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公开(公告)号:US12061097B2
公开(公告)日:2024-08-13
申请号:US17560390
申请日:2021-12-23
Applicant: SEMES CO., LTD.
Inventor: Young Seop Choi , Yong-Jun Seo , Sang Hyun Son , Sang Min Lee , Jong Hyeon Woo , Hwan Bin Kim
Abstract: A substrate type sensor provided in an atmosphere accompanied by a temperature change to measure a horizontality of a support member that supports a substrate is disclosed. The substrate type sensor may include a base having a shape of the substrate, one or more sensors provided in the base and including 3 or more axis acceleration sensors or 6 or more axis measurement units (IMUs), a receiver configured to receive data collected by the one or more sensors and a power source configured to provide electric power to the one or more sensors and the receiver.
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公开(公告)号:US11703520B2
公开(公告)日:2023-07-18
申请号:US17482845
申请日:2021-09-23
Applicant: SEMES CO., LTD.
Inventor: Yong-Jun Seo , Sang Hyun Son , Ji Su Hong , Jae Myoung Lee , Dong Ok Ahn
CPC classification number: G01P5/12 , G01P13/006 , G01P13/02 , G01P13/045
Abstract: The inventive concept provides a wafer type sensor unit which acquires data on a wind direction and a wind velocity of an air flow during processing, the wafer type sensor unit supported by a supporting unit of a substrate processing apparatus. The unit comprising a wafer-shaped circuit board and a hot-wired wind velocity sensor placed apart from an upper surface of the circuit board.
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公开(公告)号:US12224189B2
公开(公告)日:2025-02-11
申请号:US17564562
申请日:2021-12-29
Applicant: SEMES CO., LTD.
Inventor: Young Seop Choi , Yong-Jun Seo , Sang Hyun Son , Jun Gwon Lee , Hak Hyon Kim , Sun Yong Park
Abstract: A substrate type sensor includes a substrate shape member, a pressure sensor panel provided at the substrate shape member, the pressure sensor panel including a plurality of pressure sensors, a central module including a transmission unit, the reception unit receiving data from the pressure sensor panel, and a battery proving power to the pressure sensor panel and the central module.
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公开(公告)号:US11923219B2
公开(公告)日:2024-03-05
申请号:US16912762
申请日:2020-06-26
Applicant: SEMES CO., LTD.
Inventor: Youngseop Choi , Young Hun Lee , Yong-Jun Seo , Bok Kyu Lee , Miso Park
CPC classification number: H01L21/67248 , B08B3/08 , B08B7/04 , B08B13/00 , H01L21/67051 , H01L21/67103 , H01L21/6719
Abstract: The inventive concept relates to an apparatus for treating a substrate. In an embodiment, the apparatus includes a process chamber having a process space in which the substrate is treated with a fluid in a supercritical state, a support unit that supports the substrate in the process space, a fluid supply unit that supplies the fluid into the process space, a filler member disposed to face the substrate placed on the support unit in the process space, and a measurement unit that measures a state in the process space, the measurement unit being provided in the filler member.
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公开(公告)号:US12046466B2
公开(公告)日:2024-07-23
申请号:US17965911
申请日:2022-10-14
Applicant: SEMES CO., LTD.
Inventor: Yong-Jun Seo , Hyun Yoon , Jungsuk Goh , Byeong Geun Kim , Yoonki Sa , Doyeon Kim , Yerim Yeon , Choonghyun Lee , Pil Kyun Heo , Youngje Um , Jaeseong Lee , Dongok Ahn
CPC classification number: H01L21/02101 , H01L21/6715
Abstract: The inventive concept provides a method for treating a substrate. In an embodiment, the substrate treating method includes a treatment step of treating a residue on the substrate with a first fluid in a supercritical state and a second fluid in a supercritical state in a process space of a chamber, and the first fluid in the supercritical state and the second fluid in the supercritical state have different densities.
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公开(公告)号:US11933808B2
公开(公告)日:2024-03-19
申请号:US17564676
申请日:2021-12-29
Applicant: SEMES CO., LTD.
Inventor: Young Seop Choi , Yong-Jun Seo , Sang Hyun Son , Ji Young Lee , Gyeong Ryul Kim , Sun Yong Park
Abstract: A buffer unit for temporarily storing a substrate includes a housing having a space for storing a substrate therein, one or more slots disposed within the housing for placing a substrate thereon, and a holding unit disposed at a bottom portion of the housing, having a flat and non-inclined top surface, and comprising a built-in wireless charging module. A substrate type sensor is stored at the holding unit.
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