公开(公告)号：US20240014059A1

公开(公告)日：2024-01-11

申请号：US18124329

申请日：2023-03-21

Applicant: SEMES CO., LTD.

Inventor： Chan Young CHOI ,  Sang Oh KIM ,  Wan Hee JEONG ,  Hee Jae BYUN

IPC: H01L21/677 ,  H01L21/687 ,  B25J19/00 ,  B25J11/00 ,  B25J5/02 ,  H02J50/12

CPC classification number: H01L21/67733 ,  H01L21/68707 ,  B25J19/0045 ,  B25J11/0095 ,  B25J5/02 ,  H02J50/12

Abstract: Proposed is a power supply apparatus capable of suppressing heat generation, and semiconductor manufacturing equipment and a transport system including the same. The power supply apparatus, which supplies power to a transport device in semiconductor manufacturing equipment, includes a first base member made of a conductive material installed along a moving path of the transport device, a second base member provided on a surface of the first base member and made of a magnetic core material, a track member provided as an installation structure disposed on a side of the second base member, a power supply member installed in the track member and to which current is applied to supply power, and a power reception member disposed in a power reception core member provided in the transport device at a predetermined interval from the power supply member, and magnetically coupled to the power supply member to generate an induced current.

公开(公告)号：US20240112938A1

公开(公告)日：2024-04-04

申请号：US18134489

申请日：2023-04-13

Applicant: SEMES CO., LTD.

Inventor： Hee Jae BYUN ,  Kyo Bong KIM ,  Chan Young CHOI ,  Wan Hee JEONG ,  Sang Oh KIM

IPC: H01L21/68 ,  B25J11/00 ,  B25J13/08 ,  H01L21/67 ,  H01L21/687

CPC classification number: H01L21/681 ,  B25J11/0095 ,  B25J13/08 ,  H01L21/67259 ,  H01L21/68707

Abstract: A method and apparatus for aligning a wafer using a laser scanner, and a semiconductor transfer device are provided. The method includes a laser irradiation operation of irradiating a laser toward the wafer using a laser scanner disposed on a rear side or a lower side of the wafer and obtaining an image, a dataset acquisition operation of obtaining location information of at least three wafer edges by using a distance corresponding to a laser irradiation direction to a wafer edge in the image, a calculation operation of calculating a center point of the wafer by using the obtained location information of the wafer edge, and a detection operation of detecting whether a calculated center point is within a preset tolerance range.