公开(公告)号：US20230288811A1

公开(公告)日：2023-09-14

申请号：US18310704

申请日：2023-05-02

Applicant: SEMES CO, LTD.

Inventor： Moon Hyung BAE ,  Hye Bin BAEK ,  Youngseo AN ,  Euntark LEE ,  Min Jung PARK ,  Seunghan LEE ,  Jung-Hyun LEE

IPC: G03F7/16 ,  H01L21/687 ,  H01L21/67

CPC classification number: G03F7/167 ,  H01L21/68742 ,  H01L21/67017 ,  H01L21/67103

Abstract: The inventive concept provides an apparatus and method for treating a substrate with a gas. The apparatus includes a chamber having a process space in which the substrate is treated, a substrate support unit that supports the substrate in the process space, a gas supply unit that supplies a hydrophobic gas onto the substrate supported on the substrate support unit, and a controller that controls the substrate support unit and the gas supply unit. The substrate support unit includes a support plate on which the substrate is placed and a pin assembly that raises the substrate off the support plate or lowers the substrate onto the support plate, and the controller controls a degree of hydrophobization of a surface of the substrate by adjusting the pin assembly.

公开(公告)号：US20210132499A1

公开(公告)日：2021-05-06

申请号：US17084903

申请日：2020-10-30

Applicant: SEMES CO., LTD.

Inventor： Moon Hyung BAE ,  Hye Bin BAEK ,  Youngseo AN ,  Euntark LEE ,  Min Jung PARK ,  Seunghan LEE ,  Jung-Hyun LEE

IPC: G03F7/16 ,  H01L21/687

Abstract: The inventive concept provides an apparatus and method for treating a substrate with a gas. The apparatus includes a chamber having a process space in which the substrate is treated, a substrate support unit that supports the substrate in the process space, a gas supply unit that supplies a hydrophobic gas onto the substrate supported on the substrate support unit, and a controller that controls the substrate support unit and the gas supply unit. The substrate support unit includes a support plate on which the substrate is placed and a pin assembly that raises the substrate off the support plate or lowers the substrate onto the support plate, and the controller controls a degree of hydrophobization of a surface of the substrate by adjusting the pin assembly.

公开(公告)号：US20210134620A1

公开(公告)日：2021-05-06

申请号：US17088143

申请日：2020-11-03

Applicant: SEMES CO., LTD.

Inventor： Seunghan LEE ,  Jong Seok SEO ,  Euntark LEE ,  Jaeoh BANG ,  Sukhwan CHI

IPC: H01L21/67 ,  H05B1/02 ,  F27B17/00 ,  F27D5/00 ,  H05B3/22 ,  G03F7/16

Abstract: Embodiments of the inventive concept provides an apparatus for treating a substrate. An embodiment of the inventive concept comprises a housing having a process space therein; and a supporting unit supporting a substrate in the process space, and the supporting unit comprises a supporting plate supporting the substrate; a heater member provide in the supporting plate and heating the substrate; and a cooling unit provided below the heater member and cooling the supporting plate, the cooling unit comprises a cooling plate spaced apart from the heater member; and a nozzle provided in the cooling plate, and supplying a cooling gas to a bottom surface of the heater member; and a driver moving the cooling plate between a standby position spaced a first distance apart from the heater member and a cooling position spaced a second distance apart from the heater member, the second distance is shorter than the first distance.