公开(公告)号：US20230298915A1

公开(公告)日：2023-09-21

申请号：US18202396

申请日：2023-05-26

Applicant: SEMES CO., LTD.

Inventor： Sun Mi KIM ,  Jisu HONG ,  Moonsik CHOI ,  Oh Jin KWON

IPC: H01L21/67 ,  H01L21/027

CPC classification number: H01L21/6715 ,  H01L21/0273 ,  H01L21/67051

Abstract: The inventive concept provides an apparatus and method for removing a film formed on a substrate. A method for treating the substrate includes a primary solvent dispensing step of dispensing an organic solvent onto the substrate to remove a photoresist film on the substrate and an ozone dispensing step of dispensing a liquid containing ozone onto the substrate to remove organic residue on the substrate, after the primary solvent dispensing step.

公开(公告)号：US20200185236A1

公开(公告)日：2020-06-11

申请号：US16705065

申请日：2019-12-05

Applicant: SEMES CO., LTD.

Inventor： Sun Mi KIM ,  Jisu HONG ,  Moonsik CHOI ,  Oh Jin KWON

IPC: H01L21/67 ,  H01L21/027

Abstract: The inventive concept provides an apparatus and method for removing a film formed on a substrate. A method for treating the substrate includes a primary solvent dispensing step of dispensing an organic solvent onto the substrate to remove a photoresist film on the substrate and an ozone dispensing step of dispensing a liquid containing ozone onto the substrate to remove organic residue on the substrate, after the primary solvent dispensing step.