation region of the quartz crystal substrate at the first surface where the vibrator is formed; and a first dry etching step of dry etching the quartz crystal substrate from the first surface through the first protective film. R1>R2, in which R1 is a thickness of the first protective film in a first groove formation region of the quartz crystal substrate where the first groove is formed and R2 is a thickness of the first protective film in the second groove formation region where the second groove is formed.
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公开(公告)号：US20240110786A1
公开(公告)日：2024-04-04
申请号：US18475712
申请日：2023-09-27
IPC分类号： G01C19/5628 , H03H3/02 , H03H9/215 , H10N30/082
CPC分类号： G01C19/5628 , H03H3/02 , H03H9/215 , H10N30/082 , H03H2003/026
摘要： A method for manufacturing a vibrator includes a preparation step of preparing a quartz crystal substrate having a first surface and a second surface that are in a front and back relationship, a first protective film formation step of forming a first protective film in an element formation region of the first surface, the first protective film having a first opening overlapping a first groove formation region and a second opening overlapping a second groove formation region, in which a region of the quartz crystal substrate where the vibrator is formed is referred to as the element formation region, a region where the first groove is formed is referred to as the first groove formation region, and a region where the second groove is formed is referred to as the second groove formation region, and a first dry etching step of dry etching the quartz crystal substrate from the first surface through the first protective film. Wa
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公开(公告)号：US20210328566A1
公开(公告)日：2021-10-21
申请号：US17229065
申请日：2021-04-13
发明人： Masaya Kanno , Shigeru Shiraishi , Atsushi Matsuo
IPC分类号： H03H3/013
摘要： A method of manufacturing a quartz crystal element includes the steps of preparing a quartz crystal wafer which has a predetermined cutting angle with respect to a crystal axis of a quartz crystal, and which has a first surface and a second surface having an obverse-reverse relationship, forming a first resist film on the first surface, the first resist film having a first tilted part tilted with respect to the first surface, and being dry-etched together with the quartz crystal, forming a first tilted surface tilted with respect to the first surface by dry-etching the quartz crystal wafer from the first surface side, forming a second resist film on the second surface, the second resist film having a second tilted part tilted with respect to the second surface, and being dry-etched together with the quartz crystal, and forming a second tilted surface tilted with respect to the second surface by dry-etching the quartz crystal wafer from the second surface side, wherein the quartz crystal element which is provided with the first tilted surface and the second tilted surface, and which has a cutting angle different from the predetermined cutting angle is formed.
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