公开(公告)号：US20230197411A1

公开(公告)日：2023-06-22

申请号：US18080700

申请日：2022-12-13

Applicant: SEMES CO., LTD.

Inventor： Hyun Jin KIM ,  Jung Hwan LEE ,  Galstyan OGSEN ,  Sung Suk WI ,  Min Keun BAE

IPC: H01J37/32 ,  H03H7/38

CPC classification number: H01J37/32183 ,  H01J37/32091 ,  H03H7/38 ,  H01J2237/24564 ,  H01J2237/24585 ,  H01J2237/3343

Abstract: An impedance matching circuit, which is provided for quick impedance matching, a power supply apparatus, and a plasma processing equipment including the same are provided. The impedance matching circuit includes a parallel capacitor array connected to a radio frequency (RF) power supply to generate a RF signal, and a series capacitor array connected to the RF power supply in series, wherein the parallel capacitor array or the series capacitor array includes a mechanical vacuum variable capacitor and an electrical switch capacitor module connected to the mechanical vacuum variable capacitor in parallel.

公开(公告)号：US20230197409A1

公开(公告)日：2023-06-22

申请号：US18083555

申请日：2022-12-18

Applicant: SEMES CO., LTD.

Inventor： Hyun Jin KIM ,  GALSTYAN OGSEN ,  Jung Hwan LEE ,  Dong Jun PARK ,  Sang Hyeok AHN

IPC: H01J37/32

CPC classification number: H01J37/3211 ,  H01J37/32183 ,  H01J2237/334

Abstract: An antenna assembly, which is capable of controlling widely an etching rate in a plasma treatment process, and a plasma processing equipment including the same are provided. The antenna assembly provided to generate plasma includes a feeding line to which a radio frequency (RF) signal may be applied, and a coil member including a plurality of unit coils coupled to the feeding line and spaced apart from each other in a vertical direction at a predetermined gap.