公开(公告)号：US20210129175A1

公开(公告)日：2021-05-06

申请号：US17085691

申请日：2020-10-30

Applicant: SEMES CO., LTD.

Inventor： Jaeoh BANG ,  Kyungjin SEO ,  Youngseo AN

IPC: B05C13/00 ,  B05C5/02

Abstract: An apparatus for treating a substrate includes a housing having a treatment space inside, a gas supply unit that supplies a hydrophobic gas into the treatment space to hydrophobicize the substrate, and a support unit that supports the substrate in the treatment space. The support unit includes a support plate, a heating member that heats the substrate placed on the support plate, and a height adjustment member that changes a position of the substrate between a first position spaced apart upward from an upper surface of the support plate by a first distance and a second position spaced apart upward from the upper surface of the support plate by a second distance, and the second position is a higher position than the first position.

公开(公告)号：US20240194517A1

公开(公告)日：2024-06-13

申请号：US18515638

申请日：2023-11-21

Applicant: SEMES CO., LTD.

Inventor： Jaeoh BANG ,  Jumi LEE ,  Minyoung KIM ,  Jong Gun LEE

IPC: H01L21/687 ,  G03F7/40 ,  H01L21/67 ,  H01L21/683

CPC classification number: H01L21/6875 ,  G03F7/40 ,  H01L21/67109 ,  H01L21/6838 ,  H01L21/68742

Abstract: Disclosed is a substrate processing apparatus that allows a substrate to be supported on an ultra-thin heating plate so as to be spaced from the ultra-thin heating plate in a proximity manner. The substrate processing apparatus includes a heating plate for heating a substrate; and a through proximity pin installed in the heating plate so as to pass through a through-hole formed in the heating plate such that the substrate is spaced from the heating plate by a spacing via the through proximity pin.

公开(公告)号：US20210020471A1

公开(公告)日：2021-01-21

申请号：US16931175

申请日：2020-07-16

Applicant: SEMES CO., LTD.

Inventor： Jaeoh BANG

IPC: H01L21/67 ,  H05K7/20

Abstract: A cooling unit for cooling a substrate includes a plate having a fluid channel formed therein and a fluid supply member that supplies a fluid into the fluid channel. The fluid channel includes a plurality of first fluid channels, each of which is connected with the fluid supply member at one end thereof and a second fluid channel that is connected with opposite ends of the plurality of first fluid channels and that discharges the fluid. A buffer space that connects the opposite ends of the plurality of first fluid channels and one end of the second fluid channel is formed inside the plate.

公开(公告)号：US20220206393A1

公开(公告)日：2022-06-30

申请号：US17547309

申请日：2021-12-10

Applicant: SEMES CO., LTD.

Inventor： Jaeoh BANG ,  Jong Gun LEE ,  Tae Hoon LEE

IPC: G03F7/16

Abstract: Disclosed is a method for manufacturing a cooling plate for cooling a substrate, including an operation of manufacturing a coolant pipe by using a tubular pipe, an operation of inserting the coolant pipe into a casting mold that defines a plate, and an operation of casting the cooling plate by injecting a molten metal into the casting mold.

公开(公告)号：US20210134620A1

公开(公告)日：2021-05-06

申请号：US17088143

申请日：2020-11-03

Applicant: SEMES CO., LTD.

Inventor： Seunghan LEE ,  Jong Seok SEO ,  Euntark LEE ,  Jaeoh BANG ,  Sukhwan CHI

IPC: H01L21/67 ,  H05B1/02 ,  F27B17/00 ,  F27D5/00 ,  H05B3/22 ,  G03F7/16

Abstract: Embodiments of the inventive concept provides an apparatus for treating a substrate. An embodiment of the inventive concept comprises a housing having a process space therein; and a supporting unit supporting a substrate in the process space, and the supporting unit comprises a supporting plate supporting the substrate; a heater member provide in the supporting plate and heating the substrate; and a cooling unit provided below the heater member and cooling the supporting plate, the cooling unit comprises a cooling plate spaced apart from the heater member; and a nozzle provided in the cooling plate, and supplying a cooling gas to a bottom surface of the heater member; and a driver moving the cooling plate between a standby position spaced a first distance apart from the heater member and a cooling position spaced a second distance apart from the heater member, the second distance is shorter than the first distance.