公开(公告)号：US20210335596A1

公开(公告)日：2021-10-28

申请号：US17239091

申请日：2021-04-23

Applicant: SEMES CO., LTD.

Inventor： Yong Hoon HONG ,  Sul LEE ,  Myung A JEON ,  Moonsik CHOI ,  Young Su KIM

IPC: H01L21/02 ,  H01L21/263

Abstract: The inventive concept provides a substrate treating apparatus. In an embodiment, the substrate treating apparatus includes a housing having a treatment space for treating a substrate in an interior thereof, a support unit that supports the substrate in the treatment space, a nozzle that supplies a liquid to the substrate positioned on the support unit, a liquid supply unit that supplies the liquid to the nozzle, and a controller that controls the liquid unit, the liquid supply unit includes a tank having an interior space for storing the liquid, and a first circulation line that circulates the liquid stored in the interior space and in which a first heater is installed, and the controller controls the first heater such that the first heater heats the liquid to a first temperature, at which particles in the interior of the liquid are not eluted.

公开(公告)号：US20230298915A1

公开(公告)日：2023-09-21

申请号：US18202396

申请日：2023-05-26

Applicant: SEMES CO., LTD.

Inventor： Sun Mi KIM ,  Jisu HONG ,  Moonsik CHOI ,  Oh Jin KWON

IPC: H01L21/67 ,  H01L21/027

CPC classification number: H01L21/6715 ,  H01L21/0273 ,  H01L21/67051

Abstract: The inventive concept provides an apparatus and method for removing a film formed on a substrate. A method for treating the substrate includes a primary solvent dispensing step of dispensing an organic solvent onto the substrate to remove a photoresist film on the substrate and an ozone dispensing step of dispensing a liquid containing ozone onto the substrate to remove organic residue on the substrate, after the primary solvent dispensing step.

公开(公告)号：US20200185236A1

公开(公告)日：2020-06-11

申请号：US16705065

申请日：2019-12-05

Applicant: SEMES CO., LTD.

Inventor： Sun Mi KIM ,  Jisu HONG ,  Moonsik CHOI ,  Oh Jin KWON

IPC: H01L21/67 ,  H01L21/027

Abstract: The inventive concept provides an apparatus and method for removing a film formed on a substrate. A method for treating the substrate includes a primary solvent dispensing step of dispensing an organic solvent onto the substrate to remove a photoresist film on the substrate and an ozone dispensing step of dispensing a liquid containing ozone onto the substrate to remove organic residue on the substrate, after the primary solvent dispensing step.